EP3SL50F780I4L vs EP3SE260H780I4L 比較
詳細並排比較 EP3SL50F780I4L 由 Intel 與 EP3SE260H780I4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL50F780I4L | EP3SE260H780I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 最後購買 |
| Family | Stratix III L | Stratix III E (Enhanced) |
| Logic Elements | 47,500 | 255,000 |
| Embedded Memory (bits) | 2,184,192 | — |
| User I/O Count | 488 | 488 |
| I/O Banks | 8 | — |
| 封裝 | 780-BBGA, FCBGA (29 mm) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 0.9 V | 0.9 V |
| 工作溫度 | -40C to +100C (Industrial) | Industrial, -40C to +85C |
| Lead-Free / RoHS | Yes (L suffix) | — |
| Speed Grade | I4 | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (flip-chip) |
| MSL 等級 | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Configuration Memory | SRAM-based, volatile | — |
| Design Suite | Quartus II / Quartus Prime (Stratix III support) | — |
| Device Sub-Family | Low-Power (L) | — |
| Country of Origin | [DATA_NEEDED: COO not specified in source data] | — |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| RoHS 狀態 | — | Compliant (lead-free) |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |