K4A8G085WB-BCPB vs K4A8G085WC Vergleich
Detaillierter Direktvergleich von K4A8G085WB-BCPB von Samsung Electronics und K4A8G085WC von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Samsung Electronics
K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics
K4A8G085WC ✓ AktivSpezifikationsvergleich
| Parameter | K4A8G085WB-BCPB | K4A8G085WC |
|---|---|---|
| Marke | Samsung Electronics | Samsung Electronics |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,78 | $24,90 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gbit |
| Speicherorganisation | 1G x 8 | 1G x 8 |
| Versorgungsspannung | 1.2 V (nominal) | 1.2 V |
| Datenrate | 3200 Mbps (PC4-25600) | — |
| Speed Grade | BC | — |
| CAS Latency (CL) | 22 | — |
| Burst Length | 8 | — |
| Bank Architecture | 16 banks (4 bank groups) | — |
| Refresh Interval | 7.8 us (up to 85C) | — |
| Schnittstellentyp | SSTL-12 | — |
| Termination | ODT / dynamic ODT | — |
| Self-Refresh | Temperature-Compensated Self-Refresh (TCSR) | — |
| Gehäuse | 78-ball FBGA | 78-ball FBGA (78FBGA) |
| Package Dimensions | 11 mm x 11 mm | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Operating Mode | DLL enabled | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Speed | — | 2666 Mbps/pin (DDR4-2666) |
| Supply Voltage Range | — | 1.14 V to 1.26 V |
| Clock Frequency | — | 1333 MHz (1333.333 GHz nominal, per web data) |
| Operating Temperature (K4A8G085WC-BITD) | — | -40 C to +95 C |
| Operating Temperature (K4A8G085WC-BCTD) | — | 0 C to +95 C |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination (ODT) | — | Yes |
| Data Mask (DM) | — | Yes |