5CSXFC5D6F31C8N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSXFC5D6F31C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
5CSXFC5D6F31C8N Overview
A Cyclone V SX SoC FPGA belongs to the broader family of FPGAs (Field Programmable Gate Arrays) — programmable semiconductor devices that implement arbitrary digital logic via configurable logic blocks (CLBs), programmable interconnects, and embedded hardware IP. SoC FPGAs extend this concept by co-integrating a hard processor system (HPS) on the same die, enabling software programmability alongside parallel hardware acceleration. Within the FPGA taxonomy, Cyclone V sits in the low-power, mid-density tier between Cyclone IV and Cyclone 10; the SX sub-family specifically targets applications requiring HPS integration alongside the FPGA fabric.
Key features of the 5CSXFC5D6F31C8N include 85K logic elements, embedded ARM Cortex-A9 dual-core HPS running up to 600 MHz, variable-precision DSP blocks for signal processing acceleration, integrated memory controllers, and a high-speed transceiver interface. The device supports DDR2/DDR3 external memory interfaces through hard controllers, and provides PCIe Gen2 hard IP for high-bandwidth host connectivity. The 896-ball FBGA package supports substantial GPIO counts through 8 I/O banks operating at multiple voltage standards.
The 5CSXFC5D6F31C8N uses TSMC's 28 nm low-power process technology, balancing logic density with low static and dynamic power consumption. The integrated HPS includes ARM CoreSight debug, NEON media engine, and a rich set of peripherals (EMAC, USB, SD/MMC, NAND), allowing the device to run embedded Linux, VxWorks, or bare-metal firmware without an external host processor.
Typical applications include industrial machine vision systems, video surveillance and image processing pipelines, motor control and industrial automation, automotive driver assistance, and embedded computing platforms. The combination of FPGA fabric and ARM HPS allows designers to partition tasks: time-critical DSP operations execute in programmable logic while control-plane software runs on the Cortex-A9 cores.
When designing with this device, plan the PCB for the 31x31 mm FBGA land pattern with microvia stack-ups and matched-length high-speed transceiver traces. Thermal management must account for the dual power domains (FPGA core and HPS); consult the device-specific power estimator (EPE) before finalizing the thermal solution.
This page synthesizes distributor pricing, drop-in alternative MPNs from the Intel Cyclone V SoC family, and practical design notes — information not aggregated on any single distributor or manufacturer page.
Drop-in alternatives for 5CSXFC5D6F31C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSXFC5D6F31C8N (same form factor and footprint) — differing in Package, Operating Temperature, Transceivers, Logic Elements, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSXFC5D6F31C7N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →5CSXFC5D6F31C6N
✅ Drop-In✓ In Stock
$184.85 / Unit
View Datasheet →5CSXFC5C6U23C8N
✅ Drop-In✓ In Stock
$96.75 / Unit
View Datasheet →5CSXFC4C6U23C8N
✅ Drop-In✓ In Stock
$90 / Unit
View Datasheet →5CSEBA6U23C8N
✅ Drop-In✓ In Stock
$132 / Unit
View Datasheet →5CGXFC7D7F31C8N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSXFC5D6F31C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 85K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock Frequency | 600 MHz |
| Package | 896-FBGA (31x31 mm) |
| Process Technology | 28 nm low-power |
| Memory Type | FPGA fabric + ARM HPS on-die |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Speed Grade | C8 |
| Device Variant | 5CSXFC5 (logic + transceivers + HPS) |
5CSXFC5D6F31C8N 896-fbga (31x31 mm) Pin Configuration Guide
Pin configuration for 5CSXFC5D6F31C8N (896-fbga (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC5D6F31C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSXFC5D6F31C8N is suitable for 6 applications: Industrial Machine Vision Systems, Video Surveillance and Image Processing, Motor Control and Industrial Automation, Automotive Driver Assistance (ADAS), Embedded Computing Platforms, Software-Defined Radio Front-Ends.
Industrial Machine Vision Systems
The 5CSXFC5D6F31C8N suits industrial machine vision because its 85K logic elements handle image preprocessing pipelines while variable-precision DSP blocks accelerate 2D convolution, Sobel edge detection, and morphological operations. The 600 MHz dual ARM Cortex-A9 HPS runs Linux-based classification algorithms and communicates with PLCs via EtherCAT or PROFINET. Designers typically allocate ~50% of the fabric to image processing IP and use the HPS for system control. Compared with discrete CPU + FPGA solutions, the integrated SoC reduces BOM cost, board area, and latency between processing stages.
Recommended
Video Surveillance and Image Processing
For video surveillance, the 5CSXFC5D6F31C8N's hard memory controller supports DDR3 for frame buffering, while the FPGA fabric implements H.264 encode/decode, motion detection, and overlay composition. The integrated HPS streams processed video over Gigabit Ethernet to NVR backends. PCIe Gen2 hard IP enables direct attachment of camera sensors with high-throughput MIPI or parallel interfaces bridged through FPGA logic. Power consumption typically stays below 6W even at full fabric utilization.
Recommended
Motor Control and Industrial Automation
In motor control applications, the 5CSXFC5D6F31C8N implements field-oriented control (FOC) loops in the FPGA fabric with deterministic sub-microsecond latency, while the HPS runs higher-level motion profiling, HMI interfaces, and communication stacks. The integrated Cortex-A9 cores handle Ethernet/IP, EtherCAT master stacks, and safety logic. Designers leverage the hard processor for real-time Linux (PREEMPT_RT) alongside the FPGA fabric's deterministic PWM generation. Industrial temperature variants are not offered in this speed grade, so deployments must stay within 0C to 85C ambient.
