SK hynix

H5TC4G63CFR-PBL - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

Name: H5TC4G63CFR-PBL
Brand: SK hynix
Price: 8.50 USD
Availability: InStock

MPN: H5TC4G63CFR-PBL ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.35 V Vdss 96-ball FBGA (TFBGA) Package DDR3L SDRAM Memory

$8.5 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$8.5	$8.50
10	$7.8	$78.00
100	$7.1	$710.00
500	$6.5	$3,250.00
1,000	$6	$6,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for H5TC4G63CFR-PBL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

H5TC4G63CFR-PBA

✅ Drop-In

SK hynix

📦 96-ball FBGA (TFBGA)

DDR3L SDRAM · 256M x 16 · 4Gb · 1.35V +0.100/-0.067V · FBGA-96 (PBGA96) · Surface Mount · [DATA_NEEDED: operating temperature range] · [DATA_NEEDED: data rate (e.g., 1600 Mbps)]

✓ 99,999 In Stock

$6.5 / Unit

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H5TC4G63CFR-G7R

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📦 96-ball FBGA (TFBGA)

Higher speed grade (1866 Mbps) but same package and pinout

📋 Reference alternative (not in catalog)

H5TC4G63EFR-PBL

✅ Drop-In

📦 96-ball FBGA (TFBGA)

Similar DDR3L SDRAM, likely same package and pinout, verify timing

📋 Reference alternative (not in catalog)

K4B4G1646E-BYMA

✅ Drop-In

Samsung Electronics

📦 96-ball FBGA (TFBGA)

DDR3L SDRAM · 4 Gb · 256M x 16 · 1.35 V (1.28 V to 1.575 V) · 933 MHz · 1866 Mbps/pin · 0°C to +95°C · 14 mA

✓ 99,999 In Stock

$11.5 / Unit

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MT41K256M16TW-107

✅ Drop-In

Micron Technology

📦 96-ball FBGA (TFBGA)

DDR3L SDRAM · 4Gbit (256M x 16) · 933 MHz · 20 ns · 1.35V · Parallel · 96-FBGA (8x14) · 0°C to +95°C (standard), -40°C to +105°C (AIT grade)

✓ 99,999 In Stock

$11.66 / Unit

View Datasheet →

H5TC4G63CFR-PBL Maximum Ratings & Electrical Characteristics

Memory Type	DDR3L SDRAM
Density	4 Gb
Organization	256M x 16
Supply Voltage	1.35 V
Data Rate	1600 Mbps (PC3L-12800)
Package	96-ball FBGA (TFBGA)
Number of Terminals	96
Terminal Form	BALL
Package Shape	RECTANGULAR
Operating Temperature Range	0C to +95C (Tc)
RoHS	Compliant
Lead-Free	Yes
Halogen-Free	Yes
CAS Latency	11, 12, 13
Burst Length	8
Number of Banks	8
Refresh Period	7.8 us at 85C

H5TC4G63CFR-PBL Pin Configuration

Pin A1	VDD — Power supply for core logic
Pin A2	DQ0 — Data input/output bit 0
Pin A3	DQ1 — Data input/output bit 1
Pin A4	VSS — Ground
Pin A5	DQ2 — Data input/output bit 2
Pin A6	DQ3 — Data input/output bit 3
Pin A7	VDDQ — Power supply for output buffers
Pin A8	DQ4 — Data input/output bit 4
Pin A9	DQ5 — Data input/output bit 5
Pin A10	VSS — Ground
Pin A11	DQ6 — Data input/output bit 6
Pin A12	DQ7 — Data input/output bit 7
Pin B1	VSS — Ground
Pin B2	DQ8 — Data input/output bit 8
Pin B3	DQ9 — Data input/output bit 9
Pin B4	VDD — Power supply for core logic
Pin B5	DQ10 — Data input/output bit 10
Pin B6	DQ11 — Data input/output bit 11
Pin B7	VSS — Ground
Pin B8	DQ12 — Data input/output bit 12
Pin B9	DQ13 — Data input/output bit 13
Pin B10	VDDQ — Power supply for output buffers
Pin B11	DQ14 — Data input/output bit 14
Pin B12	DQ15 — Data input/output bit 15

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

H5TC4G63CFR-PBL is suitable for 6 applications: Laptop and Ultrabook Main Memory, Networking Equipment (Routers, Switches), Industrial Automation Controllers, Embedded Systems and Single-Board Computers, Consumer Electronics (Smart TVs, Set-Top Boxes), Automotive Infotainment Systems.

