EP3SE260F1152C3 vs EP3SE260F1152C4N Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C3 dari Intel dan EP3SE260F1152C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C3 | EP3SE260F1152C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 744 | — |
| Embedded 18x18 Multipliers | 384 | — |
| Paket | 1152-ball FCBGA (Flip-Chip BGA) | 1152-ball FC-FBGA (flip-chip) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Core Voltage | 0.9 V to 1.1 V | 1.1 V |
| Process Technology | 40 nm | 65 nm CMOS |
| Suhu Kerja | 0C to +85C (Commercial) | 0C to +85C (commercial, 'C' suffix) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| PLLs | 12 | — |
| Status RoHS | Compliant | — |
| Speed Grade | C3 | -4 (commercial temperature) |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Tipe Memori | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |