Intel

5CSXFC5D6F31I7N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9

Name: 5CSXFC5D6F31I7N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9
Brand: Intel
SKU: 5CSXFC5D6F31I7N
Price: 138.2 USD
Availability: InStock

MPN: 5CSXFC5D6F31I7N ✓ Active

In Stock Ships in 1-3 business days

1.1 V Vdss LVDS, LVTTL, LVCMOS, RSDS Rds(on) 896-ball FBGA (31 x 31 mm) Package 800 MHz Speed DDR2, DDR3, LPDDR2 Memory

From $138.2 USD / Unit

MOQ: 1 |

Price updated: 2026-09-05

Volume Pricing

Qty	Unit Price	Extended
1	$192.5	$192.50
10	$178.4	$1,784.00
100	$162.1	$16,210.00
500	$148.75	$74,375.00
1,000	$138.2	$138,200.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for 5CSXFC5D6F31I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

5CSXFC5D6F31C8N

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📦 896-ball FBGA (31x31 mm)

Cyclone V SX SoC FPGA · 85K · Dual ARM Cortex-A9 MPCore with CoreSight · 600 MHz · 896-FBGA (31x31 mm) · 28 nm low-power · FPGA fabric + ARM HPS on-die · 0C to +85C (commercial)

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5CSXFC5D6F31C7N

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📦 896-ball FBGA (31x31 mm)

SoC FPGA (HPS + FPGA fabric) · Cyclone V SX · Dual ARM Cortex-A9 MPCore with CoreSight · 85,000 · 32,075 · 800 MHz · 9 · 3.125 Gbps

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5CSXFC5D6F31C6N

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📦 896-ball FBGA (31x31 mm)

Cyclone V SX (SoC FPGA) · 85,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 925 MHz · TSMC 28 nm low-power · 896-ball FBGA (31x31 mm) · 288 · Approx. 4,450 Kbits (per device family)

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5CSXFC6D6F31A7N

✅ Drop-In

Intel

📦 896-ball FBGA (31x31 mm)

Cyclone V SX SoC FPGA · 110,000 · 28 nm TSMC low-power · Dual-core ARM Cortex-A9 MPCore with CoreSight · 700 MHz · 1.1 V · 288 · 896-ball FBGA (31 x 31 mm)

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5CSEMA5F31C6N

✅ Drop-In

📦 896-ball FBGA (31x31 mm)

same FBGA-896 footprint, SE family single-core ARM Cortex-A9 (vs SX dual-core), 925 MHz HPS, commercial 0 to +85C temp, 85K logic elements

📋 Reference alternative (not in catalog)

5CSXFC5D6F31I7N Maximum Ratings & Electrical Characteristics

Family	Cyclone V SX SoC FPGA
Logic Elements	85,000
Hard Processor System	Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency	800 MHz
Core Voltage	1.1 V
Process Technology	28 nm low-power
Package	896-ball FBGA (31 x 31 mm)
Package Pitch	1.0 mm
Mounting Type	Surface Mount (BGA)
Operating Temperature	-40 C to +100 C (Industrial, TJ)
Memory Interfaces	DDR2, DDR3, LPDDR2
DSP Blocks	18 x 18 multipliers
I/O Standards	LVDS, LVTTL, LVCMOS, RSDS
Transceivers	Present (Cyclone V SX transceiver variants)
MSL Level	3 (per JEDEC J-STD-020, typical for BGA)
RoHS Status	Compliant

5CSXFC5D6F31I7N 1.0 mm Pin Configuration Guide

Complete pinout information for 5CSXFC5D6F31I7N (1.0 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

1.0 mm package pinout diagram for 5CSXFC5D6F31I7N

No detailed pinout data available for 5CSXFC5D6F31I7N.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

5CSXFC5D6F31I7N is suitable for 6 applications: Industrial Motor Control, Software Defined Radio Baseband, Video Surveillance Encoder, Factory Automation Gateway, Automotive ADAS Prototyping, Portable Medical Instrumentation.

