M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip
Teilenummer: M7AFS600-2FGG256 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $274.05 | $274,05 |
| 10 | $274.05 | $2.740,50 |
| 100 | $274.05 | $27.405,00 |
| 500 | $274.05 | $137.025,00 |
| 1.000 | $274.05 | $274.050,00 |
M7AFS600-2FGG256 Übersicht
A Fusion FPGA is a field programmable gate array that integrates programmable logic with configurable analog blocks, flash-based configuration memory, and an ARM processor core in a single device. FPGAs sit within the programmable logic hierarchy (programmable logic device -> CPLD/FPGA -> embedded system IC), enabling designers to implement custom digital logic and soft peripherals without ASIC mask costs.
Key features include the ARM CoreMP7 processor running at up to 100 MHz for embedded control, flash-based nonvolatile configuration that eliminates external boot PROMs and simplifies security, 119 user I/Os for board-level connectivity, and support for mixed-signal integration unique to the Fusion family. The -2 speed grade balances performance with cost for mid-range designs.
Technically, the device uses a sea-of-modules fabric with VersaTile logic elements, embedded SRAM blocks for FIFO and memory functions, and the Fusion analog subsystem that supports voltage, current, and temperature monitoring from on-chip rack circuits. The flash configuration cell technology provides instant-on operation and high resistance to configuration readback attacks compared with SRAM FPGAs.
Typical applications include industrial automation controllers, embedded system-on-chip prototyping, power-supply management and telemetry, and defense or instrumentation systems requiring single-chip mixed-signal integration. The 256-FBGA footprint suits space-constrained boards needing high I/O density.
Design consideration: the commercial temperature range (0C to +70C) limits use in harsh environments; select the I-suffix variant for -40C to +100C operation. Verify 1.5V core rail sequencing against the power-up specification.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für M7AFS600-2FGG256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M7AFS600-2FGG256 (gleiche Bauform und Footprint) – abweichend in Package, Family, Process Technology, Configuration Memory, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M7AFS600-FGG256I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →M7AFS600-FGG256
✅ Drop-In✓ Auf Lager
$232.4 / Stück
Datenblatt ansehen →M7AFS600-1FGG256
✅ Drop-In✓ Auf Lager
$92 / Stück
Datenblatt ansehen →M7AFS600-2FG256
✅ Drop-In✓ Auf Lager
$135.1 / Stück
Datenblatt ansehen →M7AFS600-1FG256I
✅ Drop-In✓ Auf Lager
$308.6 / Stück
Datenblatt ansehen →M7AFS600-2FGG256 Grenzwerte & elektrische Eigenschaften
| Family | Fusion Mixed-Signal FPGA |
| System Gates | 600K |
| Processor Core | ARM CoreMP7 |
| User I/O | 119 |
| Dedicated Logic Bits | 110592 bits |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Technology | 130 nm flash-based |
| Configuration | Flash-based (nonvolatile, instant-on) |
| Gehäuse | 256-LBGA (FBGA-256, 17x17 mm) |
| Montageart | Surface Mount (SMD/SMT) |
| Betriebstemperatur | 0C to +70C |
| Packaging | Tray |
| Manufacturer Standard Lead Time | 16 Weeks (per Mouser, as of 2026-09-02) |
| Programmable Type | In-System Programmable (ISP) |
| Supplier Device Package | 256-FBGA |
M7AFS600-2FGG256 256-fbga Pinbelegungsleitfaden
Pinbelegung für M7AFS600-2FGG256 (256-fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M7AFS600-2FGG256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M7AFS600-2FGG256 ist geeignet für 6 Anwendungs: Industrial Automation Controller, Power Supply Management and Telemetry, Embedded System Prototyping, Medical Instrumentation, Networking and Telecom Line Cards, Test and Measurement Instrumentation.
