10AS048H3F34I2LG - Arria 10 SX SoC FPGA 480K LE | Intel
MPN: 10AS048H3F34I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3680 | $36,800.00 |
| 100 | $3420 | $342,000.00 |
| 500 | $3180 | $1,590,000.00 |
| 1,000 | $2960 | $2,960,000.00 |
Drop-in alternatives for 10AS048H3F34I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048H3F34I2SG
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View Datasheet →10AS048H3F34E2LG
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View Datasheet →10AS048H2F34I2LG
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View Datasheet →10AS048H2F34I2SG
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View Datasheet →10AS048H2F34E2SG
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View Datasheet →10AS048H1F34I1HG
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View Datasheet →10AS048H3F34I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Process Technology | 20 nm |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Frequency | 1.5 GHz |
| Package | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Embedded Memory | Approximately 28.6 Mbits |
| DSP Blocks | Variable-precision, equivalent to 1,518 18x19 multipliers |
| Transceivers | 24 transceiver channels, up to 14.4 Gbps |
| Hard Memory Controller | DDR3/DDR4 SDRAM supported |
| Hard PCIe IP | PCIe Gen2/Gen3 |
| Operating Temperature | Industrial (-40C to +100C Tj) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Supply Voltage | 0.9 V core |
10AS048H3F34I2LG 1152-ball fc-fbga (f34), 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS048H3F34I2LG (1152-ball fc-fbga (f34), 35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H3F34I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H3F34I2LG is suitable for 6 applications: Wireless Baseband and Radio Units (RRU/RRH), ASIC Prototyping, Industrial Machine Vision and Image Processing, Broadcast Video Processing and Conversion, Defense and Aerospace Signal Processing, High-Performance Industrial Control and Test.
Wireless Baseband and Radio Units (RRU/RRH)
The 10AS048H3F34I2LG fits wireless RRU/RRH designs because its 24 transceivers support CPRI up to 14.4 Gbps with deterministic latency, while the HPS dual-core ARM Cortex-A9 runs the PHY control-plane and Linux on the same die. At 480K LE plus ~28.6 Mbits of embedded M20K SRAM, the fabric holds the channelizer, FFT, and digital predistortion blocks at line-rate without external memory pressure. Designers typically place the part between the antenna digitisers and the optical CPRI framer, with the HPS handling timing, synchronization via IEEE 1588, and the OAM software stack.
Recommended
ASIC Prototyping
ASIC prototyping is a strong fit because 480K LE plus ~1,518 18x19 multipliers and 24 high-speed transceivers map directly to most sub-25M ASIC gate designs. The HPS supplies an embedded control plane so that prototype drivers can be developed alongside the ASIC DUT logic, reducing bring-up time. Quartus Prime's TimeQuest timing analyzer and the partial reconfiguration flow let engineers iterate quickly when porting logic between FPGA and ASIC. The F34 1152-ball FC-FBGA footprint remains compatible across the 10AS032/048/066 density family, allowing in-place scaling as the design grows.
Recommended
Industrial Machine Vision and Image Processing
The 10AS048H3F34I2LG serves industrial machine-vision pipelines because its M20K SRAM and variable-precision DSP deliver low-latency filtering and feature extraction at full camera-line rate. The PCIe Gen3 hard IP, USB, and gigabit Ethernet on the HPS let the part interface to industrial cameras and host PCs simultaneously. Designers commonly run YOLOv3-tiny or classical CNN feature maps directly on the fabric, with the HPS orchestrating the camera trigger, illumination, and conveyor synchronization. The industrial temperature grade and robust 20 nm process are critical for 24/7 factory operation.
Recommended
Broadcast Video Processing and Conversion
Broadcast video processing and conversion (SMPTE ST 424 / ST 2081 / ST 2082) leverages the Arria 10 SX because of its high transceiver count and on-chip serializer/deserializer. The 10AS048H3F34I2LG can drive four 12G-SDI links at 12 Gbps, alongside embedded audio embedding and up/down/cross conversion, with the HPS handling the control plane, Ethernet tally, and SNMP. The fabric's M20K memory blocks store frame buffers without external SRAM overhead. Designers pair this part with HDMI 2.0 interfaces via external reclockers and frequently use it in master-control and contribution encoder chassis.
Recommended
Defense and Aerospace Signal Processing
The industrial temperature grade and the rugged FC-FBGA package suit defense and aerospace signal processing, including electronic-warfare EW, software-defined radio SDR, and radar pulse processing. 480K LE plus 24 transceivers offer the DSP density for adaptive beamforming and STAP algorithms, with the HPS running VxWorks or LynxOS for deterministic control. The Arria 10 SX family supports the wider Arria 10 GX military screening through Intel's Hi-Rel flow, and the same F34 footprint lets boards be qualified across commercial and rugged variants. Power dissipation in a sealed enclosure typically demands a cold plate or conduction-cooled heat sink.