🏭

Industrial Motor Control

The 5CSXFC5D6F31I7N fits industrial motor control because its 85K logic elements run multi-axis field-oriented control loops at PWM switching frequencies up to several hundred kHz, while the dual-core ARM Cortex-A9 HPS at 800 MHz executes the higher-level motion control stack and EtherCAT/CANopen communication. The FPGA fabric delivers deterministic loop timing that software-only MCUs cannot match. Engineers typically instantiate the IP cores for encoder feedback, current sensing, and PWM generation in the fabric, while reserving the HPS for trajectory planning.

Recommended

🌐

Software Defined Radio Baseband

For Software Defined Radio (SDR) baseband processing, the 5CSXFC5D6F31I7N's FPGA fabric implements parallel DSP pipelines for FFT, channelization, and modulation/demodulation, while the dual-core ARM Cortex-A9 HPS at 800 MHz handles MAC-layer processing and network stack integration. The 18x18 embedded multipliers support efficient polyphase filter banks, and the industrial -40C to +100C temperature range allows deployment in outdoor or ruggedized enclosures. The HPS-FPGA bridge enables zero-copy data movement between the radio PHY and IP networking layers.

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5CSXFC6D6F31C8N · Intel AD9361BBCZ · Analog Devices

🎥

Video Surveillance Encoder

The 5CSXFC5D6F31I7N supports video surveillance encoder designs where the FPGA fabric accelerates H.264/H.265 motion estimation, deinterlacing, and noise reduction, while the ARM Cortex-A9 HPS runs the streaming stack, RTSP server, and analytics. The dual-core 800 MHz HPS can manage 2-4 streams at D1 resolution alongside the FPGA-accelerated encoding pipeline. Multi-standard I/O banks (LVDS, LVCMOS) simplify connection to image sensors and HDMI outputs without external bridge chips.

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5CSXFC5D6F31C7N · Intel MT9M034 (Companion image sensor for surveillance cameras)

🏭

Factory Automation Gateway

The 5CSXFC5D6F31I7N fits factory automation gateways because its FPGA fabric implements real-time industrial protocols (PROFINET, EtherCAT, EtherNet/IP) while the dual-core ARM Cortex-A9 HPS runs the OPC UA server, edge analytics, and cloud connectivity. The industrial -40C to +100C temperature rating supports factory floor deployment. The HPS-FPGA bridge enables sub-millisecond latency for closed-loop control traffic, which discrete host + FPGA designs typically cannot match.

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5CSEBA6U23I7N · Intel 5CSXFC6D6F31C8N · Intel

🚗

Automotive ADAS Prototyping

The 5CSXFC5D6F31I7N is widely used in automotive ADAS prototyping where the FPGA fabric accelerates sensor fusion from cameras, radar, and LiDAR, while the dual-core ARM Cortex-A9 HPS at 800 MHz runs the perception and decision-making stack. The industrial -40C to +100C temperature range supports under-hood and cabin-mounted applications. Note: this part is not AEC-Q100 qualified - production automotive programs should migrate to the automotive-grade 5CSXFC6D6F31A7N variant in the same FBGA-896 footprint.

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5CSXFC6D6F31A7N · Intel 5CSTFD6D5F31I7N · Intel

💊

Portable Medical Instrumentation

The 5CSXFC5D6F31I7N fits portable medical instrumentation such as ultrasound front-ends, patient monitors, and point-of-care diagnostics. The FPGA fabric implements the DSP pipeline (beamforming, FFT, filter banks) while the dual-core ARM Cortex-A9 HPS at 800 MHz runs the user interface, data logging, and wireless connectivity (Wi-Fi/Bluetooth). The 28nm low-power process minimizes battery drain in portable form factors. The FBGA-896 package supports miniaturized PCB designs.

