EP3SL50F780I4L vs EP3SE260H780I4L Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780I4L disebabkan oleh Intel dan EP3SE260H780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL50F780I4L EP3SE260H780I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Masa Terakhir Dibeli
Family Stratix III L Stratix III E (Enhanced)
Logic Elements 47,500 255,000
Embedded Memory (bits) 2,184,192 —
User I/O Count 488 488
I/O Banks 8 —
Kemasan 780-BBGA, FCBGA (29 mm) —
Process Technology 65 nm CMOS 65 nm
Core Voltage 0.9 V 0.9 V
Suhu Operasi -40C to +100C (Industrial) Industrial, -40C to +85C
Lead-Free / RoHS Yes (L suffix) —
Speed Grade I4 —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (flip-chip)
Aras MSL [DATA_NEEDED: MSL moisture sensitivity level] —
Configuration Memory SRAM-based, volatile —
Design Suite Quartus II / Quartus Prime (Stratix III support) —
Device Sub-Family Low-Power (L) —
Country of Origin [DATA_NEEDED: COO not specified in source data] —
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Status RoHS — Compliant (lead-free)
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

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