EP3CLS200F484C8N vs EP3CLS200F484C8 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484C8N sa pamamagitan ng Intel at EP3CLS200F484C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3CLS200F484C8N EP3CLS200F484C8
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Cyclone III LS Cyclone III LS
Family Cyclone® III LS Cyclone III LS (low-power Cyclone III)
Logic Elements 198,464 —
Embedded Memory 8,211,456 bits (8.21 Mbit) 8,211,456 bits (approx 8 Mbit)
Logic Array Blocks (LABs) [DATA_NEEDED: exact LAB count] —
Embedded Multipliers (18x18) 396 —
User I/O Pins 210 —
Number of PLLs 4 —
Global Clock Networks 20 —
Core Voltage 1.2 V 1.2 V
Process Technology 65 nm CMOS, low-leakage 65 nm low-power CMOS
Maximum Operating Frequency 402 MHz (fabric) —
Packhaging 484-ball FBGA (FineLine BGA), 23 x 23 mm 484-pin FBGA (FineLine BGA)
Speed Grade 8 (slowest) —
Temperature Grade Commercial (0C to +85C TJ) —
Bitstream Encryption AES-128 (256-bit key via separate license) —
Configuration Mode Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG —
Tindminan RoHS Compliant Compliant
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Logic Elements (LE) — 198,464
Logic Array Blocks (LAB) — 20,5056 (approx)
Embedded 18x18 Multipliers — 210
PLLs — 4
Maximum User I/O — 304
I/O Banks — 8
Package Dimensions — 23 mm x 23 mm, 1.0 mm ball pitch
Configuration Modes — AS, PS, FPP, JTAG
Security — Design encryption / bitstream AES
Temperature na Operasyon — 0C to +85C (commercial, 'C' suffix)

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