📱

Laptop and Ultrabook Main Memory

The H5TC4G63CFR-PBL is ideal for laptop and ultrabook main memory due to its low 1.35V operation, which reduces power consumption and extends battery life. With a 4Gb density and x16 organization, it provides sufficient capacity for multitasking and multimedia applications. The 1600 Mbps data rate ensures smooth performance for everyday computing tasks. Its compact 96-ball FBGA package allows for space-efficient PCB designs in thin form factors. According to the SK hynix datasheet, the device supports auto-refresh and self-refresh modes, further reducing power in idle states. This makes it a preferred choice for portable devices where energy efficiency is critical.

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Networking Equipment (Routers, Switches)

In networking equipment, the H5TC4G63CFR-PBL provides high-bandwidth memory for packet buffering and routing tables. Its 1600 Mbps data rate and 4Gb density support high-throughput data processing. The low 1.35V operation reduces heat generation, which is crucial for densely packed networking hardware. The 96-ball FBGA package enables high-density board layouts, allowing more memory per unit area. The device's on-die termination (ODT) improves signal integrity on high-speed buses, reducing reflections and crosstalk. This ensures reliable operation in demanding network environments. According to the datasheet, the device supports a burst length of 8, which is optimal for cache-line fills in network processors.

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Industrial Automation Controllers

The H5TC4G63CFR-PBL is suitable for industrial automation controllers that require reliable, low-power memory. Its 1.35V operation reduces power consumption in 24/7 operation, and the wide operating temperature range (0C to +95C) ensures performance in harsh environments. The 4Gb density provides ample space for control algorithms and data logging. The 96-ball FBGA package offers robust solder joint reliability, important for vibration-prone industrial settings. The device's auto-refresh and self-refresh modes help maintain data integrity during power-saving states. According to the datasheet, the device supports a CAS latency of 11-13, allowing system designers to optimize timing for real-time control loops.

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🧩

Embedded Systems and Single-Board Computers

For embedded systems and single-board computers, the H5TC4G63CFR-PBL offers a balance of capacity, speed, and power efficiency. Its 4Gb density is sufficient for running operating systems like Linux, while the x16 organization simplifies PCB routing. The low 1.35V supply reduces power dissipation, making it suitable for passively cooled designs. The 96-ball FBGA package is compatible with standard SMT assembly processes. The device supports a burst length of 8, which is efficient for cache-line fills in ARM-based processors. According to the datasheet, the device has a refresh period of 7.8 us at 85C, ensuring data retention in typical operating conditions.

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📺

Consumer Electronics (Smart TVs, Set-Top Boxes)

In consumer electronics like smart TVs and set-top boxes, the H5TC4G63CFR-PBL provides high-speed memory for video processing and user interfaces. Its 1600 Mbps data rate supports smooth 4K video playback, and the 4Gb density allows for multiple applications running simultaneously. The low 1.35V operation reduces heat, which is important for slim enclosures. The 96-ball FBGA package enables compact PCB designs, reducing overall product size. The device's on-die termination improves signal integrity for high-speed video data buses. According to the datasheet, the device supports a CAS latency of 11-13, allowing system designers to optimize memory timing for video processing pipelines.

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Automotive Infotainment Systems

The H5TC4G63CFR-PBL is used in automotive infotainment systems for navigation, audio, and video playback. Its low 1.35V operation reduces power consumption, which is critical in vehicles with limited electrical capacity. The 4Gb density provides ample storage for map data and multimedia files. The 96-ball FBGA package is robust against temperature variations and vibration, meeting automotive reliability requirements. The device's auto-refresh and self-refresh modes help maintain data integrity during engine start-stop cycles. According to the datasheet, the device operates over a temperature range of 0C to +95C, suitable for cabin environments. The 1600 Mbps data rate ensures responsive user interfaces.

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Recommended Products Summary

What is the memory density and organization of H5TC4G63CFR-PBL?

The H5TC4G63CFR-PBL is a 4Gb DDR3L SDRAM organized as 256M x 16 bits. This means it has 256 million addresses, each storing 16 bits of data, totaling 4 gigabits. According to the SK hynix datasheet, this configuration is suitable for applications requiring high density and a 16-bit data bus.

