EP3SE260F1152C4 vs EP3SE260F1152C2 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3SE260F1152C4 tarafından Intel ve EP3SE260F1152C2 tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP3SE260F1152C4 | EP3SE260F1152C2 |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | Obsolete |
| Series | Stratix III E (Enhanced) | Stratix® III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Speed Grade | C4 (slowest commercial grade) | C2 (commercial) |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| Paket | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| RoHS Durumu | Compliant (per distributor listings) | Compliant |
| İşletim Sıcaklığı | Commercial (0C to +85C) - inferred from speed grade C4 | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Lead-Free | — | Yes |
| MSL Seviyesi | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |