DSP56311VF150 vs DSP56303VF100 Karşılaştırma
Ayrıntılı yan yana karşılaştırma DSP56311VF150 tarafından NXP Semiconductors ve DSP56303VF100 tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | DSP56311VF150 | DSP56303VF100 |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Yaşam Döngüsü Durumu | Obsolete | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | DSP56300 (Symphony) | — |
| Type | Fixed-Point Digital Signal Processor | — |
| Core Clock Frequency | 150 MHz | — |
| Instruction Throughput | 150 MIPS | — |
| Multiply-Accumulate Performance | 300 MMACS | — |
| Veri Bus Genişliği | 24 bit | — |
| On-Chip RAM | 384 KB | 24 KB |
| Bootstrap ROM | 576 B | 576 bytes |
| Enhanced Filter Coprocessor (EFCOP) | Yes, parallel execution | — |
| DMA Channels | 6 | — |
| Serial Interfaces | Host Interface (HI), SSI, SCI | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Input Logic Compatibility | TTL-compatible | — |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: industrial temperature grade] |
| Paket | 196-ball MAP-BGA (15x15 mm) | 196-ball LBGA (15x15 mm), MAP-BGA-196 |
| Montaj Türü | Surface Mount | Surface Mount |
| Process Technology | High-density CMOS | — |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per datasheet] |
| MSL Seviyesi | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Core Architecture | — | DSP56300 family, 24-bit fixed-point |
| Clock Frequency | — | 100 MHz |
| Performance | — | 100 MIPS (million instructions per second) |
| Instruction Cycle | — | Single clock cycle per instruction |
| Data Word Width | — | 24 bits |
| Address Space | — | 24-bit program and data |
| Core Voltage | — | [DATA_NEEDED: internal core Vdd] |
| Interfaces | — | Host Interface (HI08), ESSI, SCI |
| On-Chip Peripherals | — | Triple Timer, PLL, External Memory Expansion port |
| Debug | — | JTAG/OnCE |
| Packaging | — | Tray |