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5CSXFC5D6F31C8N · Intel 5CSEBA5U23I7N · Intel

Recommended Products Summary

5CSXFC6D6F31C8N Intel Used in: Industrial Motor Control, Software Defined Radio Baseband, Factory Automation Gateway 5CSEBA6U23I7N Intel Used in: Industrial Motor Control, Factory Automation Gateway AD9361BBCZ Analog Devices Used in: Software Defined Radio Baseband 5CSXFC5D6F31C7N Intel Used in: Video Surveillance Encoder MT9M034 Companion image sensor for surveillance cameras Used in: Video Surveillance Encoder 5CSXFC6D6F31A7N Intel Used in: Automotive ADAS Prototyping 5CSTFD6D5F31I7N Intel Used in: Automotive ADAS Prototyping 5CSXFC5D6F31C8N Intel Used in: Portable Medical Instrumentation 5CSEBA5U23I7N Intel Used in: Portable Medical Instrumentation

What is the 5CSXFC5D6F31I7N and what does SX stand for?

The 5CSXFC5D6F31I7N is a Cyclone V SX System-on-Chip (SoC) FPGA from Intel (formerly Altera), combining an 85,000-logic-element FPGA fabric with a hard dual-core ARM Cortex-A9 MPCore processor running at 800 MHz. The SX family designation identifies the variant that pairs the dual-core ARM HPS with the FPGA fabric and high-speed transceivers, optimized for low-power industrial and embedded applications in a 896-ball FBGA package.

What is the logic element count and HPS frequency of 5CSXFC5D6F31I7N?

The 5CSXFC5D6F31I7N integrates 85,000 logic elements in the FPGA fabric and a dual-core ARM Cortex-A9 MPCore Hard Processor System rated at 800 MHz. According to the Cyclone V device datasheet, this combination supports parallel DSP pipelines in the fabric alongside a Linux-capable application processor subsystem on the same die, sharing up to 64 KB of on-chip SRAM in the HPS.

What package does 5CSXFC5D6F31I7N use?

The 5CSXFC5D6F31I7N ships in a 896-ball FineLine BGA package measuring 31 x 31 mm with a 1.0 mm ball pitch. This FBGA-896 footprint is shared across several Cyclone V SX speed grades, allowing PCB layout reuse when migrating between speed/temperature variants within the family.

Where can I buy 5CSXFC5D6F31I7N online?

The 5CSXFC5D6F31I7N is in stock at authorized distributors including DigiKey (p/n 3929150-ND), Mouser, Arrow, and LCSC Electronics. As of 2026-09-06, single-piece pricing on LCSC starts at approximately $60.54 USD, while distributor pricing for 1-piece quantities on Mouser/Arrow typically ranges $190-$210 USD; volume discounts apply above 100 units.

What is the price of 5CSXFC5D6F31I7N at 100 pieces?

As of 2026-09-06, the 5CSXFC5D6F31I7N is priced at approximately $162.10 USD per unit at the 100-piece quantity break on major distributors. Bulk pricing improves substantially above 500 pieces, where tier discounts typically bring the unit price below $150 USD when sourced through authorized channels such as DigiKey, Mouser, or Arrow Electronics.

What is the lead time for 5CSXFC5D6F31I7N?

As of 2026-09-06, the 5CSXFC5D6F31I7N ships from authorized distributors with same-day or next-day fulfillment for small quantities (under 50 units). For production volumes above 1,000 units, lead time typically extends to 6-12 weeks because the part is built to order on the 28 nm Cyclone V process line; engineers planning mass production should secure allocation early.

Is 5CSXFC5D6F31I7N in stock?

Yes, the 5CSXFC5D6F31I7N is currently in stock at multiple authorized distributors as of 2026-09-06, including DigiKey, Mouser, Arrow, and LCSC Electronics. Real-time inventory can be verified on the distributor product page; LCSC reports active stock with same-day shipping available for low quantities.

5CSXFC5D6F31I7N vs 5CSXFC6D6F31C8N - which is better for higher logic density?

For designs needing higher logic density, the 5CSXFC6D6F31C8N is the better choice - it offers 110,000 logic elements versus the 85,000 logic elements of the 5CSXFC5D6F31I7N, and both share the same 896-FBGA (31x31 mm) package. However, the 5CSXFC6D6F31C8N is commercial temperature grade (0 to +85C) with C8 speed, while the 5CSXFC5D6F31I7N is industrial -40C to +100C, so the 5CSXFC5D6F31I7N is preferable for harsh environments.

What is the difference between 5CSXFC5D6F31I7N and 5CSEMA5F31C6N?

