5CSEBA2U23I7N - Cyclone V SE SoC, Dual ARM Cortex-A9, 25K LE | Intel
Teilenummer: 5CSEBA2U23I7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $175 | $175,00 |
| 10 | $158 | $1.580,00 |
| 100 | $142 | $14.200,00 |
| 250 | $132 | $33.000,00 |
| 500 | $124 | $62.000,00 |
5CSEBA2U23I7N Übersicht
A Cyclone V SoC is a heterogeneous compute device that fuses a microprocessor unit (MPU) subsystem with an FPGA fabric. The MPU subsystem runs the operating system and application code while the FPGA fabric accelerates parallel datapath, custom interfaces, and signal processing. This SoC category sits between standalone microcontrollers and high-end FPGAs, targeting applications that require both deterministic hardware logic and software programmability without the cost or board area of two separate chips.
Key features of the 5CSEBA2U23I7N include approximately 25K logic elements, 1.4 Mbits of embedded memory, dual ARM Cortex-A9 cores with NEON and single/double-precision FPU, hardware floating-point support in the FPGA fabric (variable-precision DSP blocks), integrated DDR3 controller with ECC, and the standard Cyclone V SE peripheral set including EMAC, USB, SPI, I2C, and CAN. The 672-pin UBG A package exposes roughly 240 user I/Os arranged in eight I/O banks, supporting LVDS, SSTL, HSTL, and LVCMOS signaling.
From an architecture standpoint, the hard processor subsystem (HPS) communicates with the FPGA fabric through three coherent bridges (FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA), allowing low-latency register and memory-mapped access without external bus arbitration. This eliminates the latency penalty of chip-to-chip bridges used in FPGA+external-MPU designs.
Typical applications include industrial machine vision, motor control and industrial drives, factory automation controllers, broadcast video processing, military/aerospace signal processing, and embedded edge compute platforms. The combination of Cortex-A9 performance and FPGA flexibility makes the part well suited to designs where deterministic real-time response must coexist with a Linux or RTOS application stack.
When designing with the 5CSEBA2U23I7N, plan the power distribution network around the 1.1V core, dedicated HPS rails, and per-bank I/O voltages; use multiple decoupling capacitor values near each supply pin. Thermal management should account for worst-case logic utilization plus active HPS, since both subsystems draw dynamic current concurrently.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design guidance derived from Intel/Altera's Cyclone V device documentation - information not consolidated on any single manufacturer or distributor page.
Drop-in-Alternativen für 5CSEBA2U23I7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA2U23I7N (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Process Technology, HPS Peripherals, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA2U23I7LN
✅ Drop-In✓ Auf Lager
$80.64 / Stück
Datenblatt ansehen →5CSEBA2U23I7
✅ Drop-In✓ Auf Lager
$78.4 / Stück
Datenblatt ansehen →5CSEBA2U23C8N
✅ Drop-In✓ Auf Lager
$55.5 / Stück
Datenblatt ansehen →5CSEBA2U23C7N
✅ Drop-In✓ Auf Lager
$76.9 / Stück
Datenblatt ansehen →5CSEBA2U23C7SN
✅ Drop-In✓ Auf Lager
$13.73 / Stück
Datenblatt ansehen →5CSEBA2U23C6N
✅ Drop-In✓ Auf Lager
$88.4 / Stück
Datenblatt ansehen →5CSEBA2U23I7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | 800 MHz |
| Process Technology | 28 nm low-power |
| Core Voltage | 1.1 V |
| Embedded Memory | 1.4 Mbits |
| DSP Blocks | Variable-precision DSP |
| Gehäuse | 672-pin UBG A (23 mm x 23 mm) |
| I/O Banks | 8 |
| Memory Controller | DDR3 with ECC (hard IP in HPS) |
| Peripherals (HPS) | EMAC, USB, SPI, I2C, CAN, UART, SD/MMC |
| Betriebstemperatur | -40C to +100C (industrial, 'I' suffix) |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
5CSEBA2U23I7N 672-pin ubg a (23 mm x 23 mm) Pinbelegungsleitfaden
Pinbelegung für 5CSEBA2U23I7N (672-pin ubg a (23 mm x 23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA2U23I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA2U23I7N ist geeignet für 6 Anwendungs: Industrial Motor Control and Drives, Machine Vision and Image Processing, Broadcast Video Processing and Conversion, Embedded Edge Compute and IoT Gateways, Software Defined Radio Baseband, Avionics and Defense Subsystems.
