5CSXFC5D6F31C7N - Cyclone V SX SoC FPGA 85K LE | Intel
MPN: 5CSXFC5D6F31C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $348 | $34,800.00 |
| 500 | $312 | $156,000.00 |
| 1,000 | $285 | $285,000.00 |
Drop-in alternatives for 5CSXFC5D6F31C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSXFC5D6F31I7N
✅ Drop-In✓ In Stock
$138.2 / Unit
View Datasheet →5CSXFC5D6F31C8N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →5CSXFC6D6F31C6N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →5CSXFC6D6F31C7N
✅ Drop-In✓ In Stock
$360 / Unit
View Datasheet →5CSTFD6D5F31I7N
✅ Drop-In✓ In Stock
$290 / Unit
View Datasheet →5CGXFC7D6F31C7N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSXFC5D6F31C7N Maximum Ratings & Electrical Characteristics
| Product Type | SoC FPGA (HPS + FPGA fabric) |
| Series | Cyclone V SX |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 85,000 |
| Logic Blocks | 32,075 |
| Maximum Operating Frequency | 800 MHz |
| Transceivers | 9 |
| Transceiver Data Rate | 3.125 Gbps |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 896-FBGA (31x31 mm) |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | 28 nm low-power |
| RoHS Status | Compliant |
5CSXFC5D6F31C7N 896-fbga (31x31 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC5D6F31C7N (896-fbga (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC5D6F31C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC5D6F31C7N is suitable for 6 applications: Industrial Motor Control Drives, Machine Vision and Video Analytics, Factory Automation Controllers, Portable Medical Imaging Devices, Automotive Driver Assistance (ADAS) Pre-Processing, Software-Defined Radio Baseband.
Industrial Motor Control Drives
The 5CSXFC5D6F31C7N's dual ARM Cortex-A9 HPS at 800 MHz runs FOC and motion control algorithms while the FPGA fabric generates deterministic PWM and decodes encoder feedback with sub-microsecond jitter. The 9 transceivers up to 3.125 Gbps support EtherCAT, PROFINET, and EtherNet/IP industrial Ethernet protocols, while hard PCIe Gen2 blocks enable host-side supervisory communication with PLC controllers. Compared with discrete MCU+FPGA solutions, the integrated SoC reduces BOM cost by 25-35% and eliminates HPS-to-FPGA inter-chip latency in servo loops.
Recommended
Machine Vision and Video Analytics
The 5CSXFC5D6F31C7N's 85K logic elements implement image preprocessing pipelines including color-space conversion, Bayer demosaicing, and histogram equalization directly in the FPGA fabric, offloading the HPS for higher-level analytics. The MIPI CSI-2 and LVDS soft IP cores running on dedicated transceiver channels ingest 1080p60 streams at 148.5 MHz pixel clock, while the HPS executes OpenCV-based object detection. The 896-FBGA package with 364 user I/O pins provides ample connectivity for parallel image sensors, GPIO triggers, and illumination control.
Recommended
Factory Automation Controllers
The 5CSXFC5D6F31C7N integrates deterministic industrial I/O handling through its FPGA fabric with Linux-capable processing on the dual ARM Cortex-A9 HPS, enabling single-chip PLC replacements. The 87 variable-precision DSP blocks accelerate PID loop math for up to 32 axes of motion, while the hard memory controller supports DDR3 with ECC for reliable operation in electrically noisy factory environments. Industrial Ethernet stacks (PROFINET IRT, EtherCAT) run on dedicated transceivers with cycle times down to 250 microseconds.
Recommended
Portable Medical Imaging Devices
The 5CSXFC5D6F31C7N's low-power 28 nm process and integrated HPS+FPGA architecture reduce total system power by 30-40% versus discrete two-chip designs, critical for battery-operated portable ultrasound and patient monitors. The FPGA fabric processes raw transducer or sensor data at line rates up to 200 MHz, while the ARM HPS runs compressed sensing and image reconstruction algorithms. The 896-FBGA commercial temperature grade meets the 0C to 85C envelope required by IEC 60601-1 medical equipment safety standards for clinic and home-use devices.
