10AX115U2F45I1SG - Arria 10 GX 1.15M LE FPGA | Intel
MPN: 10AX115U2F45I1SG ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
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Drop-in alternatives for 10AX115U2F45I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115U2F45I2SG
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View Datasheet →10AX115U2F45E1SG
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View Datasheet →10AX115U2F45E2SG
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View Datasheet →10AX115U2F45E2LG
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View Datasheet →10AX115U1F45I1SG
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View Datasheet →10AX115U2F45I1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits |
| User I/O Count | 480 |
| Transceivers | Up to 96 channels, up to 17.4 Gbps |
| Hard Memory Controller | DDR4 / DDR3 / LPDDR3 |
| Hard PCIe | Gen3 x8 (hard IP) |
| Process Node | 20 nm Tri-Gate |
| Core Voltage | 0.87 V to 0.98 V (SmartVID) |
| Speed Grade | -1 (slowest in Arria 10 GX family) |
| Temperature Grade | Industrial (-40C to +100C TJ) |
| Package | 1932-ball FCBGA, 45 x 45 mm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free) |
10AX115U2F45I1SG 1932-ball fcbga, 45 x 45 mm Pin Configuration Guide
Complete pinout information for 10AX115U2F45I1SG (1932-ball fcbga, 45 x 45 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U2F45I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U2F45I1SG is suitable for 7 applications: 100G/400G Optical Transport Line Cards, Wireless Baseband and Radio Card Processing, Military Radar and Electronic Warfare, ASIC Prototyping and Emulation, Broadcast and Professional Video Processing, High-Performance Computing and Hardware Acceleration, Test and Measurement Instrumentation.
100G/400G Optical Transport Line Cards
The 10AX115U2F45I1SG fits 100G optical line cards because it integrates up to 96 transceiver channels capable of 17.4 Gbps, enough to bond into 4x25.78G CAUI-4 or KP4 FEC lanes. Its 1,150,000 LE plus hard floating-point DSP blocks implement OTN framing, MACsec, and soft-decision FEC at line rate. Designers place the device on a 16+ layer PCB with via-in-pad and use the hard PCIe Gen3 IP for backplane connectivity.
Recommended
Wireless Baseband and Radio Card Processing
The 10AX115U2F45I1SG supports wireless baseband designs by pairing its 17.4 Gbps transceivers (CPRI/OBSAI fronthaul) with abundant floating-point DSP for LTE/NR PHY layer functions. The 480 user I/O accept parallel RF ADC/DAC interfaces, while SmartVID reduces platform power when traffic is light. Industrial temperature grade allows outdoor radio unit deployment.
Recommended
Military Radar and Electronic Warfare
Defense radar systems leverage the 10AX115U2F45I1SG's combination of high DSP throughput, high I/O count, and industrial temperature grade for signal-processing-intensive designs. Its 17.4 Gbps transceivers carry digitized antenna data, while the 1,150,000 LE implement pulse compression, MTI filtering, and beamforming. Industrial -40C to +100C junction handles outdoor and avionics environments.
Recommended
ASIC Prototyping and Emulation
The 10AX115U2F45I1SG's 1,150,000 LE make it well-suited to ASIC prototyping and large emulation platforms, where multiple FPGAs are stitched together over high-speed serial links. Its 17.4 Gbps transceivers serve as chip-to-chip interconnect, and the hard DDR4 controller accepts large capacity memory for shadow/test data. Quartus Prime supports multi-FPGA partitioning flows for this use case.
Recommended
Broadcast and Professional Video Processing
Broadcast video routers and processors rely on the 10AX115U2F45I1SG's 480 user I/O plus 17.4 Gbps transceivers to handle uncompressed SDI (SMPTE ST 2082, ST 425) and emerging SMPTE ST 2110 IP-based video. Industrial temperature supports broadcast equipment room cooling limits. The 68 Mbit embedded buffer memory is sufficient for line-level picture processing without external DDR.
Recommended
High-Performance Computing and Hardware Acceleration
Data-center compute accelerators pair the 10AX115U2F45I1SG with x86 host CPUs over PCIe Gen3 x8 hard IP for tasks like genomics, financial analytics, and AI inference. The floating-point DSP blocks accelerate matrix math, and SmartVID minimizes power when idle. Industrial temperature grade supports server inlet air profiles up to ~55C ambient.
