EP3C25F324I7 vs EP3C25F324C7 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324I7 disebabkan oleh Intel dan EP3C25F324C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3C25F324I7 EP3C25F324C7
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Series Cyclone III —
Logic Elements (LEs) 24,624 —
Logic Array Blocks (LABs) 1,539 —
Embedded Memory 608,256 bits (594 Kbits M9K blocks) —
Embedded 18x18 Multipliers 66 —
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/O 215 —
Process Technology TSMC 65 nm low-power CMOS —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 1.2 V to 3.3 V (per bank) —
Suhu Hubungan Operasi -40 °C to +100 °C (industrial) —
Kemasan 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch —
Jenis Pemasangan Surface Mount Surface Mount
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG —
Status RoHS Compliant —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Package Code — BGA
Number of Terminals — 324
Package Shape — Square
Terminal Form — Ball
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Gambaran Suhu Operasi — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

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