K4A8G085WB-BCPB vs K4A8G085WB-BIWE Comparison
Detailed side-by-side comparison of K4A8G085WB-BCPB by Samsung Electronics and K4A8G085WB-BIWE by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G085WB-BIWE
K4A8G085WB-BIWE - 8Gb DDR4 SDRAM 3200Mbps | Samsung
K4A8G085WB-BIWE β ActiveSpecification Comparison
| Parameter | K4A8G085WB-BCPB | K4A8G085WB-BIWE |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.28 | $6.50 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | β |
| Organization | 1G x 8 | β |
| Supply Voltage | 1.2 V (nominal) | 1.2 V |
| Data Rate | 3200 Mbps (PC4-25600) | 3200 Mbps |
| Speed Grade | BC | β |
| CAS Latency (CL) | 22 | β |
| Burst Length | 8 | β |
| Bank Architecture | 16 banks (4 bank groups) | β |
| Refresh Interval | 7.8 us (up to 85C) | β |
| Interface Type | SSTL-12 | β |
| Termination | ODT / dynamic ODT | β |
| Self-Refresh | Temperature-Compensated Self-Refresh (TCSR) | β |
| Package | 78-ball FBGA | 78-FBGA |
| Package Dimensions | 11 mm x 11 mm | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Operating Mode | DLL enabled | β |
| RoHS Status | Compliant | Compliant |
| Memory Size | β | 8 Gb |
| Memory Organization | β | 1G x 8 |
| Operating Temperature | β | 0Β°C to +85Β°C |
| Memory Interface | β | Parallel |
| Access Time | β | [DATA_NEEDED: tRCD, tRP, tRAS] |
| CAS Latency | β | [DATA_NEEDED: CL value] |
| Refresh | β | Auto-refresh, self-refresh |
| Lead-Free | β | Yes |
| Halogen-Free | β | Yes |