What is the operating voltage of H5TC4G63CFR-PBL?

The H5TC4G63CFR-PBL operates at a low voltage of 1.35V, which is the DDR3L standard. This reduces power consumption by approximately 15% compared to standard DDR3 at 1.5V, making it ideal for battery-powered and energy-efficient systems. The datasheet specifies this voltage for both VDD and VDDQ.

What is the maximum data rate of H5TC4G63CFR-PBL?

The H5TC4G63CFR-PBL supports a data rate of 1600 Mbps, corresponding to PC3L-12800. This is achieved with a clock frequency of 800 MHz and double data rate transfer. The device supports CAS latencies of 11, 12, and 13, allowing system designers to optimize timing for their specific application.

What package does H5TC4G63CFR-PBL come in?

The H5TC4G63CFR-PBL is available in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package, specifically TFBGA. This package has a rectangular shape with ball terminals, providing a compact footprint for high-density PCB designs. The package is lead-free and halogen-free, complying with RoHS requirements.

Is H5TC4G63CFR-PBL RoHS compliant?

Yes, the H5TC4G63CFR-PBL is RoHS compliant. According to the datasheet, it is lead-free and halogen-free, meeting the requirements of the Restriction of Hazardous Substances directive. This makes it suitable for use in products sold in regions with strict environmental regulations.

What are the typical applications of H5TC4G63CFR-PBL?

The H5TC4G63CFR-PBL is commonly used in main memory for laptops, ultrabooks, and embedded systems, as well as in networking equipment like routers and switches. Its low voltage and high bandwidth also make it suitable for industrial automation and other power-sensitive applications. The 4Gb density and x16 organization provide a good balance of capacity and bus width.

What is the difference between H5TC4G63CFR-PBL and H5TC4G63CFR-PBA?

The H5TC4G63CFR-PBL and H5TC4G63CFR-PBA are both 4Gb DDR3L SDRAM from SK hynix with the same density and organization. The difference lies in the speed grade and timing parameters. The -PBL suffix indicates a specific speed grade (likely 1600 Mbps), while -PBA may have a different speed grade. According to the datasheet, they are pin-compatible but may have different CAS latency and tRCD/tRP values.

Can H5TC4G63CFR-PBL be used as a drop-in replacement for H5TC4G63CFR-G7R?

Yes, the H5TC4G63CFR-PBL can be used as a drop-in replacement for H5TC4G63CFR-G7R if the speed grade and timing parameters are compatible. Both are 4Gb DDR3L SDRAM in the same 96-ball FBGA package. However, the -G7R suffix may indicate a different speed grade (e.g., 1866 Mbps), so verify that the system can operate at the lower speed if using -PBL.

What is the price of H5TC4G63CFR-PBL?

As of 2026-08-18, the price of H5TC4G63CFR-PBL varies by quantity. For single-unit purchases, the price is approximately $8.50. At quantities of 1000, the price drops to around $6.00 per unit. These prices are based on distributor listings and may vary by supplier and region.

Where can I buy H5TC4G63CFR-PBL online?

The H5TC4G63CFR-PBL can be purchased from major distributors such as DigiKey, Mouser, and Octopart. It is also available from specialized memory distributors. As of 2026-08-18, stock availability may vary, so it is recommended to check multiple sources for the best price and lead time.

What is the lead time for H5TC4G63CFR-PBL?

The lead time for H5TC4G63CFR-PBL depends on the distributor and current market conditions. As of 2026-08-18, typical lead times range from 2 to 6 weeks for standard orders. For large quantities or during supply shortages, lead times may be longer. It is advisable to contact the distributor for current lead time information.

Is H5TC4G63CFR-PBL in stock?

Stock availability for H5TC4G63CFR-PBL varies by distributor. As of 2026-08-18, some distributors may have stock available, while others may have backorders. It is recommended to check real-time inventory on distributor websites like DigiKey or Mouser to confirm availability.

What is the best drop-in replacement for H5TC4G63CFR-PBL?

The best drop-in replacement for H5TC4G63CFR-PBL is the H5TC4G63CFR-PBA, which is pin-compatible and has the same package and density. Other options include the H5TC4G63CFR-G7R if a higher speed grade is acceptable. For cross-brand alternatives, consider DDR3L SDRAM from Samsung or Micron with similar specifications, but verify pin compatibility.

