MPXV5010DP vs MPX5010DP Comparación
Comparación detallada lado a lado de MPXV5010DP por NXP Semiconductors y MPX5010DP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPXV5010DP | MPX5010DP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,10 | $9,60 |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 to 10 kPa (0 to 1.45 PSI) | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload] | [DATA_NEEDED: max overload kPa] |
| Tipo de salida | Analog, Ratiometric | Analog, ratiometric |
| Rango de tensión de salida | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Tensión de alimentación | 5 V nominal (4.75 V to 5.25 V) | 4.75 V to 5.25 V (5 V typical) |
| Accuracy | 5 % (over 0 C to 85 C) | — |
| Response Time | 1 ms typical | — |
| Temperatura de funcionamiento | -40 C to +125 C | 0 C to +85 C (compensated) |
| Compensated Temperature | 0 C to 85 C | — |
| Port Style | Male, 0.13 in (3.3 mm) tube, Dual, Same Side | — |
| Encapsulado | 8-BSOP (0.475 in / 12.06 mm width), Dual Ports | 6-SIP Module |
| Tipo de montaje | Surface Mount | Through-hole (SIP) |
| Technology | Piezoresistive, MEMS, On-chip Signal Conditioned | Piezoresistive, monolithic silicon, on-chip signal conditioned |
| Estado RoHS | Compliant | Compliant |
| Sensitivity | — | 450 mV/kPa (typical) |
| Corriente de alimentación | — | [DATA_NEEDED: supply current mA] |
| Linearity | — | ±1.5% VFSS (typical, 0-85 C) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature C] |
| Port Configuration | — | Dual axial ports, 4.93 mm (0.19 in) tube |