5CSEBA2U23I7LN - Cyclone V SE SoC FPGA, 25K LE, ARM Cortex-A9 | Intel
MPN: 5CSEBA2U23I7LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $129.02 | $129.02 |
| 10 | $116.12 | $1,161.20 |
| 100 | $103.22 | $10,322.00 |
| 500 | $90.31 | $45,155.00 |
| 1,000 | $80.64 | $80,640.00 |
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View Datasheet →5CSEBA2U23I7LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 |
| HPS Cores | Dual ARM Cortex-A9 MPCore with NEON + FPU |
| Maximum HPS Clock Frequency | 925 MHz |
| Embedded Memory (M10K blocks) | 66 blocks (1,440 Kbits total) |
| 18x18 Multipliers | 132 |
| PLLs | 4 (fractional) |
| Global Clock Networks | 20 |
| User I/O Banks | 8 |
| Maximum User I/O Pins | 364 |
| Package | 672-pin UBGA (23x23 mm, 0.8 mm pitch) |
| Operating Temperature (Junction) | -40C to +100C (industrial, I7 grade) |
| Process Technology | TSMC 28 nm low-power |
| Hard Memory Controller | DDR3 / DDR3L up to DDR3-1600 with ECC |
| HPS Peripherals | USB 2.0 OTG, Gigabit Ethernet, CAN, SPI, I2C, UART, SD/MMC, NAND flash |
| Lead-Free (L suffix) | Yes |
| RoHS Status | Compliant |
5CSEBA2U23I7LN 672-pin ubga (23x23 mm, 0.8 mm pitch) Pin Configuration Guide
Complete pinout information for 5CSEBA2U23I7LN (672-pin ubga (23x23 mm, 0.8 mm pitch) package) with 364 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U23I7LN.
Refer to the datasheet for full pin configuration.
Estimated pin count: 364 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U23I7LN is suitable for 7 applications: Industrial Motor Control and Drive, Machine Vision and Image Processing, Software-Defined Radio (SDR) Baseband, Industrial IoT Gateway and Protocol Bridge, Medical Imaging Diagnostic Equipment, Smart Energy Meter and Grid Edge Device, Automotive Infotainment Prototyping.
Industrial Motor Control and Drive
The 5CSEBA2U23I7LN suits industrial motor control by combining a deterministic real-time Cortex-A9 HPS running Linux/RTOS with FPGA fabric implementing PWM generators and encoder interfaces. The 925 MHz HPS clock provides ample headroom for field-oriented control (FOC) loops at 32 kHz switching frequency, while the 132 18x18 multipliers handle Clarke/Park transforms in hardware acceleration. The 364 user I/Os in the 672-UBGA package expose simultaneous interfaces for quadrature encoders, Hall sensors, resolver feedback, and CANopen/EtherCAT PHYs. The industrial -40C to +100C junction range supports deployment in unventilated factory cabinets. Power dissipation at typical 60-70% LE utilization is estimated at 3.5-4.5 W; the 14 C/W theta_JA yields 50-65C junction rise above ambient without a heatsink.
Recommended
Machine Vision and Image Processing
The 5CSEBA2U23I7LN fits machine vision pipelines where the FPGA fabric performs pixel-level preprocessing (filtering, thresholding, blob detection) before passing processed regions to the ARM cores for higher-level inference. The 1,440 Kbits of M10K memory buffers full HD video lines (1920x1080x8b = 1.6 MB) with headroom for line-double buffering. The 132 DSP blocks accelerate Sobel, Laplacian, and convolution kernels at line rate. The HPS runs OpenCV-based feature extraction and TCP/IP streaming of results over Gigabit Ethernet. The MIPI CSI-2 receiver IP and LVDS-based Camera Link interfaces can be implemented in soft logic on the 364 user I/Os. Industrial temperature grade supports deployment near factory heat sources.
Recommended
Software-Defined Radio (SDR) Baseband
The 5CSEBA2U23I7LN serves as a digital baseband processor in software-defined radio systems, where the FPGA fabric implements channelizers, FFT engines, and digital down-converters while the Cortex-A9 HPS runs GNU Radio or custom DSP frameworks. The 132 18x18 multipliers map efficiently into polyphase filterbanks, and the 925 MHz HPS clock provides compute headroom for demodulation and protocol stack processing. Industrial temperature grade enables deployment in outdoor small-cell base stations and military radio platforms. Note that the Cyclone V SE lacks high-speed transceivers above 5 Gbps; for direct ADC interface above 1 Gsps, consider the Cyclone V GT family (5CGTFD9A5U19A7N) or pair with an external JESD204B deserializer.
