EP3SE260F1152C4 vs EP3SE260F1152C2 Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C4 dari Intel dan EP3SE260F1152C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C4 | EP3SE260F1152C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Series | Stratix III E (Enhanced) | Stratix® III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Speed Grade | C4 (slowest commercial grade) | C2 (commercial) |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| Paket | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Suhu Kerja | Commercial (0C to +85C) - inferred from speed grade C4 | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Lead-Free | — | Yes |
| Level MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |