EP3SL50F780I4L vs EP3SE260H780I4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780I4L sa pamamagitan ng Intel at EP3SE260H780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F780I4L EP3SE260H780I4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Family Stratix III L Stratix III E (Enhanced)
Logic Elements 47,500 255,000
Embedded Memory (bits) 2,184,192 —
User I/O Count 488 488
I/O Banks 8 —
Packhaging 780-BBGA, FCBGA (29 mm) —
Process Technology 65 nm CMOS 65 nm
Core Voltage 0.9 V 0.9 V
Temperature na Operasyon -40C to +100C (Industrial) Industrial, -40C to +85C
Lead-Free / RoHS Yes (L suffix) —
Speed Grade I4 —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (flip-chip)
Level ng MSL [DATA_NEEDED: MSL moisture sensitivity level] —
Configuration Memory SRAM-based, volatile —
Design Suite Quartus II / Quartus Prime (Stratix III support) —
Device Sub-Family Low-Power (L) —
Country of Origin [DATA_NEEDED: COO not specified in source data] —
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Tindminan RoHS — Compliant (lead-free)
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

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