EP3CLS200F484C8N vs EP3CLS200F484C8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS200F484C8N disebabkan oleh Intel dan EP3CLS200F484C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS200F484C8N | EP3CLS200F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone® III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements | 198,464 | — |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) | 8,211,456 bits (approx 8 Mbit) |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count] | — |
| Embedded Multipliers (18x18) | 396 | — |
| User I/O Pins | 210 | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm CMOS, low-leakage | 65 nm low-power CMOS |
| Maximum Operating Frequency | 402 MHz (fabric) | — |
| Kemasan | 484-ball FBGA (FineLine BGA), 23 x 23 mm | 484-pin FBGA (FineLine BGA) |
| Speed Grade | 8 (slowest) | — |
| Temperature Grade | Commercial (0C to +85C TJ) | — |
| Bitstream Encryption | AES-128 (256-bit key via separate license) | — |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded 18x18 Multipliers | — | 210 |
| PLLs | — | 4 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |
| Suhu Operasi | — | 0C to +85C (commercial, 'C' suffix) |