10AX115U2F45I2LG - Arria 10 GX FPGA 1.15M LE | Intel | 1932-FCBGA
Teilenummer: 10AX115U2F45I2LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $13905.75 | $13.905,75 |
| 10 | $13210.46 | $132.104,60 |
| 100 | $11820.89 | $1.182.089,00 |
| 500 | $10429.31 | $5.214.655,00 |
| 1.000 | $9589.87 | $9.589.870,00 |
10AX115U2F45I2LG Übersicht
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O can be configured after manufacture to implement arbitrary digital circuits ranging from glue logic to complete system-on-chip subsystems. The Arria 10 GX family is part of Intel's mid-range, transceiver-rich FPGA portfolio, offering hard PCI Express Gen3 and Gen2 hard IP blocks, 10-Gbps and 12.5-Gbps transceivers, hardened floating-point DSP blocks, and an ARM Cortex-A9 hard processor subsystem option, placing the Arria 10 GX hierarchically between low-cost Cyclone/MAX families and high-end Stratix families within Intel's programmable logic portfolio.
Key specifications include 1,150,000 logic elements, 68,857,856 bits of embedded SRAM distributed across M20K blocks and MLABs, 1,518 DSP blocks for fixed- and floating-point arithmetic, 24 transceivers supporting up to 12.5 Gbps data rates, 4 PCIe hard IP blocks up to Gen3 x8, 8 fractional PLLs, and 480 general-purpose user I/O pins distributed across 12 I/O banks. The 1932-ball FCBGA package uses Intel's flip-chip BGA technology with a 45mm body size and a 1.0mm ball pitch, providing high-density interconnect for high-pin-count designs.
Architecturally, the Arria 10 GX uses Intel's Adaptive Logic Module (ALM) as its basic logic unit, an 8-input fracturable LUT that supports efficient implementation of wide combinational and arithmetic functions. The 20nm process enables higher integration and lower power than the previous 28nm Arria V family, while the hard IP blocks for PCIe, memory controllers, and DSP deliver deterministic latency without consuming soft logic resources.
Typical applications include high-throughput digital signal processing (radar, beamforming, medical imaging), high-speed serial protocol bridging (PCIe Gen3, 10G Ethernet, CPRI, JESD204B/C), video broadcast and pro-AV processing, ASIC prototyping, and embedded vision. The combination of integrated transceivers, hardened PCIe, and abundant DSP makes the Arria 10 GX particularly well-suited to latency-sensitive systems where determinism matters more than absolute peak throughput.
When designing with this device, engineers must plan for the substantial power and thermal envelope of a 1.15M-LE FPGA with 24 active transceivers. A multi-layer PCB with continuous ground and power planes, dedicated transceiver reference clock distribution, and a robust thermal solution (heatsink plus airflow) is mandatory. Designers should also use Intel Quartus Prime software for synthesis, place-and-route, and timing closure; signal integrity of the 12.5-Gbps links requires controlled-impedance PCB stackup and length-matched routing.
This page synthesizes distributor inventory, real-time pricing, same-family drop-in alternatives from the Arria 10 GX lineup, and practical design considerations not consolidated on a single distributor or manufacturer page.
Drop-in-Alternativen für 10AX115U2F45I2LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX115U2F45I2LG (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Process Technology, DSP Blocks, Operating Temperature Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX115U2F45I2SG
✅ Drop-In✓ Auf Lager
$8902.49 / Stück
Datenblatt ansehen →10AX115U2F45E2LG
✅ Drop-In✓ Auf Lager
$7380 / Stück
Datenblatt ansehen →10AX115U2F45E2SG
✅ Drop-In✓ Auf Lager
$6920.66 / Stück
Datenblatt ansehen →10AX115U2F45I1SG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →10AX090U2F45I2LG
✅ Drop-In✓ Auf Lager
$7957.34 / Stück
Datenblatt ansehen →10AX115U2F45I2LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits |
| DSP Blocks | 1,518 |
| User I/O Count | 480 |
| Transceiver Count | 24 |
| Transceiver Data Rate | Up to 12.5 Gbps |
| PCIe Hard IP Blocks | 4 (up to Gen3 x8) |
| Fractional PLLs | 8 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Gehäuse | 1932-ball FCBGA (F45) |
| Package Body Size | 45 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Speed Grade | 2 (moderate) |
10AX115U2F45I2LG 45 mm Pinbelegungsleitfaden
Pinbelegung für 10AX115U2F45I2LG (45 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AX115U2F45I2LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AX115U2F45I2LG ist geeignet für 6 Anwendungs: High-Throughput Digital Signal Processing, PCIe Gen3 Accelerator Card, 10G Ethernet / Network Interface Card, Video Broadcast and Pro-AV Processing, Wireless Baseband and Fronthaul (CPRI / eCPRI), ASIC Prototyping and Emulation.