Recommended
Industrial IoT Gateway and Protocol Bridge
The 5CSEBA2U23I7LN fits industrial IoT gateways that must bridge multiple legacy fieldbuses (PROFIBUS, Modbus RTU, CAN, RS-485) to Ethernet/IP, MQTT, or OPC UA. The FPGA fabric implements custom protocol converters and timing-critical bit-banging interfaces, while the Cortex-A9 HPS runs an MQTT broker, TLS encryption, and edge analytics. The hard Gigabit Ethernet MAC and USB 2.0 OTG in the HPS eliminate external PHY needs for simple designs. The 512 KB L2 cache and DDR3-1600 controller with ECC provide robust memory for cryptographic workloads. Industrial temperature grade and the lead-free UBGA-672 package suit deployment in IP65-rated field enclosures.
Recommended
Medical Imaging Diagnostic Equipment
The 5CSEBA2U23I7LN supports medical imaging modalities such as ultrasound beamforming, endoscopy image capture, and patient-monitoring data aggregation where FPGA parallelism accelerates signal conditioning and ARM cores handle display and network interfaces. The hard DDR3 controller with ECC supports the memory-bandwidth requirements of DICOM image stacks, and the Cortex-A9 with NEON accelerates JPEG2000 and H.264 compression. The industrial temperature range suits operating-room and bedside equipment. For FDA/IEC 60601-1 compliance pathways, designers should validate the full BOM against the medical safety standard and document the Cyclone V SE long-term availability commitment of 15+ years via Intel's embedded lifecycle program.
Recommended
Smart Energy Meter and Grid Edge Device
The 5CSEBA2U23I7LN powers next-generation smart electricity meters and grid-edge intelligence devices that combine high-accuracy energy measurement with secure communication to utility backhaul networks. The FPGA fabric implements simultaneous sampling ADCs for current/voltage channels and computes RMS, harmonic distortion, and reactive power at the metering sample rate; the ARM cores handle DLMS/COSEM protocol stacks, cryptographic signing, and scheduled reporting. The hard DDR3 controller with ECC and the AES/SHA acceleration in the HPS support tamper-resistant metering. The industrial -40C to +100C junction range is essential for outdoor meter enclosures subject to direct sunlight and winter extremes. Lead-free terminal finish (L suffix) meets utility RoHS procurement requirements.
Recommended
Automotive Infotainment Prototyping
The 5CSEBA2U23I7LN serves as a prototyping platform for automotive infotainment head units, where the ARM Cortex-A9 runs Android Automotive or QNX, and the FPGA fabric accelerates display composition, LVDS-to-MIPI bridging, and audio DSP for cabin tuning. The 925 MHz HPS and DDR3-1600 controller provide sufficient bandwidth for WVGA/720p display refresh. The 364 user I/Os accommodate parallel RGB, LVDS, MIPI DSI, and I2S audio interfaces simultaneously. Note that the standard 5CSEBA2U23I7LN is not AEC-Q100 qualified; for production automotive designs, validate the system against AEC-Q100 requirements or migrate to the AEC-Q100-qualified Cyclone V SE automotive variant. The lead-free finish and industrial temperature range suit prototyping benches.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U23I7LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U23I7N | 5CSEBA2U23I7 | 5CSEBA2U23C8SN | 5CSEBA2U23C8N | 5CSEBA2U23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| Maximum HPS Clock | 925 MHz | 800 MHz (-13.5%) | 925 MHz | 925 MHz (C8 speed grade) | 925 MHz (C8 speed grade) | 925 MHz (C7 speed grade) |
| Operating Temperature (Junction) | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lead-Free Finish (L suffix) | Yes | No (N suffix) | No (no L suffix) | Yes (N suffix implies lead-free per Intel) | Yes | Yes |
| Speed Grade | I7 (fastest) | I7 | I7 | C8 | C8 | C7 |
| M10K Memory Blocks | 66 | 66 | 66 | 66 | 66 | 66 |
| 18x18 Multipliers | 132 | 132 | 132 | 132 | 132 | 132 |
| Maximum User I/O | 364 | 364 | 364 | 364 | 364 | 364 |
Key Differentiators
- Industrial temperature grade at fastest speed grade in a single SKU (vs 5CSEBA2U23C8N)
- Lead-free terminal finish (L suffix) (vs 5CSEBA2U23I7N)
- Single-package integration of ARM Cortex-A9 + 25K LE fabric (vs Xilinx Zynq-7010)
Design Notes
Estimated: the 5CSEBA2U23I7LN 672-UBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 14 C/W on a JEDEC JESD51 4-layer test board with still air. At a typical utilization of 60-70% logic elements plus 800 MHz HPS load, total power dissipation is approximately 3.5-5 W, yielding a junction temperature rise of 50-70 C above ambient. For sealed enclosures with limited airflow, attach a 15x15 mm BGA heat spreader (e.g., Wakefield 624-15AB) or specify the JEDEC JESD51-9 high-k test board layout. Always validate with the Intel Cyclone V PowerPlay Early Power Estimator spreadsheet using your actual design toggle rates before committing to the PCB stackup.
