RTAX2000DL-CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip
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Drop-in alternatives for RTAX2000DL-CQ352B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000DL-1CQ352B
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$3420 / Unit
View Datasheet →RTAX2000SL-1CQ352V
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$2050 / Unit
View Datasheet →RTAX2000SL-1CQ352PROTO
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View Datasheet →RTAX1000SL-CQ352V
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View Datasheet →RTAX4000SL-1CQ352E
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View Datasheet →RTAX2000DL-1CQ352V
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$2950 / Unit
View Datasheet →RTAX2000DL-CQ352B Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 2,000,000 |
| CLBs | 19,712 |
| DSP Mathblocks | Up to 120 |
| DSP MAC Performance | 125 MHz, 18-bit x 18-bit multiply-accumulate |
| Embedded Memory | Up to 540 kbits with optional EDAC protection |
| Programming Technology | Nonvolatile antifuse |
| Total Ionizing Dose (Functional) | 300 krad (Si) |
| Total Ionizing Dose (Parameter) | 200 krad (Si) |
| Core Supply Voltage (Nominal) | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Package | 352-terminal ceramic CQFP, metal-sealed |
| Terminal Pitch | 0.500 mm |
| Mounting Type | Surface Mount |
| Configuration | Live at power-up, no external boot PROM required |
| Application Domain | Space flight systems |
RTAX2000DL-CQ352B 352-terminal ceramic cqfp, metal-sealed Pin Configuration Guide
Complete pinout information for RTAX2000DL-CQ352B (352-terminal ceramic cqfp, metal-sealed package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000DL-CQ352B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000DL-CQ352B is suitable for 6 applications: Satellite Payload Signal Processing, Spacecraft Bus Control and Housekeeping, On-Board Image and Video Processing, Telemetry, Tracking and Command (TT&C) Systems, Radiation-Tolerant Prototyping and Test Benches, Launch Vehicle and Avionics Electronics.
Satellite Payload Signal Processing
The RTAX2000DL-CQ352B fits satellite payload processing because its up to 120 DSP mathblocks execute 18-bit x 18-bit multiply-accumulate at 125 MHz, delivering on the order of 30 GMAC/s for FIR filtering, FFT, and correlation workloads, while its 300 krad (Si) functional TID rating satisfies typical LEO/MEO mission requirements. In use, designers implement the payload DSP chain directly on the fabric, using the 540 kbits of EDAC-protected embedded SRAM as coefficient and sample buffers. The antifuse technology is live at power-up, eliminating configuration boot time for time-critical downlink chains, and the single-chip form factor reduces board area versus SRAM FPGA plus PROM solutions. The trade-off is one-time programmability: any payload algorithm change requires flight hardware modification, so algorithm freeze and extensive simulation must precede build.
Recommended
Spacecraft Bus Control and Housekeeping
For spacecraft bus controllers, telemetry formatting, and power/attitude housekeeping, the RTAX2000DL-CQ352B provides 19,712 CLBs of glueless integration, replacing dozens of discrete logic devices with a single hermetic ceramic CQFP. Its nonvolatile antifuse programming is live at power-up, which is essential for spacecraft that must begin command reception immediately after launch separation without a configuration sequence. The 0.500 mm pitch 352-terminal package supports the screening and workmanship flows of flight assembly, and 1.5V nominal core operation keeps dynamic power within typical spacecraft bus power budgets. The DSP mathblocks are often left unused in this role but cost nothing extra versus the SL variant in system terms; conversely, teams needing only bus logic may choose RTAX2000SL-1CQ352V to streamline qualification documentation.
Recommended
On-Board Image and Video Processing
Earth-observation and reconnaissance payloads require convolution, histogram, image compression, and line-correction pipelines with deterministic timing - exactly the workload profile of the RTAX2000DL-CQ352B. Its dedicated DSP mathblocks sustain 125 MHz 18x18 MACs, and the embedded SRAM blocks with EDAC line buffers handle row-stores between filter stages, all within radiation-tolerant silicon rated to 300 krad (Si) functional TID. Because the device is live at power-up with no configuration PROM, the imager can begin frame capture autonomously, and the metal-sealed ceramic package meets outgassing constraints of optical benches. Designers should budget I/O bandwidth on the CQ352 package for high-speed ADC interfaces and verify timing at the chosen speed grade in Libero SoC before committing the antifuse design.
Recommended
Telemetry, Tracking and Command (TT&C) Systems
TT&C chains demand always-on availability and bit-level determinism. The RTAX2000DL-CQ352B's antifuse fabric is immune to configuration upsets that plague SRAM FPGAs - there is no configuration memory to corrupt - which is why Microchip positions RTAX-S devices for spaceflight command links. The device's 540 kbits of embedded SRAM with optional EDAC implement FEC decoders and frame buffers, while up to 120 DSP mathblocks accelerate matched filtering and correlation for signal acquisition. Core operation at a nominal 1.5V (1.425V-1.575V) integrates with regulated spacecraft power rails. The 352-terminal CQFP provides sufficient I/O for redundant receiver, transmitter, and cross-strap interfaces on a single chip, supporting the cross-strapping redundancy typical of TT&C architectures without additional logic devices.
