EP3SE260F1152C3 vs EP3SE260F1152C4N Comparison

Detailed side-by-side comparison of EP3SE260F1152C3 by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260F1152C3 EP3SE260F1152C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $12,500.00 $1,620.00
Series Stratix III E Stratix III E
Logic Elements 255,000 β€”
Embedded Memory (bits) 16,672,768 β€”
Logic Array Blocks (LABs) 10,200 β€”
User I/Os 744 β€”
Embedded 18x18 Multipliers 384 β€”
Package 1152-ball FCBGA (Flip-Chip BGA) 1152-ball FC-FBGA (flip-chip)
Mounting Type Surface Mount Surface Mount (BGA)
Core Voltage 0.9 V to 1.1 V 1.1 V
Process Technology 40 nm 65 nm CMOS
Operating Temperature 0C to +85C (Commercial) 0C to +85C (commercial, 'C' suffix)
Configuration Method Passive Serial / Fast Passive Parallel / JTAG β€”
PLLs 12 β€”
RoHS Status Compliant β€”
Speed Grade C3 -4 (commercial temperature)
Family β€” Stratix III (Enhanced)
Logic Elements (LEs) β€” 255,000
Embedded Memory β€” 16,672,768 bits (16.67 Mbit)
Maximum User I/Os β€” 744
Number of LABs/CLBs β€” 10,200
DSP / 18x18 Multipliers β€” 768 embedded multipliers
Maximum Operating Frequency β€” 450 MHz
Packaging β€” Tray
Lead-Free / RoHS β€” Lead-free finish (RoHS compliant per distributor listing)
Memory Type β€” SRAM-based, volatile (requires configuration device)
Configuration β€” External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status β€” Obsolete (per Xecor cross-reference data)

Datasheets & Resources

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