Recommended
Automotive Driver Assistance (ADAS)
Within ADAS subsystems like surround-view and lane-departure warning, the 5CSXFC5D6F31C8N provides adequate processing for multi-camera stitching and basic object detection. Designers use FPGA fabric for image rectification and feature extraction while the HPS executes classification networks. For full AEC-Q100 qualification, designers should select the industrial-temperature Cyclone V variants rather than the commercial-grade 5CSXFC5D6F31C8N. The integrated ARM cores support AUTOSAR-compliant stacks and run CAN/LIN diagnostics in parallel with vision processing.
Recommended
Embedded Computing Platforms
The 5CSXFC5D6F31C8N functions as a single-board computer with FPGA acceleration. The HPS boots Linux from SD card or QSPI flash, the FPGA fabric implements custom peripherals such as high-speed ADC interfaces, and the integrated transceivers support SFP+ or 10GbE uplinks. Typical designs include industrial IoT gateways, software-defined radio front-ends, and test-and-measurement instruments. The dual-core HPS with NEON engine handles 1080p video encode while the FPGA performs DSP.
Recommended
Software-Defined Radio Front-Ends
In SDR front-ends, the 5CSXFC5D6F31C8N fabric implements DDC/DUC, channelizers, and baseband processing while the integrated transceivers support RF-to-baseband digitization chains up to 3.125 Gbps. The HPS runs protocol stacks such as LTE or 5G NR lower-layer splits. Designers pair the FPGA with external RF ADCs such as the AD9680 family. The 28 nm low-power process keeps the device under 8W even with 70% transceiver utilization.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC5D6F31C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC5D6F31C7N | 5CSXFC5D6F31C6N | 5CSXFC5C6U23C8N | 5CSXFC4C6U23C8N | 5CSEBA6U23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (F31, 31x31 mm) | 896-FBGA (F31, 31x31 mm) - same | 896-FBGA (F31, 31x31 mm) - same | 896-FBGA (U23, 23x23 mm) - different | 896-FBGA (U23, 23x23 mm) - different | 896-FBGA (U23, 23x23 mm) - different |
| Family | Cyclone V SX SoC | Cyclone V SX SoC | Cyclone V SX SoC | Cyclone V SX SoC | Cyclone V SX SoC | Cyclone V SE SoC |
| HPS | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 | Dual Cortex-A9 | Dual Cortex-A9 |
| Speed Grade | C8 | C7 | C6 | C8 | C8 | C8 |
| Transceivers | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps) | Yes (3.125 Gbps) | No |
| Hardened FP DSP | No | No | No | No | No | Yes |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Key Differentiators
- Integrated HPS with full Linux support (vs 5CGXFC7D7F31C8N)
- Transceivers included vs SE SoC (vs 5CSEBA6U23C8N)
- Mid-density 85K LE SX device (vs 5CSXFC4C6U23C8N)
Design Notes
Estimated: At typical 60-70% logic utilization and 50% DSP block toggle rate, total power consumption for the 5CSXFC5D6F31C8N is approximately 4-6W (FPGA core) plus 1-2W (HPS), for ~6-8W total. The 896-FBGA package has a typical theta_JA of approximately 13-15 C/W with 8-layer PCB thermal via array; this yields a 90-120 C junction temperature rise above ambient. Designers should use Intel's Early Power Estimator (EPE) for board-specific thermal modeling and ensure the PCB includes a thermal via array beneath the package center for heat removal.
The 896-FBGA (F31) package requires microvia PCB technology. Use 1.0 mm pitch BGA land pattern per the Intel Cyclone V handbook pin-out specification. Stack-up recommendation: 8-layer with HDI microvias at BGA pad-to-inner-layer connections. Match high-speed transceiver trace lengths within +/- 5 mil tolerance. Decouple each transceiver power pin with 0.1 uF and 10 uF capacitors placed within 100 mil of the pin.
The 5CSXFC5D6F31C8N requires multiple supply rails: VCCINT (0.85-1.1V core), VCCAUX (2.5V), VCCPD (2.5/3.0V), VCCIO (1.2-3.3V per bank), HPS_VCC (0.9-1.1V), HPS_VCCIO (1.8-3.3V), and transceiver supplies (1.1V VCCR, 1.1V VCCT, 2.5V VCCA). Use a dedicated sequencer such as the LTC2928 or use the Intel PowerTree recommended ordering. All rails must ramp within 100 ms of each other to prevent latch-up.
Do not omit the configuration mode jumper selection. The 5CSXFC5D6F31C8N supports AS (Active Serial), PS (Passive Serial), JTAG, and FPPx16/FPPx32 fast passive parallel modes — incorrect MSEL[2:0] settings leave the device unconfigured. Also ensure the HPS boot source (BSEL) pins are correctly set for SD card, QSPI, or NAND boot. Refer to the Cyclone V handbook chapter on configuration for the resistor selection table.
Compliance Information
RoHS compliant per Altera/Intel product page. AEC-Q100 not qualified for this commercial-grade 0-85C variant; industrial-temperature variants of Cyclone V SX exist but require separate MPN selection. Conflict minerals declaration available from Intel.