High-Throughput Digital Signal Processing
The 10AX115U2F45I2LG is well-suited to high-throughput DSP designs such as radar baseband processing, beamforming, and medical imaging reconstruction. The device offers 1,518 DSP blocks supporting both fixed-point and single-precision floating-point arithmetic at hundreds of GMACs, while 68.86 Mbits of embedded SRAM lets designers stage coefficients and intermediate samples without external memory round-trips. With 1.15M logic elements, complex multi-channel FFT and FIR pipelines fit comfortably on a single device, and the industrial temperature grade supports deployment in outdoor radar enclosures and factory-floor imaging equipment.
Empfohlen
PCIe Gen3 Accelerator Card
The 10AX115U2F45I2LG integrates 4 hard PCIe IP blocks up to Gen3 x8, making it an ideal endpoint or root-complex for accelerator cards that connect to host CPUs over PCIe Gen3. Hard PCIe IP delivers deterministic latency and saves soft logic that would otherwise be consumed by a soft PCIe core, freeing the 1.15M LE fabric for user accelerator logic. The 24 transceivers can simultaneously carry PCIe lanes plus 10 Gigabit Ethernet or CPRI links for backhaul, enabling single-FPGA compute+IO cards for data-center and 5G fronthaul applications. Industrial temperature grade supports deployment in non-controlled environments.
Empfohlen
10G Ethernet / Network Interface Card
For 10 Gigabit Ethernet and 40G Ethernet NIC designs, the 10AX115U2F45I2LG provides 24 transceivers at up to 12.5 Gbps that map directly to 10G SFP+ channels or 40G QSFP+ breakout configurations. Hard 10G MAC IP blocks, hardened memory controllers for DDR3/DDR4, and 1,518 DSP blocks combine to handle line-rate packet processing and on-chip traffic shaping without external processors. With 480 user I/O pins across 12 banks, multi-port NIC designs can fan out to multiple SFP+ cages, and industrial temperature grade supports carrier-grade and outdoor networking equipment.
Empfohlen
Video Broadcast and Pro-AV Processing
The 10AX115U2F45I2LG's combination of 1.15M logic elements, 1,518 DSP blocks, and 480 user I/O makes it a strong fit for professional video processing - 4K/8K up/down/cross-conversion, multi-viewer compositing, and ST 2110 / ST 2022-6 IP video gateway designs. Hard transceiver IP supports 12G-SDI and 10G Ethernet ST 2110 streams simultaneously, while embedded SRAM absorbs line buffers and frame-store memory at line rate. Industrial temperature grade enables deployment in broadcast studio and outdoor event production gear.
Empfohlen
Wireless Baseband and Fronthaul (CPRI / eCPRI)
Wireless infrastructure baseband and fronthaul processing benefit from the 10AX115U2F45I2LG's 24 transceivers supporting CPRI up to 9.8 Gbps and emerging eCPRI over 10G/25G Ethernet. The 1,518 DSP blocks accelerate channel coding (LDPC, turbo), FFT/iFFT for OFDM, and digital predistortion, while 68.86 Mbits of SRAM holds soft-decision buffers. Industrial temperature grade supports deployment in outdoor small-cell and macro-cell base-station enclosures, and 480 user I/O allows direct interface to RF front-end ADCs/DACs without bridge ASICs.
