EP3CLS200F484C8N vs EP3CLS200F484C8 तुलना
विस्तृत दोनों ओर की तुलना EP3CLS200F484C8N द्वारा Intel और EP3CLS200F484C8 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3CLS200F484C8N | EP3CLS200F484C8 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone® III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements | 198,464 | — |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) | 8,211,456 bits (approx 8 Mbit) |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count] | — |
| Embedded Multipliers (18x18) | 396 | — |
| User I/O Pins | 210 | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm CMOS, low-leakage | 65 nm low-power CMOS |
| Maximum Operating Frequency | 402 MHz (fabric) | — |
| पैकेज | 484-ball FBGA (FineLine BGA), 23 x 23 mm | 484-pin FBGA (FineLine BGA) |
| Speed Grade | 8 (slowest) | — |
| Temperature Grade | Commercial (0C to +85C TJ) | — |
| Bitstream Encryption | AES-128 (256-bit key via separate license) | — |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG | — |
| RoHS स्थिति | Compliant | Compliant |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded 18x18 Multipliers | — | 210 |
| PLLs | — | 4 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |
| ऑपरेटिंग तापमान | — | 0C to +85C (commercial, 'C' suffix) |