MPC870VR66 vs MPC875VR133 Perbandingan
Perbandingan bersamaan detil MPC870VR66 dari NXP Semiconductors dan MPC875VR133 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC870VR66 | MPC875VR133 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC, MPC8xx | PowerQUICC, MPC8xx |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 |
| Lebar Bus Data | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | 176 MIPS |
| Tegangan Pemuat Kerja | 3.3 V | — |
| Rentang Suhu Kerja | 0C to +95C | — |
| Paket / Case | 256-BGA (PBGA), 23x23 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Processor Type | MPC8xx PowerQUICC Communications Processor | — |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Core Frequency | — | 133 MHz |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Suhu Kerja | — | 0 °C to +95 °C |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| Level MSL | — | [DATA_NEEDED: MSL level] |