MPC870VR66 vs MPC875VR133 比較
詳細並排比較 MPC870VR66 由 NXP Semiconductors 與 MPC875VR133 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC870VR66 | MPC875VR133 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | Obsolete |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC, MPC8xx | PowerQUICC, MPC8xx |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 |
| 資料匯流排寬度 | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | 176 MIPS |
| 工作電源電壓 | 3.3 V | — |
| 工作溫度範圍 | 0C to +95C | — |
| 封裝 / 外殼 | 256-BGA (PBGA), 23x23 mm | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS 狀態 | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Processor Type | MPC8xx PowerQUICC Communications Processor | — |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Core Frequency | — | 133 MHz |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| 工作溫度 | — | 0 °C to +95 °C |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |