EP3SL50F780I4L vs EP3SE260H780I4L Perbandingan

Perbandingan bersamaan detil EP3SL50F780I4L dari Intel dan EP3SE260H780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SL50F780I4L EP3SE260H780I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Waktu Pembelian Terakhir
Family Stratix III L Stratix III E (Enhanced)
Logic Elements 47,500 255,000
Embedded Memory (bits) 2,184,192 —
User I/O Count 488 488
I/O Banks 8 —
Paket 780-BBGA, FCBGA (29 mm) —
Process Technology 65 nm CMOS 65 nm
Core Voltage 0.9 V 0.9 V
Suhu Kerja -40C to +100C (Industrial) Industrial, -40C to +85C
Lead-Free / RoHS Yes (L suffix) —
Speed Grade I4 —
Tipe Mounting Surface Mount (BGA) Surface Mount (flip-chip)
Level MSL [DATA_NEEDED: MSL moisture sensitivity level] —
Configuration Memory SRAM-based, volatile —
Design Suite Quartus II / Quartus Prime (Stratix III support) —
Device Sub-Family Low-Power (L) —
Country of Origin [DATA_NEEDED: COO not specified in source data] —
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Status RoHS — Compliant (lead-free)
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

Spek dan Sumber

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