EP3SE260F1152C3 vs EP3SE260F1152C4N 比較
詳細並排比較 EP3SE260F1152C3 由 Intel 與 EP3SE260F1152C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1152C3 | EP3SE260F1152C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | Obsolete |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/Os | 744 | — |
| Embedded 18x18 Multipliers | 384 | — |
| 封裝 | 1152-ball FCBGA (Flip-Chip BGA) | 1152-ball FC-FBGA (flip-chip) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Core Voltage | 0.9 V to 1.1 V | 1.1 V |
| Process Technology | 40 nm | 65 nm CMOS |
| 工作溫度 | 0C to +85C (Commercial) | 0C to +85C (commercial, 'C' suffix) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| PLLs | 12 | — |
| RoHS 狀態 | Compliant | — |
| Speed Grade | C3 | -4 (commercial temperature) |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| 記憶體類型 | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |