MPC870VR66 vs MPC875VR133 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC870VR66 disebabkan oleh NXP Semiconductors dan MPC875VR133 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC870VR66 | MPC875VR133 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC, MPC8xx | PowerQUICC, MPC8xx |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 |
| Lebar Bus Data | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | 176 MIPS |
| Tegangan Pemberi Arus Operasi | 3.3 V | — |
| Gambaran Suhu Operasi | 0C to +95C | — |
| Kemasan / Case | 256-BGA (PBGA), 23x23 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Processor Type | MPC8xx PowerQUICC Communications Processor | — |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Core Frequency | — | 133 MHz |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Suhu Operasi | — | 0 °C to +95 °C |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |