DSP56311VF150 vs DSP56303VF100 Perbandingan

Perbandingan bersamaan detil DSP56311VF150 dari NXP Semiconductors dan DSP56303VF100 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
DSP56311VF150 DSP56311VF150 - 150MHz 24-Bit Fixed-Point DSP | NXP

DSP56311VF150 - 150MHz 24-Bit Fixed-Point DSP | NXP

DSP56311VF150 Obsolete
NXP Semiconductors
DSP56303VF100 DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 Obsolete

Perbandingan Spesifikasi

Parameter Umum DSP56311VF150 DSP56303VF100
Merek NXP Semiconductors NXP Semiconductors
Kategori DSP DSP
Status Lingkungan Hidup Obsolete Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) —
Series DSP56300 (Symphony) —
Type Fixed-Point Digital Signal Processor —
Core Clock Frequency 150 MHz —
Instruction Throughput 150 MIPS —
Multiply-Accumulate Performance 300 MMACS —
Lebar Bus Data 24 bit —
On-Chip RAM 384 KB 24 KB
Bootstrap ROM 576 B 576 bytes
Enhanced Filter Coprocessor (EFCOP) Yes, parallel execution —
DMA Channels 6 —
Serial Interfaces Host Interface (HI), SSI, SCI —
I/O Voltage 3.30 V 3.30 V
Input Logic Compatibility TTL-compatible —
Suhu Kerja [DATA_NEEDED: operating temperature range] [DATA_NEEDED: industrial temperature grade]
Paket 196-ball MAP-BGA (15x15 mm) 196-ball LBGA (15x15 mm), MAP-BGA-196
Tipe Mounting Surface Mount Surface Mount
Process Technology High-density CMOS —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance per datasheet]
Level MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: moisture sensitivity level]
Core Architecture — DSP56300 family, 24-bit fixed-point
Clock Frequency — 100 MHz
Performance — 100 MIPS (million instructions per second)
Instruction Cycle — Single clock cycle per instruction
Data Word Width — 24 bits
Address Space — 24-bit program and data
Core Voltage — [DATA_NEEDED: internal core Vdd]
Interfaces — Host Interface (HI08), ESSI, SCI
On-Chip Peripherals — Triple Timer, PLL, External Memory Expansion port
Debug — JTAG/OnCE
Packaging — Tray

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