Recommended
High-Performance Industrial Control and Test
High-performance industrial control and ATE (automatic test equipment) leverage the 10AS048H3F34I2LG because of its deterministic latency, PCIe Gen3 endpoint, and large DSP count for real-time signal conditioning. Engineers use the FPGA fabric to drive parallel DAC/ADC arrays while the HPS runs the Linux-based test sequencer, web UI, and EtherCAT master. The FC-FBGA package withstands the mechanical vibration of factory floors, and the industrial temperature grade ensures operation in unconditioned enclosures. Custom trigger and synchronization logic is implemented in hardware on the fabric for sub-microsecond jitter.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H3F34I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H3F34I2SG | 10AS048H3F34E2LG | 10AS048H2F34I2LG | 10AS048H2F34I2SG | 10AS048H2F34E2SG | 10AS048H1F34I1HG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (F34), 35x35 mm | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same | 1152-ball FC-FBGA (F34) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | 3 (highest Fmax) | 3 | 3 | 2 (10-15% lower Fmax) | 2 | 2 | 1 (slowest, ~20-30% lower Fmax) |
| Operating Temperature | Industrial (-40C to +100C Tj) | Industrial | Extended | Industrial | Industrial | Extended | Industrial |
| Transceiver Rate | Up to 14.4 Gbps | 14.4 Gbps | 14.4 Gbps | 12.5 Gbps typical at grade 2 | 12.5 Gbps typical | 12.5 Gbps typical | 10 Gbps typical |
| Tape-and-Reel Pin-1 | LG orientation | SG orientation | LG orientation | LG orientation | SG orientation | SG orientation | HG orientation |
| RoHS / Lead-Free | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Same F34 1152-ball footprint across all listed alternatives enables PCB reuse with zero re-spin (vs 10AS048H3F34I2SG)
- Speed grade 3 enables 14.4 Gbps transceivers and highest Fmax (vs 10AS048H2F34I2LG)
- Industrial temperature -40C to +100C Tj rating (vs 10AS048H3F34E2LG)
- Higher DSP and memory density than the 10AS032 family (vs 10AS032H3F34I3LG)
Design Notes
Estimated: at typical industrial RRU operating point with 80% LUT utilization and 16 active transceivers at 10 Gbps, the 10AS048H3F34I2LG dissipates approximately 30 W. Junction temperature must stay below 100 C industrial Tj, so the heatsink plus thermal-interface material should target a theta_JA below 2.5 C/W. A graphite TIM with a copper heatsink plus 200 LFM airflow is the standard reference design; for sealed enclosures a conduction-cooled cold plate is required. Use the Intel Early Power Estimator (EPE) spreadsheet for the actual post-place-and-route power before committing to mechanical.
The F34 1152-ball FC-FBGA at 1.0 mm ball pitch requires a high-density PCB stackup: minimum 14 layers with mixed 1-2-1 microvia structures to fan out from the inner-row balls. Per the Arria 10 Device Family Pin Connection Guidelines, all I/O banks must have local 0.1 uF + 1 uF + 10 uF decoupling within 100 mil of the package balls, and each transceiver channel requires a 22 nF AC-coupling cap within 250 mil. Length-match the transceiver pairs to within 5 mil for 14 Gbps operation; use Intel's transceiver toolkit to verify. Reference schematics for the F34 package are available under NDA from Intel's Customer Design Center.
Three pitfalls appear repeatedly on first-time Arria 10 SX designs. First, HPS power sequencing: the HPS rails (1.0 V, 1.5 V, 3.3 V) must ramp before the FPGA core to avoid latch-up - read the Power Management section of the Arria 10 SoC datasheet and use a PMIC with explicit sequence control. Second, configuration: the HPS boots from QSPI flash and the FPGA fabric boots from a separate flash, but they can share a single QSPI if the pinout allows - verify the dual-image setup in the Quartus Prime Bootloader tool. Third, do not assume Intel-recommended transmitter settings for non-Intel PHY devices - the Arria 10 VOD, pre-emphasis, and equalization must be re-tuned per link.
Place the 10AS048H3F34I2LG in the centre of the PCB so all I/O banks can be routed with a single microvia stackup. Top and bottom layers should be reserved for short local signals and decoupling only. Transceiver channels should exit on the same edge of the package to keep the AC-coupling caps and external PHY in a single cluster; crossing channels across the package causes routing congestion and degrades signal integrity at 14 Gbps. Reference Intel's F34 package pinout diagram from the Arria 10 Device Family Pin Connection Guidelines, then freeze the pinout before schematic capture to avoid costly board re-spins.
Compliance Information
RoHS and REACH compliant per Intel product environmental disclosure. Lead-free SAC405 ball finish. AEC-Q100 not applicable because this is an industrial-temp FPGA, not an automotive-qualified device.