Industrial Automation Controller
The M7AFS600-2FGG256 fits industrial controller designs because it combines 600K gates of programmable logic with an ARM CoreMP7 processor on one flash-based die, eliminating a separate MCU and boot flash. Its 119 user I/Os drive motor-control PWM, quadrature encoders, and fieldbus interfaces, while the Fusion analog subsystem monitors supply voltages and die temperature for predictive maintenance. In a typical topology the CoreMP7 runs the communication stack and diagnostics at up to 100 MHz, and the fabric implements deterministic motion-control state machines. Flash configuration provides instant-on startup, so the controller is live within milliseconds of power application - a measurable benefit for machines requiring fast line recovery. Industrial 3.3V/2.5V I/O banks interface directly with sensors and actuators without level-shifting glue logic.
Empfohlen
Power Supply Management and Telemetry
The Fusion family was designed specifically for power-supply management: the M7AFS600-2FGG256 integrates on-chip voltage, current, and temperature monitoring via its analog rack circuits, so a single 600K-gate device can sequence, supervise, and telemetry-log multiple rails. With 119 I/Os it can drive PWM fan controls, gate drivers, I2C/PMBus telemetry to a host, and fault interrupts. Unlike a discrete supervisory solution, the ARM CoreMP7 executes adaptive control firmware while the fabric implements cycle-accurate PWM and protection comparators with microsecond response. The flash-based fabric is live at power-up, meaning sequencing logic is active before any external processor boots - a key requirement for backplanes and high-availability systems. Commercial 0C to +70C rating suits telecom indoor equipment; use the FGG256I variant for outdoor plants.
Empfohlen
Embedded System Prototyping
For embedded prototyping, the M7AFS600-2FGG256 offers a single-chip SoC: 600K gates of fabric for custom peripherals, an ARM CoreMP7 for firmware, and 110592 bits of embedded resources - enough to model full product logic before committing to a custom board. The 17x17 mm 256-FBGA lands on mainstream 4-6 layer prototyping PCBs, and flash configuration means no configuration PROM on the prototype, reducing BOM and solder steps. Engineers iterate hardware logic in Libero SoC and firmware with ARM toolchains against the same die that production uses, removing emulation risk. The 119 I/Os expose sufficient pins for memory buses, displays, and sensor headers. Note the -2 speed grade is adequate for most peripheral prototyping; timing closure above roughly 100 MHz fabric clocks should be verified in Designer.
Empfohlen
Medical Instrumentation
Benchtop medical instruments such as analyzers and patient-interface test rigs benefit from the M7AFS600-2FGG256's mixed-signal integration: the analog monitoring blocks track internal supply health and board temperature, supporting the self-test routines required in IEC-governed lab equipment, while the ARM CoreMP7 runs the user-interface state machine and the fabric handles sensor interfaces and filters. Flash configuration removes configuration readout concerns because bitstream data is not stored in an external SRAM-configured device, aiding design-protection goals common in commercial medical products. The 119 I/Os connect ADCs, displays, and communication ports in one device, cutting board area in portable analyzers. The commercial 0C to +70C range matches typical indoor laboratory environments; outdoor or ambulance-mounted units should specify the industrial FGG256I variant.
Empfohlen
Networking and Telecom Line Cards
Telecom line cards and network interface boards use the M7AFS600-2FGG256 as glue-plus-control logic: the 600K-gate fabric implements framing, polling, and LED/status engines across its 119 I/Os, while the ARM CoreMP7 manages I2C/SMD-PMD management buses and firmware-updatable policies. The flash fabric is active at power-up, so the board can arbitrate power and inventory EEPROM reads before a network processor finishes booting - useful for hot-swap line-card insertion sequencing. The Fusion analog monitors backplane supply voltages and reports telemetry to shelf management per typical ATCA-style architectures. The commercial temperature rating and 1.5 V core (1.425 V to 1.575 V tolerance) match conditioned central-office environments. The 256-FBGA with 0.8 mm fine pitch conserves line-card real estate at high I/O density.