Industrial Motor Control and Drives
The 5CSEBA2U23I7N fits industrial motor control because the dual ARM Cortex-A9 HPS runs the motion-control application stack and fieldbus communication (EtherCAT, PROFINET) while the FPGA fabric executes the high-rate current-loop and PWM generation in parallel. At 25K logic elements the fabric has sufficient headroom for encoder decoding (EnDat, BISS), resolver-to-digital conversion, and Sigma-Delta modulator interfaces used in modern servo drives. The 672-ball UBG A package exposes enough LVDS pairs for multi-axis feedback capture. Compared to a discrete MCU plus FPGA two-chip solution, the integrated HPS-to-FPGA bridge reduces deterministic interrupt latency below 1 microsecond, critical for 32 kHz current loops. The industrial temperature grade (-40C to +100C) meets IEC 61800 standards for drive cabinets.
Empfohlen
Machine Vision and Image Processing
For machine vision the 5CSEBA2U23I7N is appropriate when the design needs on-the-fly image preprocessing (filtering, thresholding, Bayer-to-RGB conversion) plus an embedded Linux host running inference or HMI software. The variable-precision DSP blocks in the 25K-LE fabric accelerate convolutional and morphological operations at multiple megapixels per second, while the HPS side handles the Gigabit Ethernet pipeline (using the integrated EMAC) for streaming compressed video to a host PC. The integrated DDR3 controller with ECC provides reliable bandwidth for frame buffers. The device is widely used in industrial camera, barcode scanner, and AOI (automated optical inspection) platforms.
Empfohlen
Broadcast Video Processing and Conversion
The 5CSEBA2U23I7N is well matched to broadcast video conversion (SDI to HDMI, up/down/cross conversion, color space conversion) where the FPGA fabric performs real-time pixel-rate processing and the HPS handles protocol bridging, web UI, and audio mixing. The eight I/O banks support mixed LVDS and LVCMOS signaling for SDI input, HDMI output, and external memory interfaces simultaneously. The 800 MHz Cortex-A9 can run lightweight Linux with ffmpeg-style codecs for ancillary data. Designers value the deterministic HPS-to-FPGA bridge for sub-frame latency in live production environments.
Empfohlen
Embedded Edge Compute and IoT Gateways
Industrial IoT gateways built around the 5CSEBA2U23I7N leverage the dual Cortex-A9 to run Yocto Linux, Docker containers, and MQTT brokers while the FPGA fabric implements deterministic sensor aggregation over legacy field buses (RS-485, CAN, SPI sensors). The integrated DDR3 controller handles the working set of container images, and the HPS peripherals (dual EMAC, USB, I2C, SPI) cover all common IoT connectivity. Industrial temperature grade allows deployment in unheated cabinets. Power consumption at moderate utilization is in the 3-5 W range, suitable for fanless DIN-rail enclosures.
Empfohlen
Software Defined Radio Baseband
For SDR baseband processing the 5CSEBA2U23I7N provides enough DSP bandwidth for narrowband waveforms (DMR, TETRA, LTE eNodeB partial functions, custom OFDM) when paired with an external RF transceiver. The variable-precision DSP blocks implement FIR filtering, FFT/iFFT, and channel estimation at sample rates up to ~50 MSPS with 16-bit precision. The HPS runs the higher-layer MAC and network stack on Linux. For wideband SDR (100+ MHz instantaneous bandwidth) designers typically step up to a larger Cyclone V variant or move to Cyclone 10 GX with integrated transceivers.
