MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP
MPN： MPC860DEZQ50D4 ✗ 停產MPC860DEZQ50D4 概覽
A PowerQUICC device is a member of the communications-processor family that merges a general-purpose RISC microprocessor core with a dedicated communications engine on the same die. In the broader taxonomy it sits at: PowerQUICC -> communications microprocessor -> microprocessor unit (MPU) -> integrated circuit -> semiconductor. This category was developed specifically for embedded networking and telecom control-plane designs where deterministic I/O handling, multi-protocol serial framing, and low BOM cost outweigh raw computational throughput.
Key features include a 50 MHz core, integrated 10/100 Ethernet MAC, HDLC/SDLC channel support, PCMCIA interface, a flexible memory controller for DRAM/SRAM/Flash, an interrupt controller with multiple priority levels, and a peripheral set that covers serial, parallel, and timer functions. The device integrates virtually every block required to build an xDSL/Cable modem, router, bridge, or industrial serial controller, eliminating external protocol-bridge chips.
Architecturally, the MPC860 uses a 0.32 µm CMOS process with separate instruction and data paths for the embedded Power core, while the CPM offloads DMA-driven serial framing, freeing the core for routing and control-plane code. The chip is delivered in a 357-ball Plastic BGA (PBGA) with 25x25 mm body, providing adequate escape routing for the wide external bus while staying within a manageable PCB footprint.
Typical applications include xDSL/cable modem control plane, ISDN router termination, T1/E1 channel banks, industrial serial concentrators, and embedded networking appliances where the integrated Ethernet MAC and HDLC channels remove the need for an external bridge IC.
Designers should note the 3.3 V I/O supply requirement, the need to honor all 357 BGA balls including unused supply pins, and the importance of following the reference manual's reset and configuration sequence for proper CPM bring-up.
This page consolidates distributor pricing, verified drop-in alternatives, and practical design notes that go beyond the bare manufacturer datasheet to help engineers and procurement teams evaluate this legacy PowerQUICC part.
直接替換替代品，適用於 MPC860DEZQ50D4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC860DEZQ50D4 （相同外形與佔位） — 差異在於 Core Architecture, Package, RoHS Status, Packaging, Operating Temperature.
MPC860DEZQ50D4R2
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860DTCZQ50D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860DECVR50D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860DTVR50D4
✅ 直接替換聯絡詢價
查看資料表 →MPC860TZQ50D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC855TVR50D4
✅ 直接替換聯絡詢價
查看資料表 →MPC860DEZQ50D4 最大額定值與電氣特性
| Processor Type | MPC8xx PowerQUICC, 32-bit |
| Core Architecture | Power Architecture (embedded) |
| Core Frequency | 50 MHz |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC |
| Ethernet MAC | 10/100 Mbps integrated |
| HDLC/SDLC Channels | Yes (multi-channel) |
| PCMCIA Interface | Yes |
| Supply Voltage (I/O) | 3.3 V |
| 封裝 | 357-Ball PBGA (25x25 mm) |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | 0 C to +95 C |
| RoHS 狀態 | Contains Lead (legacy BGA) |
| Lead-Free Status | Contains Lead |
| Packaging | Tray |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC |
MPC860DEZQ50D4 357-ball pbga (25x25 mm) 腳位配置指南
MPC860DEZQ50D4（357-ball pbga (25x25 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC860DEZQ50D4.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC860DEZQ50D4 適用於 7 應用s: xDSL/Cable Modem Control Plane, ISDN Router Termination, T1/E1 Channel Bank Aggregation, Industrial Serial Concentrator, Embedded Networking Appliance, PCMCIA-Based Wireless Gateway, Legacy Telecom Backplane Controller.
xDSL/Cable Modem Control Plane
The MPC860DEZQ50D4's integrated Ethernet MAC and HDLC channels enable it to terminate DSLAM-side framing and route traffic into the central-office switching fabric. With a 50 MHz Power Architecture core and on-chip DMA-driven SCCs, the chip handles PPPoE, IP, and ATM adaptation layers without offloading to a companion processor. Per the PowerQUICC family datasheet, the device eliminates external bridge ICs in typical CPE designs, reducing BOM count and PCB area. Drop-in alternative: MPC860DTCZQ50D4 shares the same 357-PBGA footprint with a similar CPM map.
推薦
ISDN Router Termination
The MPC860DEZQ50D4's multi-channel HDLC support is well suited for ISDN primary-rate (T1/E1) termination at the customer-premises router. The CPM's DMA-driven SCCs handle multiple PRI channels concurrently while the 50 MHz Power core runs the routing stack. According to NXP product documentation, the integrated memory controller glues to SDRAM and Flash without external logic, enabling compact 4-layer PCB designs for SOHO routers. Companion MPNs: TLV2545IDGKRG4 for low-speed ADC monitoring of supply rails.
推薦
T1/E1 Channel Bank Aggregation
Designed for telecom access equipment, the MPC860DEZQ50D4 aggregates multiple T1/E1 lines into a higher-speed uplink through its Ethernet MAC and HDLC channels. The CPM offloads per-channel framing and bit stuffing, freeing the 50 MHz core for SNMP/CLI management. Per the family hardware specification, the 357-ball PBGA offers the routing escape room required for multi-port serial PHY connections on a single board. Alternative MPC860DEZQ50D4R2 shares identical silicon in tape-and-reel packaging.