Empfohlen
Test and Measurement Instrumentation
In test and measurement equipment, the M7AFS600-2FGG256 serves as the real-time control and acquisition sequencer: the 600K-gate fabric triggers, time-stamps, and routes signals across 119 I/Os with deterministic latency, while the ARM CoreMP7 handles SCPI command parsing and LAN/USB communication stacks at up to 100 MHz. The Fusion analog blocks continuously verify internal rail accuracy, which matters for an instrument's self-calibration logging. Flash configuration gives instant-on readiness so the instrument responds to triggers immediately after power-up - important in automated test systems with short dwell windows. The 130 nm flash fabric also avoids configuration-file exposure in shared laboratory environments. For bench instruments, the 0C to +70C rating is sufficient; rack-mounted outdoor cabinets should use the -40C to +100C FGG256I version.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M7AFS600-2FGG256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M7AFS600-FGG256I | M7AFS600-FGG256 | M7AFS600-1FGG256 | M7AFS600-2FG256 |
|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256, 17x17 mm) | 256-LBGA (FBGA-256) - same footprint | 256-LBGA (FBGA-256) - same footprint | 256-LBGA (FBGA-256) - same footprint | 256-LBGA (FBGA-256, 1.0 mm pitch) |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| Speed Grade | -2 | -2 class | Standard | -1 | -2 |
| Operating Temperature | 0C to +70C | -40C to +100C | 0C to +70C | 0C to +70C | 0C to +70C |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
| Configuration | Flash-based, nonvolatile, instant-on | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile |
Wichtigste Unterscheidungsmerkmale
- Integrated ARM CoreMP7 plus mixed-signal analog on one flash die (vs. A3P600-2FG256)
- Industrial temperature option on identical footprint (vs. M7AFS600-FGG256I)
- -2 speed grade fabric performance (vs. M7AFS600-1FGG256)
- Nonvolatile flash configuration (no boot PROM) (vs. SRAM FPGAs (e.g., Xilinx/Altera equivalents))
Designhinweise
The M7AFS600-2FGG256 core requires a tightly regulated 1.5 V rail (1.425 V to 1.575 V per Mouser listing). Because this is a flash-based FPGA with instant-on behavior, core power is drawn from the moment supply ramps; include a supervisor or use a sequencing-compliant regulator to guarantee monotonic rise. I/O banks need their own 3.3V/2.5V/1.8V rails depending on bank standard - confirm bank assignment in Libero before fixing regulators. Budget decoupling per the Fusion power application guidance: bulk capacitance near the package plus per-ball high-frequency ceramics on the 17x17 mm FBGA.
The FGG256 suffix denotes the fine-pitch 0.8 mm ball-pitch 256-FBGA; the non-G FG256 uses a 1.0 mm pitch. These land patterns are NOT interchangeable - double-check your footprint before ordering substitutions. For the 17x17 mm 256-ball BGA, use a minimum 6-layer stack with dedicated Via-in-Pad or dog-bone escape routing, and tie the package center/ground balls to a solid ground plane for signal return. Follow the Fusion family PCB layout guidelines in the manufacturer datasheet for BGA escape and power-plane segmentation.
Three recurring pitfalls: (1) The commercial suffix (-2FGG256, no I) is rated only 0C to +70C - industrial deployments must switch to M7AFS600-FGG256I, which is footprint-identical. (2) Flash FPGAs program via JTAG with FlashPro; omitting the programming header or under-sizing the JTAG series resistors causes field-reprogramming failures. (3) Mouser lists a 90-piece minimum order multiple and 16-week lead time - order quantities must respect the 90-piece tray multiple, and DigiKey notes quote-gated orders cannot be canceled or returned, so verify stock and lead time before committing.
Estimated: a 600K-gate Fusion device at moderate utilization typically dissipates on the order of 1-2 W (exact figure depends on toggle rate and I/O loading - confirm with the Microchip power estimator for your design). A 17x17 mm 256-FBGA on a multilayer PCB relies primarily on via arrays under the package thermal balls and ground planes for heat spreading. If your estimated junction temperature approaches the +70C commercial limit (junction rise plus ambient), move to the industrial FGG256I variant, which carries a +100C ceiling and provides thermal margin at no footprint cost.
Compliance-Informationen
Compliance data not explicitly stated in the retrieved web results for this exact MPN. Verify RoHS/lead-free status on the Microchip product page or distributor environmental datasheet before ordering.
