IRF530NSTRLPBF vs IRF540NSTRLPBF Comparison

Detailed side-by-side comparison of IRF530NSTRLPBF by Infineon and IRF540NSTRLPBF by Infineon. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter IRF530NSTRLPBF IRF540NSTRLPBF
Brand Infineon Infineon
Category MOSFETs MOSFETs
Lifecycle Status Active Active
Polarity N-Channel —
MOSFET Operating Mode Enhancement —
Drain-Source Breakdown Voltage (V(BR)DSS) 100 V —
Continuous Drain Current (ID) at Tc=25C 17 A —
Static Drain-Source On-Resistance (RDS(on)) max at VGS=10V 90 mOhm —
Total Gate Charge (Qg) 24.7 nC —
Power Dissipation (Pd) at Tc=25C 70 W 130 W
Power Dissipation (Pd) at Ta=25C 3.8 W —
Gate-Source Voltage (VGS) max +/- 20 V —
Package Type D2PAK (TO-263), 3-pin (2 + tab) —
Mounting Type Surface Mount Surface Mount
Technology HEXFET (Planar Stripe Cell) HEXFET (IR MOSFET)
Operating Temperature Range -55C to +175C -55 C to +175 C
Lead-Free / RoHS Status Lead-Free / RoHS Compliant —
Qualification Market Industrial —
Transistor Type — N-Channel MOSFET
Drain-Source Voltage (Vdss) — 100 V
Continuous Drain Current (Id) at Tc=25C — 33 A
Pulsed Drain Current (Idm) — 110 A (per datasheet pulse curve)
On-Resistance Rds(on) max at Vgs=10V — 44 mOhm
Gate Threshold Voltage Vgs(th) — 2.0 V to 4.0 V
Total Gate Charge Qg — 47.3 nC (typical)
Package — D2PAK (TO-263), surface mount
Packaging — Tape & Reel (13-inch reel)
RoHS Status — Compliant (Pb-free)
Avalanche Energy Rated — Yes (HEXFET ruggedized)

Datasheets & Resources

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