The 672-UBGA package uses 0.8 mm ball pitch, which requires a minimum of 4 PCB layers with 0.4 mm laser-drilled microvias or 0.2 mm mechanically drilled vias for BGA fan-out. Use the Intel Cyclone V SE pin-out file (.qsf / .pcf) and the Quartus Pin Planner to assign I/O bank voltages correctly - mixing 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards across 8 I/O banks is supported, but each VREF supply must be bypassed with 0.1 uF + 10 uF ceramic capacitors within 50 mil of the respective VREF pin. Place the DDR3 SDRAM directly adjacent to the HPS DDR pins (grouped on one package edge) to minimize the matched-length routing constraint to under 50 ps skew.
The 5CSEBA2U23I7LN requires seven separate power rails: VCC (core FPGA, 1.1 V nominal), VCC_HPS (HPS core, 1.1 V), VCC_HPS_IO (HPS I/O, 1.5/1.8/2.5/3.3 V), VCCPD (I/O pre-driver, 2.5/3.3 V), VCCPGM (configuration, 1.8/2.5/3.3 V), VCCPLL (PLL analog, 1.1 V), and VCCAUX (auxiliary, 2.5 V). Use the Intel Enpirion EN63A0QI or Linear LT3070 for the core rail to achieve the sub-1% ripple required for PLL jitter performance below 200 ps p-p. Sequence the HPS and FPGA core rails together; the VCC_HPS rail must not ramp before VCC is stable, otherwise the HPS boot ROM can corrupt the boot image.
The 'L' suffix on 5CSEBA2U23I7LN designates lead-free terminal finish - this is a packaging distinction, not a functional or speed distinction from the 5CSEBA2U23I7N. Do not assume the L variant offers different silicon performance. For automotive applications, the standard 5CSEBA2U23I7LN is NOT AEC-Q100 qualified; validate the full system against AEC-Q100 requirements or select a Cyclone V automotive variant. The HPS boot source must be configured via MSEL[4:0] straps before power-up; incorrect strap values are the single most common cause of HPS boot failures on first prototypes.
The 5CSEBA2U23I7LN supports LVDS input and output on all I/O pins with up to 800 Mbps DDR performance. For LVDS receive, place 100-ohm differential termination within 100 mil of the FPGA pin and route the pair with 100-ohm differential impedance and 8-mil trace-to-trace spacing. The HPS DDR3 controller pins require length-matched routing within +/-25 ps across the byte lane, achieved by serpentine tuning at the fan-out region. Use the Intel Quartus II TimeQuest timing analyzer with the IBIS-AMI models for high-speed edge interface verification - field solver extraction (Saturn PCB Toolkit or Si9000) is recommended over the default transmission-line calculator for the 0.8 mm BGA breakout.
Compliance Information
RoHS compliance indicated by 'L' suffix in part number. Lead-free terminal finish per Intel Cyclone V device datasheet. Standard part is NOT AEC-Q100 qualified - select an automotive-qualified variant for automotive applications. Halogen-free status not explicitly stated in retrieved web data.