Empfohlen
Avionics and Defense Subsystems
Avionics and defense subsystems built around the 5CSEBA2U23I7N exploit the SoC's deterministic HPS-to-FPGA bridge for MIL-STD-1553, ARINC 429, and custom databus protocols running at deterministic rates, while the HPS hosts a secure RTOS (VxWorks, INTEGRITY) for mission software. The industrial temperature range, BGA package, and RoHS compliance align with DO-254 design assurance workflows when used with the appropriate documentation package. For flight-critical hardware, designers typically pair the device with external watchdog, ECC memory, and redundant compute channels.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA2U23I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA2U23I7LN | 5CSEBA2U23I7 | 5CSEBA2U23C8N | 5CSEBA2U23C7N | 5CSEBA2U23C7SN | 5CSEBA2U23C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBG A (23x23) | 672-pin UBG A (23x23) - same | 672-pin UBG A (23x23) - same | 672-pin UBG A (23x23) - same | 672-pin UBG A (23x23) - same | 672-pin UBG A (23x23) - same | 672-pin UBG A (23x23) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| Speed Grade | I7 (fastest, industrial) | L (low-power, industrial) | I7 (industrial) | C8 (commercial, slower) | C7 (commercial) | C7S (commercial, low static) | C6 (commercial, slowest) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Commercial |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Embedded Memory | 1.4 Mbits | 1.4 Mbits | 1.4 Mbits | 1.4 Mbits | 1.4 Mbits | 1.4 Mbits | 1.4 Mbits |
| Drop-in Compatible (Same Package) | Reference | Yes - exact same die, lower speed/power | Yes - exact same die and grade | Yes (UBG A-672), commercial temp differs | Yes (UBG A-672), commercial temp differs | Yes (UBG A-672), commercial temp differs | Yes (UBG A-672), slower speed grade |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade at highest speed bin (I7) (vs. 5CSEBA2U23C7N)
- Lowest static power option in the same die (vs. 5CSEBA2U23I7LN)
- Largest logic density among same-package same-bin variants on Site (vs. 5CSEBA2U19I7N)
Designhinweise
Estimated: power distribution for the 5CSEBA2U23I7N must supply at least five rails: VCCINT (1.1V core), VCCP (HPS processor core), VCCPD (HPS periphery), VCCIO_x (per I/O bank, mixed voltages), and VCCBAT (battery-backed HPS logic). Each VCCINT pin should have a 0.1 uF X7R decoupling capacitor placed within 1 mm of the pin; add bulk 47-100 uF tantalum or polymer caps per rail. Use a dedicated LDO for VCCBAT to support RTC and security key retention in the HPS. Power sequencing must follow Intel's Cyclone V Power Management User Guide order - failure to sequence correctly can trigger POR events or permanent damage.
Estimated: the 5CSEBA2U23I7N junction-to-ambient thermal resistance is in the 12-15 C/W range for a 4-layer JEDEC test board with minimal copper. At a worst-case total power of ~5 W (active FPGA fabric plus dual-core Cortex-A9 running Linux with peripherals active), the junction rises 60-75 C above ambient. In a sealed industrial enclosure with 60 C ambient, this exceeds the 100 C industrial limit, requiring a heatsink or top-side airflow. Designers should target junction temperatures below 85 C for reliability headroom. Use Intel's PowerPlay early power estimator during schematic design.
The 672-ball UBG A package has a 1.0 mm ball pitch requiring microvia (laser-drilled) PCB technology for fanout on standard 4-layer boards. Use 1-2-1 stack-up with HDI microvias in pad or via-in-pad construction for the BGA break-out region. Match DDR3 trace lengths within +/- 25 mils to the HPS controller and maintain 100 ohm differential impedance for LVDS pairs. Reference the Cyclone V SoC Device Pin Connection Guidelines for unused-pin termination rules - all unused HPS balls must be left floating or terminated per the guideline, never tied directly to ground.
Three common pitfalls in 5CSEBA2U23I7N designs: (1) configuration mode selection - the MSEL pins must be pulled to the correct values for the chosen configuration source (AS, PS, JTAG, FPP); incorrect MSEL leaves the device unconfigured. (2) HPS boot source - the HPS can boot from SD/MMC, QSPI flash, or NAND; the strap pins must match the chosen medium. (3) Bank voltage compatibility - mixing 1.8V and 2.5V I/O standards in the same bank causes contention; verify I/O standard assignment in Quartus pin planner before layout.
Compliance-Informationen
RoHS and lead-free confirmed by 'N' suffix in the OPN and Intel/Altera product ordering information. AEC-Q100 not applicable - this is an industrial-grade FPGA SoC, not an automotive-qualified part. Halogen-free status not explicitly listed in verified web data.
