EP3SE260F1152C4 vs EP3SE260F1152C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4 disebabkan oleh Intel dan EP3SE260F1152C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1152C4 | EP3SE260F1152C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Series | Stratix III E (Enhanced) | Stratix® III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Speed Grade | C4 (slowest commercial grade) | C2 (commercial) |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| Kemasan | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Suhu Operasi | Commercial (0C to +85C) - inferred from speed grade C4 | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |