EP3SE260F1152C3 vs EP3SE260F1152C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3 sa pamamagitan ng Intel at EP3SE260F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C3 EP3SE260F1152C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Series Stratix III E Stratix III E
Logic Elements 255,000 —
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 —
User I/Os 744 —
Embedded 18x18 Multipliers 384 —
Packhaging 1152-ball FCBGA (Flip-Chip BGA) 1152-ball FC-FBGA (flip-chip)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Core Voltage 0.9 V to 1.1 V 1.1 V
Process Technology 40 nm 65 nm CMOS
Temperature na Operasyon 0C to +85C (Commercial) 0C to +85C (commercial, 'C' suffix)
Configuration Method Passive Serial / Fast Passive Parallel / JTAG —
PLLs 12 —
Tindminan RoHS Compliant —
Speed Grade C3 -4 (commercial temperature)
Family — Stratix III (Enhanced)
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Maximum Operating Frequency — 450 MHz
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Uri ng Memory — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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