EP3SE260F1152C4 vs EP3SE260F1152C2 तुलना
विस्तृत दोनों ओर की तुलना EP3SE260F1152C4 द्वारा Intel और EP3SE260F1152C2 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SE260F1152C4 | EP3SE260F1152C2 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | Obsolete |
| Series | Stratix III E (Enhanced) | Stratix® III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Speed Grade | C4 (slowest commercial grade) | C2 (commercial) |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| पैकेज | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| RoHS स्थिति | Compliant (per distributor listings) | Compliant |
| ऑपरेटिंग तापमान | Commercial (0C to +85C) - inferred from speed grade C4 | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Lead-Free | — | Yes |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |