10AS048H3F34I2SG - Arria 10 SX 480K LE SoC FPGA 1152-FBGA | Intel
MPN: 10AS048H3F34I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4100 | $41,000.00 |
| 100 | $3850 | $385,000.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3450 | $3,450,000.00 |
Drop-in alternatives for 10AS048H3F34I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AS048H3F34I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Clock | 1.5 GHz |
| Package | 1152-ball FC-FBGA (35x35 mm), F34 speed grade |
| Transceivers | Up to 24 GXS channels |
| Transceiver Data Rate | Up to 17.4 Gbps |
| Memory Controller | Hard DDR4/DDR3 with ECC |
| Temperature Grade | Industrial (-40C to +100C) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
10AS048H3F34I2SG 1152-ball fc-fbga (35x35 mm), f34 speed grade Pin Configuration Guide
Complete pinout information for 10AS048H3F34I2SG (1152-ball fc-fbga (35x35 mm), f34 speed grade package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H3F34I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H3F34I2SG is suitable for 6 applications: 4K/8K Video Broadcast Processing, Industrial Machine Vision Systems, 5G Fronthaul CPRI Aggregation, Radar and Electronic Warfare DSP Front-End, Medical Imaging Accelerator (CT/MRI Reconstruction), High-Performance Embedded Compute Platform.
4K/8K Video Broadcast Processing
The 10AS048H3F34I2SG's 480K logic elements and 24 GXS transceivers at 17.4 Gbps make it ideal for 4K/8K video broadcast pipelines requiring real-time compression and multi-channel aggregation. With up to 384 variable-precision DSP blocks, the device can implement H.265/HEVC encoding or deinterlacing at broadcast frame rates without external coprocessors. Placed between SDI ingest and 10GbE output, it consolidates framing, FEC, and IP encapsulation in a single device. According to the Arria 10 SX device overview, the dual ARM Cortex-A9 HPS at 1.5 GHz runs a Linux control plane for stream management while the FPGA fabric handles deterministic video data paths. Compared with CPU-only broadcast servers, the integrated DSP fabric reduces latency by an order of magnitude at lower power per channel.
Recommended
Industrial Machine Vision Systems
The 10AS048H3F34I2SG fits industrial machine vision with its high DSP count, 17.4 Gbps transceivers for CoaXPress or Camera Link HS, and industrial -40C to +100C temperature grade. The hard DDR4 controller supports multi-camera frame buffering at 4K resolution without soft memory IP. Placed between image sensors and host PC via 10GbE, it performs real-time defect detection inference using FPGA-accelerated CNN layers. The ARM Cortex-A9 HPS runs a Linux-based vision pipeline manager and triggers PLC integration over PROFINET or EtherCAT. According to Arria 10 industrial documentation, the I2 temperature suffix guarantees operation at 100C ambient in sealed factory enclosures. Compared with GPU-based vision systems, the Arria 10 SX delivers deterministic sub-frame latency for high-speed inspection lines.
Recommended
5G Fronthaul CPRI Aggregation
The 10AS048H3F34I2SG targets 5G fronthaul with up to 24 GXS transceivers at 17.4 Gbps supporting CPRI option 7-9 rates for radio unit aggregation. The 480K LE fabric handles CPRI deframing, IQ data routing, and eCPRI packet processing for centralized RAN architectures. The dual ARM Cortex-A9 HPS runs a Linux-based O-RAN compatible management plane while the FPGA fabric processes the deterministic PHY layer. According to Arria 10 SX telecom datasheets, the F34 speed grade meets strict CPRI jitter requirements. Placed between multiple RRUs and a baseband unit, it consolidates 8-12 radio streams at lower power than discrete FPGA + CPU solutions.
Recommended
Radar and Electronic Warfare DSP Front-End
The 10AS048H3F34I2SG serves radar and EW front-end processing with its variable-precision DSP blocks and high-memory bandwidth from 28 Mbits embedded SRAM. The F34 speed grade enables high-sample-rate pulse-Doppler processing at multi-hundred MHz clock rates. Placed between ADCs and a signal processor, it performs channelization, MTI filtering, and beamforming in FPGA fabric while the Cortex-A9 HPS runs the threat library and operator interface. According to Intel defense-grade documentation, the Arria 10 SX meets typical military temperature ranges with appropriate derating. Compared with ASIC-based radar processors, the SoC FPGA enables late-binding algorithm updates critical for evolving threat scenarios.
Recommended
Medical Imaging Accelerator (CT/MRI Reconstruction)
The 10AS048H3F34I2SG supports CT and MRI reconstruction with high DSP throughput and hard PCIe Gen3 x8 IP for host system integration. The 480K LE fabric accelerates back-projection and iterative reconstruction algorithms at sub-second frame times required for interventional imaging. Placed between detector arrays and the diagnostic workstation, it offloads FBP or model-based reconstruction. The dual ARM Cortex-A9 HPS runs patient-side control software with IEC 62304 lifecycle compliance. According to Arria 10 medical reference designs, the I2 industrial temperature grade supports controlled medical equipment environments. Compared with GPU reconstruction farms, a single Arria 10 SX delivers comparable throughput at lower power and latency.