Empfohlen
ASIC Prototyping and Emulation
The 10AX115U2F45I2LG with 1.15M logic elements is well-suited to ASIC prototyping and emulation, where multiple FPGAs are partitioned via transceivers to map large SoC designs. The 24 transceivers at up to 12.5 Gbps provide high-bandwidth chip-to-chip links for partitioned designs, and the rich embedded memory supports realistic cache and FIFO behavior. Industrial temperature grade also supports in-vehicle and outdoor prototyping rigs. For very large ASICs, multiple 10AX115U2F45I2LG devices can be co-emulated with multi-FPGA partitioning tools in Intel Quartus Prime.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX115U2F45I2LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX115U2F45I2SG | 10AX115U2F45E2LG | 10AX115U2F45E2SG | 10AX115U2F45I1SG | 10AX090U2F45I2LG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Speed Grade | 2 | 2 | 2 | 2 | 1 (faster) | 2 |
| Temperature Grade | Industrial | Industrial | Commercial | Commercial | Industrial | Industrial |
| Terminal Finish | Lead-free (RoHS) | Standard (non-RoHS) | Lead-free (RoHS) | Standard | Standard | Lead-free (RoHS) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 53,560,320 bits (-22%) |
| Transceivers | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) |
Wichtigste Unterscheidungsmerkmale
- True drop-in compatibility within the Arria 10 GX F45 package family (vs. 10AX115U2F45I2SG)
- Full 1.15M-LE logic density at the F45 package's I/O complement (vs. 10AX090U2F45I2LG)
- Industrial temperature grade while maintaining speed grade 2 cost (vs. 10AX115U2F45I1SG)
Designhinweise
Estimated: A 1.15M-LE Arria 10 GX device with 24 active 12.5-Gbps transceivers can dissipate 25-40 W depending on utilization. Designers should plan for a heatsink plus 1-2 m/s airflow for industrial-temperature (-40C to +100C) operation. The 1932-FCBGA package exposes a large thermal pad that must be soldered to a continuous ground plane on the top PCB layer with 9+ thermal vias to inner copper layers. Use the Intel Quartus Prime power analyzer early in the design cycle to refine thermal budgeting.
The 1.0mm ball pitch on the 1932-FCBGA requires a high-density-interconnect (HDI) PCB build with laser-drilled microvias, or sequential lamination with stacked microvias. All 480 user I/O plus 24 high-speed transceiver channels must be routed on inner or outer microvia layers with controlled impedance (100 ohm differential for transceivers, 50 ohm single-ended for general I/O). Use Intel's device pin-out file and IBIS-AMI models for SI simulation of all 12.5-Gbps links.
The Arria 10 GX requires multiple power rails: 0.9V core, 1.1V transceiver, 1.8V/2.5V/3.0V I/O banks, and a 1.8V/3.3V configuration voltage. Use the Intel Enpirion or compatible power supply reference design; the 0.9V core rail in particular requires high-current (20-40 A) point-of-load regulation with tight (<2%) tolerance and sub-milliohm PCB distribution. Decoupling must follow the Intel power distribution network (PDN) guideline with bulk, mid-frequency, and high-frequency capacitors placed as close to the balls as the PCB stackup allows.
Do not mix speed grades within a multi-FPGA design without re-running timing analysis - speed grade 2 (-2) and speed grade 1 (-1) devices have measurably different Fmax values. Also confirm configuration mode (AS, JTAG, FPP) and configuration flash density against your chosen boot scheme early in the design; the Arria 10 GX requires a specific configuration controller IP that must be instantiated in the design. Finally, always check the Intel PCN database before finalizing the PCB layout, as BGA pin maps for new revisions occasionally shift.
The 12.5-Gbps transceivers require careful PCB stackup planning: use low-loss PCB material (e.g. Megtron 6, FR4-408HR for short reach), maintain 100 ohm differential impedance with length-matched +/-5 mil pairs, and isolate high-speed channels from noisy digital and power layers. Reference clock distribution must use a low-jitter clock buffer and matched-length routing; jitter from reference clocks directly degrades transceiver eye margin. Intel provides pin planner tools in Quartus Prime that auto-generate length-matched transceiver channel pin assignments.
Compliance-Informationen
RoHS compliant per LG terminal finish designator. Industrial temperature grade per 'I' designator. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC in the AEC sense; Intel FPGAs are qualified under different industrial standards.