EP3SE80F1152C3N vs EP3SE260F1152C3N Comparison
Detailed side-by-side comparison of EP3SE80F1152C3N by Intel and EP3SE260F1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N β ActiveSpecification Comparison
| Parameter | EP3SE80F1152C3N | EP3SE260F1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,690.00 | $7,500.00 |
| Series | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 80,000 | β |
| Total Memory Bits | 6,843,392 bits | β |
| Number of LABs/CLBs | 3200 | β |
| Number of User I/O | 744 | β |
| Number of Outputs | 744 | β |
| Package / Case | 1152-BBGA, FCBGA (FineLine BGA) | β |
| Operating Temperature | 0C to +85C (commercial, C3 grade) | 0 C to +85 C (Commercial) |
| Speed/Power Grade | C3 | β |
| Process Technology | 40 nm CMOS | 65 nm |
| Mounting Type | Surface Mount | Surface Mount |
| Lead Free | Yes | β |
| MSL Level | 3 (per JEDEC J-STD-020) | β |
| Configuration Memory | SRAM-based, volatile (needs external config device) | β |
| RoHS Status | Compliant | Compliant |
| Logic Elements / Cells | β | 255,000 |
| Embedded Memory Bits | β | 16,672,768 bits |
| Logic Array Blocks (LABs) | β | 10,200 |
| User I/O Count | β | 744 |
| Package | β | 1152-BBGA, FCBGA |
| Core Voltage | β | 1.1 V |
| Transceivers | β | Integrated high-speed transceivers |
| DSP Blocks | β | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | β | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | β | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | β | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | β | Supported |
| Programmable Power Technology | β | Yes (up to 50% dynamic power reduction) |