H5TC4G63CFR-PBL vs K4B4G1646D-BCK00 Comparison

Detailed side-by-side comparison of H5TC4G63CFR-PBL by SK hynix and K4B4G1646D-BCK00 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5TC4G63CFR-PBL H5TC4G63CFR-PBL - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63CFR-PBL - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63CFR-PBL ✓ Active
Samsung Electronics
K4B4G1646D-BCK00 K4B4G1646D-BCK00 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung

K4B4G1646D-BCK00 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung

K4B4G1646D-BCK00 ✓ Active

Specification Comparison

Parameter H5TC4G63CFR-PBL K4B4G1646D-BCK00
Brand SK hynix Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Memory Type DDR3L SDRAM DDR3L SDRAM
Memory Size 4 Gb (256M x 16) —
Supply Voltage 1.35 V 1.35V (1.283V to 1.45V)
Data Rate 1600 Mbps (PC3L-12800) 1600 Mbps/pin
Package 96-ball FBGA (TFBGA) 96-ball FBGA (13 x 9 mm, 0.8 mm pitch)
Number of Terminals 96 —
Package Shape RECTANGULAR —
Terminal Form BALL —
Burst Length 8 8, 4 (with burst chop)
CAS Latency 11, 12, 13 11 (at 1600 Mbps)
Number of Banks 8 8
Refresh Period 7.8 us at 85C —
RoHS Compliant Compliant
Lead-Free Yes Yes
Halogen Free Yes Yes
Density — 4 Gb
Organization — 256M x 16
Speed Grade — DDR3-1600 (800 MHz)
I/O Voltage — 1.35V
Operating Temperature — 0°C to 95°C (Tcase)

Datasheets & Resources

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