EP3SE260F1152C4 vs EP3SE260F1152C2 比較
詳細並排比較 EP3SE260F1152C4 由 Intel 與 EP3SE260F1152C2 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1152C4 | EP3SE260F1152C2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Series | Stratix III E (Enhanced) | Stratix® III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Process Technology | 65 nm CMOS (TSMC) | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Speed Grade | C4 (slowest commercial grade) | C2 (commercial) |
| Maximum Internal Frequency | ~450 MHz (per FPGAkey listing) | — |
| 封裝 | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | BGA, square | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| DSP Blocks (18x18 Multipliers) | 384 | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Transceivers | External PHY interface only (no integrated GXB) | — |
| RoHS 狀態 | Compliant (per distributor listings) | Compliant |
| 工作溫度 | Commercial (0C to +85C) - inferred from speed grade C4 | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel (formerly Altera) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Lead-Free | — | Yes |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |