DSP56311VF150 vs DSP56303VF100 比較
詳細並排比較 DSP56311VF150 由 NXP Semiconductors 與 DSP56303VF100 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | DSP56311VF150 | DSP56303VF100 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | DSP | DSP |
| 生命週期狀態 | Obsolete | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | DSP56300 (Symphony) | — |
| Type | Fixed-Point Digital Signal Processor | — |
| Core Clock Frequency | 150 MHz | — |
| Instruction Throughput | 150 MIPS | — |
| Multiply-Accumulate Performance | 300 MMACS | — |
| 資料匯流排寬度 | 24 bit | — |
| On-Chip RAM | 384 KB | 24 KB |
| Bootstrap ROM | 576 B | 576 bytes |
| Enhanced Filter Coprocessor (EFCOP) | Yes, parallel execution | — |
| DMA Channels | 6 | — |
| Serial Interfaces | Host Interface (HI), SSI, SCI | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Input Logic Compatibility | TTL-compatible | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: industrial temperature grade] |
| 封裝 | 196-ball MAP-BGA (15x15 mm) | 196-ball LBGA (15x15 mm), MAP-BGA-196 |
| 安裝類型 | Surface Mount | Surface Mount |
| Process Technology | High-density CMOS | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per datasheet] |
| MSL 等級 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Core Architecture | — | DSP56300 family, 24-bit fixed-point |
| Clock Frequency | — | 100 MHz |
| Performance | — | 100 MIPS (million instructions per second) |
| Instruction Cycle | — | Single clock cycle per instruction |
| Data Word Width | — | 24 bits |
| Address Space | — | 24-bit program and data |
| Core Voltage | — | [DATA_NEEDED: internal core Vdd] |
| Interfaces | — | Host Interface (HI08), ESSI, SCI |
| On-Chip Peripherals | — | Triple Timer, PLL, External Memory Expansion port |
| Debug | — | JTAG/OnCE |
| Packaging | — | Tray |