10AX115U2F45I2LG - Arria 10 GX FPGA 1.15M LE | Intel | 1932-FCBGA
MPN: 10AX115U2F45I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13905.75 | $13,905.75 |
| 10 | $13210.46 | $132,104.60 |
| 100 | $11820.89 | $1,182,089.00 |
| 500 | $10429.31 | $5,214,655.00 |
| 1,000 | $9589.87 | $9,589,870.00 |
Drop-in alternatives for 10AX115U2F45I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U2F45I2SG
✅ Drop-In✓ In Stock
$8902.49 / Unit
View Datasheet →10AX115U2F45E2LG
✅ Drop-In✓ In Stock
$7380 / Unit
View Datasheet →10AX115U2F45E2SG
✅ Drop-In✓ In Stock
$6920.66 / Unit
View Datasheet →10AX115U2F45I1SG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10AX090U2F45I2LG
✅ Drop-In✓ In Stock
$7957.34 / Unit
View Datasheet →10AX115U2F45I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits |
| DSP Blocks | 1,518 |
| User I/O Count | 480 |
| Transceiver Count | 24 |
| Transceiver Data Rate | Up to 12.5 Gbps |
| PCIe Hard IP Blocks | 4 (up to Gen3 x8) |
| Fractional PLLs | 8 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1932-ball FCBGA (F45) |
| Package Body Size | 45 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Speed Grade | 2 (moderate) |
10AX115U2F45I2LG 45 mm Pin Configuration Guide
Complete pinout information for 10AX115U2F45I2LG (45 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U2F45I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U2F45I2LG is suitable for 6 applications: High-Throughput Digital Signal Processing, PCIe Gen3 Accelerator Card, 10G Ethernet / Network Interface Card, Video Broadcast and Pro-AV Processing, Wireless Baseband and Fronthaul (CPRI / eCPRI), ASIC Prototyping and Emulation.
High-Throughput Digital Signal Processing
The 10AX115U2F45I2LG is well-suited to high-throughput DSP designs such as radar baseband processing, beamforming, and medical imaging reconstruction. The device offers 1,518 DSP blocks supporting both fixed-point and single-precision floating-point arithmetic at hundreds of GMACs, while 68.86 Mbits of embedded SRAM lets designers stage coefficients and intermediate samples without external memory round-trips. With 1.15M logic elements, complex multi-channel FFT and FIR pipelines fit comfortably on a single device, and the industrial temperature grade supports deployment in outdoor radar enclosures and factory-floor imaging equipment.
Recommended
PCIe Gen3 Accelerator Card
The 10AX115U2F45I2LG integrates 4 hard PCIe IP blocks up to Gen3 x8, making it an ideal endpoint or root-complex for accelerator cards that connect to host CPUs over PCIe Gen3. Hard PCIe IP delivers deterministic latency and saves soft logic that would otherwise be consumed by a soft PCIe core, freeing the 1.15M LE fabric for user accelerator logic. The 24 transceivers can simultaneously carry PCIe lanes plus 10 Gigabit Ethernet or CPRI links for backhaul, enabling single-FPGA compute+IO cards for data-center and 5G fronthaul applications. Industrial temperature grade supports deployment in non-controlled environments.
Recommended
10G Ethernet / Network Interface Card
For 10 Gigabit Ethernet and 40G Ethernet NIC designs, the 10AX115U2F45I2LG provides 24 transceivers at up to 12.5 Gbps that map directly to 10G SFP+ channels or 40G QSFP+ breakout configurations. Hard 10G MAC IP blocks, hardened memory controllers for DDR3/DDR4, and 1,518 DSP blocks combine to handle line-rate packet processing and on-chip traffic shaping without external processors. With 480 user I/O pins across 12 banks, multi-port NIC designs can fan out to multiple SFP+ cages, and industrial temperature grade supports carrier-grade and outdoor networking equipment.
Recommended
Video Broadcast and Pro-AV Processing
The 10AX115U2F45I2LG's combination of 1.15M logic elements, 1,518 DSP blocks, and 480 user I/O makes it a strong fit for professional video processing - 4K/8K up/down/cross-conversion, multi-viewer compositing, and ST 2110 / ST 2022-6 IP video gateway designs. Hard transceiver IP supports 12G-SDI and 10G Ethernet ST 2110 streams simultaneously, while embedded SRAM absorbs line buffers and frame-store memory at line rate. Industrial temperature grade enables deployment in broadcast studio and outdoor event production gear.