Recommended
Radiation-Tolerant Prototyping and Test Benches
Because antifuse RTAX devices are one-time programmable, flight teams routinely pair flight units with prototype-grade silicon for board bring-up, and the RTAX2000SL-1CQ352PROTO occupies the identical 352-terminal CQFP footprint for exactly this purpose. A design flow using the RTAX2000DL-CQ352B typically validates pin mapping, power distribution, and timing on PROTO parts before committing costly flight devices. Both parts derive from the same Axcelerator-derived fabric described in the Microchip RTAX datasheet, so test patterns and timing closures port directly; only radiation qualification documentation differs. Teams should model speed-grade timing margins conservatively during prototyping and confirm final AC parameters on the actual flight speed grade, since PROTO electrical screening is reduced relative to flight-grade parts.
Recommended
Launch Vehicle and Avionics Electronics
Launch-vehicle avionics and flight-control electronics benefit from the RTAX2000DL-CQ352B's combination of deterministic, live-at-power-up logic and resistance to configuration corruption under vibration, thermal cycling, and radiation exposure. The 2,000,000-gate fabric integrates redundant flight computers, MIL-STD-style serial interfaces, and voter logic on a single chip, cutting part count and assembly complexity in volume-constrained avionics bays. The hermetic, metal-sealed 352-terminal CQFP supports the moisture and contamination control required by launch environments, and the 1.5V core keeps power distribution simple across stacked avionics shelves. Designers must treat the device as one-time programmable: configuration management and full simulation sign-off are mandatory before any flight lot is programmed and soldered.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000DL-CQ352B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000DL-1CQ352B | RTAX2000SL-1CQ352V | RTAX1000SL-CQ352V | RTAX4000SL-1CQ352E |
|---|---|---|---|---|---|
| Package | 352-terminal ceramic CQFP (CQ352), 0.500 mm pitch | CQFP-352 - same | CQFP-352 - same | CQFP-352 - same | CQFP-352 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 2,000,000 | 2,000,000 | 2,000,000 | ~1,000,000 | ~4,000,000 |
| CLBs | 19,712 | 19,712 | 19,712 | [DATA_NEEDED] | [DATA_NEEDED] |
| DSP Mathblocks | Up to 120 (18x18 MAC, 125 MHz) | Up to 120 (speed grade 1) | None (SL family) | None (SL family) | None (SL family) |
| Core Supply Voltage | 1.5 V nominal (1.425 V - 1.575 V) | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Speed Grade | Standard | Speed grade 1 (faster) | Speed grade 1, V build | V build | Speed grade 1, E build |
| Programming Technology | Nonvolatile antifuse, live at power-up | Antifuse | Antifuse | Antifuse | Antifuse |
| Primary Differentiation | Radiation-tolerant DSP FPGA for spaceflight | Identical die, faster timing | Logic-only, no DSP blocks | Lower density, lower power | Highest density in same package |
Key Differentiators
- Dedicated DSP mathblocks for spaceborne signal processing (vs RTAX2000SL-1CQ352V)
- Faster timing option available on identical die (vs RTAX2000DL-1CQ352B)
- Optimized density/power balance within the same package (vs RTAX4000SL-1CQ352E)
Design Notes
Design the 1.5V core rail for tight regulation within the 1.425V to 1.575V window specified for RTAX2000 family devices. Space power converters should include rad-hard or radiation-tolerant point-of-load regulation, input filtering for bus transients, and sequencing that brings core supply stable before I/O bank ramping per the RTAX-S/SL and RTAX-DSP datasheet power-up requirements. Because antifuse fabric draws static current at all times once powered, power budget analysis should use datasheet static plus evaluated dynamic figures for your actual toggle rates, not gate-count heuristics alone.
Antifuse FPGAs are one-time programmable: a single design error means scrapping a flight-cost ceramic CQFP device. Freeze the design, run complete timing simulation at the selected speed grade in Microchip Libero SoC, and perform sign-off including STA and gate-level simulation before programming. Prototype on RTAX2000SL-1CQ352PROTO parts in the identical 352-pin footprint where possible. Additionally, remember that the DL variant's DSP mathblocks exist only on RTAX-DSP family members - porting a design to SL siblings requires replacing mathblock instances with fabric multipliers and re-verifying timing.
The 352-terminal CQFP with 0.500 mm pitch requires careful PCB land-pattern design per the package drawing in the Microchip datasheet and IPC-compliant footprint generation. Use symmetrical power/ground plane pairs under the package, decouple each supply pin group with local ceramic capacitance, and route high-speed I/O with controlled impedance and matched lengths for source-synchronous interfaces. The hermetic package lid is connected per package datasheet - verify lid/ground handling on your stackup. Ensure reflow profiles match ceramic package thermal mass to avoid solder joint voiding on the 352 perimeter terminations.
Ceramic CQFP packages conduct most heat through the terminations and lid into the board and chassis. Estimate junction temperature from datasheet theta-JA for the CQ352 package, your worst-case ambient, and total power from the Libero SoC power estimator; as a rule of thumb, keep calculated junction temperature within datasheet maximum with margin appropriate to the mission reliability target. Estimated: a 2W dissipation with a package theta-JA on the order of 20-30 C/W implies roughly 40-60 C junction rise - verify against the current datasheet table rather than this estimate before flight sign-off.
Compliance Information
Space-grade ceramic hermetic package; compliance declarations (RoHS/REACH exemptions for aerospace) were not stated in the retrieved web data and must be confirmed with Microchip for the specific build standard.