Recommended
High-Performance Embedded Compute Platform
The 10AS048H3F34I2SG serves as a heterogeneous compute platform combining ARM Cortex-A9 software processing with FPGA fabric acceleration. Linux runs on the HPS while FPGA fabric handles data-plane accelerators such as compression, encryption, or custom DSP. The 17.4 Gbps transceivers enable direct attachment to NVMe storage or 100GbE networks. Placed on a COM Express or custom carrier board, it serves industrial PC, edge server, or test equipment applications. According to Arria 10 SX embedded documentation, the HPS peripherals include USB, Gigabit Ethernet, SATA, and CAN for broad system integration. Compared with x86 + FPGA discrete boards, the integrated SoC reduces board area by 30-40% and improves processor-to-fabric bandwidth.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H3F34I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H2F34I2SG | 10AS048H3F34I2LG | 10AS048H1F34I1HG | 10AS048H3F34E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (35x35 mm) | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same |
| Speed Grade | H3 (fastest) | H2 | H3 | H1 | H3 |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Enhanced |
| Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Solder Ball | Leaded (SnPb) | Leaded | Lead-free | Lead-free | Leaded |
| Approx Unit Price (qty 1) | $4,250 | $3,950 | $4,250 | $3,650 | $4,400 |
Key Differentiators
- Fastest H3 speed grade in same package (vs 10AS048H2F34I2SG)
- Industrial temperature with same H3 speed (vs 10AS048H3F34E2SG)
- Integrates ARM Cortex-A9 HPS eliminating external MCU (vs Cyclone V SX or discrete FPGA + MCU)
- Hard PCIe Gen3 x8 and 10GbE MAC IP (vs Soft IP implementations)
Design Notes
The 1152-ball FC-FBGA package at 1.0 mm pitch requires a 12-layer or thicker PCB with laser-drilled microvias (stacked via preferred for BGA breakouts). Use a 1-2-1 via-in-pad structure with filled and plated-over vias to minimize inductance for the 0.9V core supply. Estimated: with 12 layers at 0.2 mm each and 1 oz copper, total board thickness is approximately 2.4 mm. Reference Intel's Arria 10 SX FPGA pin connection guidelines for the recommended BGA fanout pattern.
Estimated: at full logic utilization (480K LE) with 25% toggle rate and 1.5 GHz HPS active, the Arria 10 SX F34 dissipates approximately 25-30 W requiring a thermal management solution. Theta_JB is approximately 0.5 C/W with the exposed-die FC-FBGA package, so attach a heatsink with thermal interface material rated for at least 4 W/mK. For sealed industrial enclosures, consider a heat-spreader plate rather than relying solely on convection. Use the Arria 10 PowerPlay early power estimator tool to refine the thermal design before PCB layout.
The 17.4 Gbps GXS transceivers require matched-length differential pairs with skew under 1 ps per inch and continuous reference planes on adjacent layers. Use a 100-ohm differential impedance with 85-ohm common-mode for the transceiver channels. Place DC-blocking capacitors within 5 mm of the transmitter balls. The reference clock must be a low-jitter oscillator (under 100 fs RMS) such as a SiTime or Skyworks device to meet CPRI/10GbE jitter masks. Avoid routing high-speed lanes across power plane splits.
Estimated: the 0.9V core rail can draw up to 20 A at full utilization, requiring a buck regulator capable of at least 25 A continuous with 25 A peak. Place input bulk capacitors (470 uF polymer or 22 uF ceramic per phase) within 10 mm of the BGA power balls. The HPS has separate 0.9V VCC_HPS and 1.8V/3.3V auxiliary rails that must be sequenced per Intel's power management guidelines. Use the Arria 10 LX daughter card reference design as a starting point for the power tree.
Do not assume the F34 speed grade can be downgraded to F31 or H2 without re-running timing closure — critical paths at H3 may fail at slower grades. Do not enable the Cortex-A9 HPS without first programming the boot ROM and clock manager. Do not omit the POR (power-on-reset) supervisor — Intel recommends a TPS3808-style supervisor with 100 ms delay for proper HPS boot. Do not use lead-free solder balls (LG suffix) on a reflow profile designed for leaded (SG suffix) — peak temperature and dwell time differ.
Compliance Information
SG suffix indicates leaded solder balls (SnPb); for lead-free choose LG suffix. RoHS compliance depends on LG suffix selection. AEC-Q100 not applicable for FPGAs; industrial temp grade covers automotive-adjacent applications.
