K4A8G085WB-BCPB vs K4A8G085WC Comparison
Detailed side-by-side comparison of K4A8G085WB-BCPB by Samsung Electronics and K4A8G085WC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics
K4A8G085WC ✓ ActiveSpecification Comparison
| Parameter | K4A8G085WB-BCPB | K4A8G085WC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.78 | $24.90 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gbit |
| Organization | 1G x 8 | 1G x 8 |
| Supply Voltage | 1.2 V (nominal) | 1.2 V |
| Data Rate | 3200 Mbps (PC4-25600) | — |
| Speed Grade | BC | — |
| CAS Latency (CL) | 22 | — |
| Burst Length | 8 | — |
| Bank Architecture | 16 banks (4 bank groups) | — |
| Refresh Interval | 7.8 us (up to 85C) | — |
| Interface Type | SSTL-12 | — |
| Termination | ODT / dynamic ODT | — |
| Self-Refresh | Temperature-Compensated Self-Refresh (TCSR) | — |
| Package | 78-ball FBGA | 78-ball FBGA (78FBGA) |
| Package Dimensions | 11 mm x 11 mm | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Operating Mode | DLL enabled | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Speed | — | 2666 Mbps/pin (DDR4-2666) |
| Supply Voltage Range | — | 1.14 V to 1.26 V |
| Clock Frequency | — | 1333 MHz (1333.333 GHz nominal, per web data) |
| Operating Temperature (K4A8G085WC-BITD) | — | -40 C to +95 C |
| Operating Temperature (K4A8G085WC-BCTD) | — | 0 C to +95 C |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination (ODT) | — | Yes |
| Data Mask (DM) | — | Yes |