Recommended
Wireless Baseband and Fronthaul (CPRI / eCPRI)
Wireless infrastructure baseband and fronthaul processing benefit from the 10AX115U2F45I2LG's 24 transceivers supporting CPRI up to 9.8 Gbps and emerging eCPRI over 10G/25G Ethernet. The 1,518 DSP blocks accelerate channel coding (LDPC, turbo), FFT/iFFT for OFDM, and digital predistortion, while 68.86 Mbits of SRAM holds soft-decision buffers. Industrial temperature grade supports deployment in outdoor small-cell and macro-cell base-station enclosures, and 480 user I/O allows direct interface to RF front-end ADCs/DACs without bridge ASICs.
Recommended
ASIC Prototyping and Emulation
The 10AX115U2F45I2LG with 1.15M logic elements is well-suited to ASIC prototyping and emulation, where multiple FPGAs are partitioned via transceivers to map large SoC designs. The 24 transceivers at up to 12.5 Gbps provide high-bandwidth chip-to-chip links for partitioned designs, and the rich embedded memory supports realistic cache and FIFO behavior. Industrial temperature grade also supports in-vehicle and outdoor prototyping rigs. For very large ASICs, multiple 10AX115U2F45I2LG devices can be co-emulated with multi-FPGA partitioning tools in Intel Quartus Prime.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U2F45I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U2F45I2SG | 10AX115U2F45E2LG | 10AX115U2F45E2SG | 10AX115U2F45I1SG | 10AX090U2F45I2LG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Speed Grade | 2 | 2 | 2 | 2 | 1 (faster) | 2 |
| Temperature Grade | Industrial | Industrial | Commercial | Commercial | Industrial | Industrial |
| Terminal Finish | Lead-free (RoHS) | Standard (non-RoHS) | Lead-free (RoHS) | Standard | Standard | Lead-free (RoHS) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 53,560,320 bits (-22%) |
| Transceivers | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) | 24 (up to 12.5 Gbps) |
Key Differentiators
- True drop-in compatibility within the Arria 10 GX F45 package family (vs 10AX115U2F45I2SG)
- Full 1.15M-LE logic density at the F45 package's I/O complement (vs 10AX090U2F45I2LG)
- Industrial temperature grade while maintaining speed grade 2 cost (vs 10AX115U2F45I1SG)
Design Notes
Estimated: A 1.15M-LE Arria 10 GX device with 24 active 12.5-Gbps transceivers can dissipate 25-40 W depending on utilization. Designers should plan for a heatsink plus 1-2 m/s airflow for industrial-temperature (-40C to +100C) operation. The 1932-FCBGA package exposes a large thermal pad that must be soldered to a continuous ground plane on the top PCB layer with 9+ thermal vias to inner copper layers. Use the Intel Quartus Prime power analyzer early in the design cycle to refine thermal budgeting.
The 1.0mm ball pitch on the 1932-FCBGA requires a high-density-interconnect (HDI) PCB build with laser-drilled microvias, or sequential lamination with stacked microvias. All 480 user I/O plus 24 high-speed transceiver channels must be routed on inner or outer microvia layers with controlled impedance (100 ohm differential for transceivers, 50 ohm single-ended for general I/O). Use Intel's device pin-out file and IBIS-AMI models for SI simulation of all 12.5-Gbps links.
The Arria 10 GX requires multiple power rails: 0.9V core, 1.1V transceiver, 1.8V/2.5V/3.0V I/O banks, and a 1.8V/3.3V configuration voltage. Use the Intel Enpirion or compatible power supply reference design; the 0.9V core rail in particular requires high-current (20-40 A) point-of-load regulation with tight (<2%) tolerance and sub-milliohm PCB distribution. Decoupling must follow the Intel power distribution network (PDN) guideline with bulk, mid-frequency, and high-frequency capacitors placed as close to the balls as the PCB stackup allows.
Do not mix speed grades within a multi-FPGA design without re-running timing analysis - speed grade 2 (-2) and speed grade 1 (-1) devices have measurably different Fmax values. Also confirm configuration mode (AS, JTAG, FPP) and configuration flash density against your chosen boot scheme early in the design; the Arria 10 GX requires a specific configuration controller IP that must be instantiated in the design. Finally, always check the Intel PCN database before finalizing the PCB layout, as BGA pin maps for new revisions occasionally shift.
The 12.5-Gbps transceivers require careful PCB stackup planning: use low-loss PCB material (e.g. Megtron 6, FR4-408HR for short reach), maintain 100 ohm differential impedance with length-matched +/-5 mil pairs, and isolate high-speed channels from noisy digital and power layers. Reference clock distribution must use a low-jitter clock buffer and matched-length routing; jitter from reference clocks directly degrades transceiver eye margin. Intel provides pin planner tools in Quartus Prime that auto-generate length-matched transceiver channel pin assignments.
Compliance Information
RoHS compliant per LG terminal finish designator. Industrial temperature grade per 'I' designator. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC in the AEC sense; Intel FPGAs are qualified under different industrial standards.