Recommended
Automotive Driver Assistance (ADAS) Pre-Processing
Although not AEC-Q100 qualified, the 5CSXFC5D6F31C7N serves as a development platform and pre-production reference for ADAS sensor fusion, with the HPS running perception algorithms and the FPGA fabric fusing multiple camera and radar streams. The 9 transceivers aggregate sensor data from surround-view cameras at 3.125 Gbps per lane, and the hard PCIe Gen2 x4 controllers stream pre-processed results to a host ADAS processor at 5 Gbps. For volume automotive deployment, designers migrate to AEC-Q100 qualified Cyclone V Auto variants sharing the same toolchain.
Recommended
Software-Defined Radio Baseband
The 5CSXFC5D6F31C7N's 9 transceivers at 3.125 Gbps handle multiple digital radio standards (LTE, Wi-Fi, custom protocols) in parallel, while the FPGA fabric implements digital down-conversion, channelization, and FEC decoding. The dual ARM Cortex-A9 cores at 800 MHz run the MAC layer and protocol stack, offloading DSP-heavy baseband work to the FPGA's 87 variable-precision DSP blocks. The 4,480 Kbits of embedded memory buffers samples between the transceiver frontend and HPS, eliminating external SRAM in cost-sensitive small-cell designs.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC5D6F31C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC5D6F31I7N | 5CSXFC5D6F31C8N | 5CSXFC6D6F31C6N | 5CSXFC6D6F31C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (31x31) | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same |
| Logic Elements | 85,000 | 85,000 | 85,000 | 110,000 | 110,000 |
| Speed Grade | 7 (commercial) | 7 (industrial) | 8 (commercial) | 6 (commercial) | 7 (commercial) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| HPS Processor | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Transceivers | 9 at 3.125 Gbps | 9 at 3.125 Gbps | 9 at 3.125 Gbps | 9 at 3.125 Gbps | 9 at 3.125 Gbps |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Key Differentiators
- Balanced 85K LE density with full 9-transceiver complement at commercial temperature (vs 5CSXFC6D6F31C6N)
- Drop-in commercial-to-industrial temperature migration without PCB changes (vs 5CSXFC5D6F31I7N)
- Integrated HPS eliminates external processor chip for Linux-capable designs (vs 5CSTFD6D5F31I7N)
Design Notes
The Cyclone V SX SoC FPGA requires multiple supply rails: VCC (core), VCCPLL, VCCPD (I/O pre-drivers), VCCIO (I/O banks), VCCAUX, VCCA_FPLL, and dedicated HPS rails (VCC_HPS, VCC_HPS_PLL, DDR_PLL). Sequence the HPS and FPGA power supplies per Intel's power management design guidelines; VCC must ramp before VCCIO for any given bank or the I/O pins can latch up. Use a dedicated sequencer IC (such as Intel's EM11x family) to enforce monotonic ramping within 100 ms across all rails.
The 896-FBGA package has a typical theta_JA in the 12-15 C/W range with proper thermal via array (4 thermal vias under the central BGA pad, 0.3 mm diameter, connected to internal ground planes). For full-fabric utilization with all 9 transceivers active, designers should plan for up to 4-5 W of dissipation. In enclosed industrial cabinets, attach a heatsink with thermal interface material rated for the 85C ambient ceiling, or derate the operating temperature if natural convection is the only cooling.
Route all 9 transceiver channels with 100 ohm differential impedance and length matching within 0.127 mm (5 mil) for lanes above 2.5 Gbps. Place 0.1 uF and 0.01 uF high-frequency ceramic decoupling capacitors within 1 cm of every transceiver power pin and use a continuous ground reference plane under all high-speed traces. For DDR3 interfaces, route the address/command group and byte lanes with proper fly-by topology and maintain 50 ohm single-ended impedance with length matching within 0.5 mm per byte lane.
Do not confuse speed grade 7 (slower timing, lower cost) with grade 8 (faster) when ordering - swapping one letter changes the Fmax and may cause timing failures on critical paths. The HPS boot source must be configured through MSEL pins before power-up; using JTAG only as a fallback prevents reliable field updates. Avoid assigning sensitive analog signals to bank 8A, which has higher noise coupling from the transceiver PLL supply; consult the pin connection guidelines for clean bank assignments.
Compliance Information
RoHS compliant per Intel/Altera Cyclone V product page. Commercial temperature grade only - not AEC-Q100 qualified. For automotive designs, consider AEC-Q100 qualified Cyclone V Auto variants which share the same toolchain but different part numbers.
