MT41K256M16MTW-107IT vs K4B4G1646E-BYK0 Comparison
Detailed side-by-side comparison of MT41K256M16MTW-107IT by Micron Technology and K4B4G1646E-BYK0 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Micron Technology
MT41K256M16MTW-107IT
MT41K256M16MTW-107IT - 4Gb DDR3L SDRAM 933MHz | Micron
MT41K256M16MTW-107IT β ActiveSamsung Electronics
K4B4G1646E-BYK0
K4B4G1646E-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
K4B4G1646E-BYK0 β ActiveSpecification Comparison
| Parameter | MT41K256M16MTW-107IT | K4B4G1646E-BYK0 |
|---|---|---|
| Brand | Micron Technology | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.50 | $1.80 |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Memory Size | 4 Gbit (256M x 16) | β |
| Clock Speed | 933 MHz | β |
| Data Bus Width | 16 bit | β |
| Supply Voltage | 1.35 V | 1.35 V (1.283 V to 1.45 V) |
| Row Cycle Time (tRC) | 20 ns | β |
| CAS Latency | 13 | 11 (CL-tRCD-tRP) |
| Operating Temperature Range | -40Β°C to +95Β°C | β |
| Package | 96-FBGA (8x14 mm) | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) |
| Mounting Type | Surface Mount | β |
| Interface | Parallel | β |
| Access Time | 0.195 ns | β |
| RoHS Status | Compliant | β |
| Lead-Free | Yes | β |
| Technology | CMOS | β |
| Density | β | 4 Gb |
| Organization | β | 256M x 16 |
| Data Rate | β | DDR3-1600 (800 MHz) |
| Operating Temperature | β | 0Β°C to +95Β°C (TC) |
| Burst Length | β | 8 (fixed), 4 (burst chop) |
| On-Die Termination | β | Yes (dynamic ODT) |
| ZQ Calibration | β | Yes |
| Auto Precharge | β | Yes |
| Self-Refresh | β | Yes |
| Asynchronous Reset | β | Yes |
| Data Mask | β | Yes |
| RoHS | β | Compliant |