推薦
Industrial Serial Concentrator
Factory automation controllers often require dozens of RS-232/RS-485 ports aggregated into Ethernet. The MPC860DEZQ50D4's SCCs and SMCs provide hardware acceleration for those serial channels while its Ethernet MAC delivers the uplink. Per the family datasheet, the wide external data bus and flexible chip-selects simplify connection to UART expander ASICs. Drop-in alternative: MAX1480BCPI pairs as an isolated RS-485 transceiver on each port.
推薦
Embedded Networking Appliance
For small-form-factor routers, firewalls, and VPN endpoints, the MPC860DEZQ50D4 integrates everything needed except PHYs and memory. The 50 MHz core is sufficient for low-Mpps packet forwarding in SOHO/SMB products, while the integrated peripherals reduce the external chip count. According to NXP reference designs, the chip can run embedded Linux or VxWorks from boot Flash with minimal glue logic. Companion part MAX174AEPI monitors system rails.
推薦
PCMCIA-Based Wireless Gateway
Late-1990s/early-2000s wireless gateways used PCMCIA slots for 802.11 cards. The MPC860DEZQ50D4's integrated PCMCIA host controller simplifies such designs by eliminating the need for a dedicated PCMCIA bridge chip. Per the PowerQUICC family datasheet, the controller supports two PCMCIA sockets with hot-swappable card insertion. The Ethernet MAC ties the wireless uplink to the wired LAN side.
推薦
Legacy Telecom Backplane Controller
Long-life telecom equipment installed in the 2000s still ships with MPC860-class parts as backplane management controllers. The MPC860DEZQ50D4 handles HDLC framing for shelf-to-shelf communication and runs the management CPU load. According to NXP's NRND notice, the part remains in production support for installed telecom bases - exactly the use case where long-term availability matters more than raw performance.
推薦
推薦產品摘要
工程參考資料，適用於 MPC860DEZQ50D4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC860DEZQ50D4R2 | MPC860DTCZQ50D4 | MPC860DECVR50D4 | MPC860DTVR50D4 | MPC860TZQ50D4 | MPC855TVR50D4 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale heritage) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-Ball PBGA (25x25 mm) | 357-Ball PBGA - same | 357-Ball PBGA - same | 357-Ball PBGA - same | 357-Ball PBGA - same | 357-Ball PBGA - same | 357-Ball PBGA - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Architecture | MPC8xx PowerQUICC, 32-bit | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC |
| CPM Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| CPM Channel Count | Full MPC860 CPM | Full MPC860 CPM | Reduced/alternate CPM map | Full MPC860 CPM | Full MPC860 CPM | Full MPC860 CPM | MPC855 reduced CPM |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | Industrial grade variant | Industrial grade variant | 0 C to +95 C | 0 C to +95 C |
| Lead-Free / RoHS | Contains Lead (legacy BGA) | Contains Lead | Contains Lead | Contains Lead | Contains Lead | Contains Lead | Contains Lead |
| Packaging Form | Tray | Tape & Reel | Tray | Tray | Tray | Tray | Tray |
主要差異化特點
- Integrated 10/100 Ethernet MAC plus multi-channel HDLC CPM (對比MPC855TVR50D4)
- Tray-packaged PBGA versus tape-and-reel variant (對比MPC860DEZQ50D4R2)
- Broader CPM feature set versus temperature-graded siblings (對比MPC860DTVR50D4 / MPC860DECVR50D4)
- Same 50 MHz core across the entire family (對比MPC860DTCZQ50D4)
設計說明
MPC860DEZQ50D4 requires a clean 3.3 V I/O rail with bulk decoupling at each supply ball cluster. Place low-ESR ceramic capacitors (100 nF and 10 uF) within 5 mm of every supply ball group. Estimated: at 50 MHz core clock, typical power dissipation is in the 1.0-1.5 W range, so a 4-layer PCB with a dedicated ground plane is required to keep the die within its 95 C junction limit.
The 357-ball PBGA on a 25x25 mm body with 1.27 mm ball pitch requires a 4-layer PCB with via-in-pad or dog-bone fanout. Match the BGA escape pattern to the manufacturer reference layout to maintain signal integrity on the 32-bit external data bus and to avoid crosstalk on the HDLC and Ethernet signals. Per the family hardware specification, unused balls should still be soldered for mechanical reliability.
Do not assume that MPC860 family suffix code letters (DEZ, DTC, TZQ, TVR, etc.) are drop-in compatible without verifying the CPM channel map. Although the 357-ball PBGA footprint and 50 MHz core rating are consistent across the variants, the specific SCC/SMC count and peripheral assignments differ. Per the Utmel comparison data, always re-validate the firmware's CPM channel allocation against the substitute part's reference manual before deploying in production.
Estimated: at ambient 70 C and full CPM activity, the BGA junction temperature can approach 100 C. Provide thermal vias under the center ball grid and copper pours on inner layers to spread heat. For enclosed industrial cabinets, derate CPM channel activity or add forced airflow to maintain margin below the 95 C upper spec limit.
Keep the 50 MHz system clock trace short and impedance-controlled (50 ohms to ground). Isolate the Ethernet MII traces from the HDLC lines with a ground guard trace to prevent high-speed Ethernet coupling into the slower serial framing channels. Per the family hardware specification, the PCMCIA bus signals should be length-matched within 5 mm to avoid timing violations at 50 MHz.
合規資訊
Per the digchip datasheet entry, the MPC860DEZQ50D4 'Contains Lead' and is therefore not RoHS compliant. This is typical of legacy PowerQUICC BGA parts shipped before the RoHS transition. The part is not AEC-Q100 qualified as it targets telecom and industrial markets, not automotive.