Recommended
Test and Measurement Instrumentation
High-end test gear such as protocol analyzers and oscilloscope front-ends use the 10AX115U2F45I1SG for its combination of 17.4 Gbps transceivers (capturing PCIe Gen3, USB 3.1, DisplayPort) and abundant logic for inline protocol decoding. The industrial temperature grade ensures calibration stability. SmartVID plus rich clocking PLL resources simplify multi-domain timing.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U2F45I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U2F45I2SG | 10AX115U2F45E1SG | 10AX115U2F45E2SG | 10AX115U2F45E2LG | 10AX115U1F45I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA 45x45 mm (F45) | 1932-ball FCBGA 45x45 mm (F45) - same | 1932-ball FCBGA 45x45 mm (F45) - same | 1932-ball FCBGA 45x45 mm (F45) - same | 1932-ball FCBGA 45x45 mm (F45) - same | 1932-ball FCBGA 45x45 mm (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 - same | 1,150,000 - same | 1,150,000 - same | 1,150,000 - same | 1,150,000 - same |
| User I/O | 480 | 480 - same | 480 - same | 480 - same | 480 - same | 480 - same |
| Speed Grade | -1 | -2 (10-15% faster) | -1 - same | -2 | -2 | -1 - same |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial - same | Extended / Commercial | Extended / Commercial | Extended / Commercial | Industrial - same |
| Core Variant | U2 (standard power) | U2 - same | U2 - same | U2 - same | U2 - same | U1 (lower-power core, ~10-15% lower Vcc) |
| Process Node | 20 nm Tri-Gate | 20 nm Tri-Gate - same | 20 nm Tri-Gate - same | 20 nm Tri-Gate - same | 20 nm Tri-Gate - same | 20 nm Tri-Gate - same |
Key Differentiators
- Lowest-cost option within the same F45 1932-ball FCBGA, same 1.15M LE, same 480 I/O (vs 10AX115U2F45I2SG)
- Industrial -40C to +100C junction range enables outdoor and rugged deployments (vs 10AX115U2F45E1SG)
- U2 standard-power core variant offers the most robust timing margin for transceiver-heavy designs (vs 10AX115U1F45I1SG)
Design Notes
The 45x45 mm F45 1932-ball FCBGA requires a high-layer-count PCB (16+ layers typical) with via-in-pad and laser-drilled microvias for the BGA breakout region. Use Intel's published PCB layout guidelines for the Arria 10 family. Allow at least 4 PCB layers dedicated to the transceiver channel routing to maintain the 17.4 Gbps signal-integrity target and meet return-loss masks.
Estimated: at full utilization (~80% LE, all 96 transceivers active, 0.95 V core), the 10AX115U2F45I1SG dissipates roughly 25-35 W depending on toggle rate. The F45 FCBGA exposes a large thermal lid; pair it with a heat sink plus 200-400 LFM airflow to keep the junction below 100C. Industrial temperature grade is rated at 100C junction, not ambient - derate by at least 15C between junction and inlet air.
Use SmartVID with an Intel-recommended DC-DC controller (such as the EM2XX0 family or compatible) to dynamically negotiate the 0.87-0.98 V core voltage. SmartVID can reduce dynamic power by 15-25 percent compared to a fixed 0.95 V rail. Provide a sequencing supervisor for the core, transceiver, and auxiliary rails; Arria 10 devices are sensitive to ramp ordering and will not configure if rails come up out of order.
Do not confuse package codes F45 vs F34 vs F40 - they share the 1,150,000 LE die but have different BGA ball maps and footprints. A board laid out for the F34 package cannot accept the F45 part without re-spinning the PCB. Always check the ordering part number suffix 'F45' before PCB fabrication. Also confirm the speed grade (-1 vs -2) and temperature grade (I vs E) match your product requirement at order entry.
Use IBIS-AMI models from Intel and run 17.4 Gbps channel simulations against the CEI-25G-LR / CAUI-4 mask before committing the PCB stack-up. Transceiver reference clock jitter must meet the 17.4 Gbps Rx jitter tolerance, so source the refclk from a low-jitter integer-N or fractional-N PLL (such as the SI5341 or equivalent) rather than daisy-chaining from another FPGA. AC-couple all transceiver channels per Intel's reference schematic.
Compliance Information
RoHS compliant and lead-free per distributor datasheets (assypcb snippet). Industrial temperature grade but not AEC-Q100 qualified (FPGAs are not typically AEC-Q100). Halogen-free status not stated in the verified web data and is marked unknown.
