EP3SL50F780I4L vs EP3SE260H780I4L Comparison

Detailed side-by-side comparison of EP3SL50F780I4L by Intel and EP3SE260H780I4L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Last Time Buy

Specification Comparison

Parameter EP3SL50F780I4L EP3SE260H780I4L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $695.09 $1,395.00
Family Stratix III L Stratix III E (Enhanced)
Logic Elements 47,500 255,000
Embedded Memory (bits) 2,184,192 β€”
User I/O Count 488 488
I/O Banks 8 β€”
Package 780-BBGA, FCBGA (29 mm) β€”
Process Technology 65 nm CMOS 65 nm
Core Voltage 0.9 V 0.9 V
Operating Temperature -40C to +100C (Industrial) Industrial, -40C to +85C
Lead-Free / RoHS Yes (L suffix) β€”
Speed Grade I4 β€”
Mounting Type Surface Mount (BGA) Surface Mount (flip-chip)
MSL Level [DATA_NEEDED: MSL moisture sensitivity level] β€”
Configuration Memory SRAM-based, volatile β€”
Design Suite Quartus II / Quartus Prime (Stratix III support) β€”
Device Sub-Family Low-Power (L) β€”
Country of Origin [DATA_NEEDED: COO not specified in source data] β€”
Total Memory Bits β€” 16,672,640
Number of LABs/CLBs β€” [DATA_NEEDED: LAB count]
Package Type β€” 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers β€” 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate β€” 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers β€” [DATA_NEEDED: per-package multiplier count]
RoHS Status β€” Compliant (lead-free)
Configuration Mode β€” JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package β€” 780-BBGA, FCBGA (flip-chip)

Datasheets & Resources

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