EP3CLS200F484C8N vs EP3CLS200F484C8 Perbandingan
Perbandingan bersamaan detil EP3CLS200F484C8N dari Intel dan EP3CLS200F484C8 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3CLS200F484C8N | EP3CLS200F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone® III LS | Cyclone III LS (low-power Cyclone III) |
| Logic Elements | 198,464 | — |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) | 8,211,456 bits (approx 8 Mbit) |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count] | — |
| Embedded Multipliers (18x18) | 396 | — |
| User I/O Pins | 210 | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm CMOS, low-leakage | 65 nm low-power CMOS |
| Maximum Operating Frequency | 402 MHz (fabric) | — |
| Paket | 484-ball FBGA (FineLine BGA), 23 x 23 mm | 484-pin FBGA (FineLine BGA) |
| Speed Grade | 8 (slowest) | — |
| Temperature Grade | Commercial (0C to +85C TJ) | — |
| Bitstream Encryption | AES-128 (256-bit key via separate license) | — |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG | — |
| Status RoHS | Compliant | Compliant |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 20,5056 (approx) |
| Embedded 18x18 Multipliers | — | 210 |
| PLLs | — | 4 |
| Maximum User I/O | — | 304 |
| I/O Banks | — | 8 |
| Package Dimensions | — | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Security | — | Design encryption / bitstream AES |
| Suhu Kerja | — | 0C to +85C (commercial, 'C' suffix) |