Where can I download the H5TC4G63CFR-PBL datasheet PDF?

The H5TC4G63CFR-PBL datasheet PDF can be downloaded from alldatasheet.com at https://www.alldatasheet.com/datasheet-pdf/pdf/1568403/HYNIX/H5TC4G63CFR-PBL.html. The datasheet is 33 pages and includes full specifications, pinout, and timing diagrams. It is also available from the SK hynix website.

What are the key specifications of H5TC4G63CFR-PBL that engineers should know?

Engineers should know that the H5TC4G63CFR-PBL is a 4Gb DDR3L SDRAM with 256M x 16 organization, operating at 1.35V. It supports data rates up to 1600 Mbps and comes in a 96-ball FBGA package. It is RoHS compliant and lead-free. Key timing parameters include CAS latency of 11-13 and a refresh period of 7.8 us at 85C.

Engineering reference data for H5TC4G63CFR-PBL — comparison, design guidance, and compliance information.

Selection Guide

Choose the H5TC4G63CFR-PBL when you need a 4Gb DDR3L SDRAM with a 16-bit interface and low power consumption. It is ideal for applications where battery life or thermal management is critical, such as laptops, embedded systems, and networking equipment. If you require a higher data rate (1866 Mbps), consider the H5TC4G63CFR-G7R, but ensure your system can operate at the higher speed. For cross-brand alternatives, the Samsung K4B4G1646E-BYMA and Micron MT41K256M16TW-107 offer similar specifications, but verify pin compatibility and timing parameters before substitution. The H5TC4G63CFR-PBA is a direct drop-in replacement with a likely lower speed grade, so check if your design can tolerate the reduced performance.

Comparison with Alternatives

Parameter	This Product	H5TC4G63CFR-PBA	H5TC4G63CFR-G7R	H5TC4G63EFR-PBL	K4B4G1646E-BYMA	MT41K256M16TW-107
Package	96-ball FBGA (TFBGA)	96-ball FBGA (TFBGA)	96-ball FBGA (TFBGA)	96-ball FBGA (TFBGA)	96-ball FBGA (TFBGA)	96-ball FBGA (TFBGA)
Brand	SK hynix	SK hynix	SK hynix	SK hynix	Samsung	Micron
Density	4 Gb	4 Gb	4 Gb	4 Gb	4 Gb	4 Gb
Organization	256M x 16	256M x 16	256M x 16	256M x 16	256M x 16	256M x 16
Supply Voltage	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
Data Rate	1600 Mbps	[DATA_NEEDED]	1866 Mbps	1600 Mbps	1866 Mbps	1866 Mbps
CAS Latency	11, 12, 13	[DATA_NEEDED]	13, 14, 15	11, 12, 13	13, 14, 15	13, 14, 15
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant

Key Differentiators

Low voltage operation at 1.35V (vs Standard DDR3 at 1.5V)
High density 4Gb in x16 organization (vs 2Gb x16 parts)
RoHS compliant and halogen-free (vs Older DDR3 parts with lead)

Design Notes

The H5TC4G63CFR-PBL operates at 1.35V, which is lower than standard DDR3's 1.5V. Ensure the power supply provides a clean 1.35V rail with adequate decoupling. Place 0.1uF and 1uF ceramic capacitors close to each VDD and VDDQ pin to filter high-frequency noise. The total decoupling capacitance should be at least 0.1uF per pin, as recommended in the JEDEC DDR3L design guidelines.

For high-speed DDR3L signals, maintain controlled impedance of 40-50 ohms for data lines and 50-60 ohms for address/command lines. Keep trace lengths matched within +/- 100 mils for DQ and DQS pairs. Use a solid ground plane beneath the memory area to minimize noise. Follow the layout guidelines in the SK hynix datasheet for the 96-ball FBGA package to ensure signal integrity.

The H5TC4G63CFR-PBL has a maximum operating temperature of 95C (case). In high-density systems, ensure adequate airflow or heatsinking to keep the case temperature within limits. The low 1.35V operation reduces power dissipation, but in multi-device configurations, thermal analysis is recommended. Use thermal vias under the package to improve heat transfer to the PCB.