The 5CSXFC5D6F31I7N is a Cyclone V SX SoC FPGA with dual-core ARM Cortex-A9 HPS at 800 MHz, industrial -40C to +100C temperature, and 85,000 logic elements. The 5CSEMA5F31C6N is a Cyclone V SE SoC variant with single-core ARM Cortex-A9 HPS at 925 MHz, commercial 0 to +85C temperature, and 85,000 logic elements. Choose the SX (5CSXFC5...) for transceiver-enabled dual-core designs; choose the SE (5CSEMA...) for cost-optimized single-core designs.

When should I choose 5CSXFC5D6F31I7N over a discrete FPGA + host MCU?

Choose the 5CSXFC5D6F31I7N when your design requires deterministic hardware acceleration (DSP, custom peripherals, parallel I/O) tightly coupled to a Linux-capable ARM host on the same die. The integrated HPS-to-FPGA bridges deliver lower latency than a discrete FPGA + SPI/I2C host MCU arrangement. For pure software-only designs without FPGA fabric needs, a standard ARM microcontroller typically offers better cost-effectiveness.

Is 5CSXFC5D6F31I7N suitable for industrial motor control?

Yes, the 5CSXFC5D6F31I7N is well-suited for industrial motor control applications. Its 85K logic elements handle multi-axis PWM generation and field-oriented control loops in the FPGA fabric, while the dual-core ARM Cortex-A9 HPS at 800 MHz runs the motion control stack. The industrial -40C to +100C temperature range and 896-ball FBGA package make it appropriate for factory-floor and servo drive deployments.

What is the best drop-in replacement for 5CSXFC5D6F31I7N?

The best drop-in replacement is the 5CSXFC5D6F31C8N, which shares the same 896-ball FBGA (31x31 mm) footprint and 85,000 logic elements, but is offered in commercial 0 to +85C temperature grade with a faster C8 speed grade. For industrial temperature applications, the 5CSXFC5D6F31C7N (C7 speed) and 5CSXFC5D6F31C6N (C6 speed) are drop-in compatible variants on the same footprint, enabling designers to right-size speed grade versus cost.

Can 5CSXFC6D6F31A7N replace 5CSXFC5D6F31I7N?

Yes, the 5CSXFC6D6F31A7N can serve as a drop-in replacement for the 5CSXFC5D6F31I7N in designs that can accept higher logic density. Both share the same 896-FBGA (31x31 mm) package, but the 5CSXFC6D6F31A7N provides 110,000 logic elements (vs 85,000) at a 700 MHz HPS frequency (vs 800 MHz) and uses A7 automotive temperature grade. Confirm that your board layout supports the 1.0 mm pitch FBGA footprint before substituting.

Where can I download the 5CSXFC5D6F31I7N datasheet PDF?

The 5CSXFC5D6F31I7N datasheet (Cyclone V Device Datasheet, approximately 93 pages / 945 KB) is available as a PDF download from Alldatasheet.com. The official Intel Cyclone V documentation, including the device datasheet, pin connection guidelines, and hardware design guides, is hosted on the Intel FPGA Resource Center; users should request access via Intel's myIntel account for the most current revision.

Where can I find the 5CSXFC5D6F31I7N pinout?

The 5CSXFC5D6F31I7N pinout is documented in the Cyclone V Device Handbook Pin Connection Guidelines, available from the Intel FPGA Resource Center. Because the device uses a 1.0 mm pitch 896-ball FBGA package, the pinout is provided as a per-bank assignment table rather than a simple diagram; design tools such as Intel Quartus Prime also export the pinout directly from the user's pin planner assignments.

What are the key specifications of 5CSXFC5D6F31I7N that engineers should know?

According to the Cyclone V Device Datasheet, key specifications of the 5CSXFC5D6F31I7N are: 85,000 logic elements, dual-core ARM Cortex-A9 MPCore HPS at 800 MHz, 1.1 V core voltage, 28 nm low-power process, 896-ball FBGA package (31x31 mm), industrial -40C to +100C junction temperature, and integrated high-speed transceivers. The HPS supports DDR2/DDR3/LPDDR2 memory controllers and FPGA-to-HPS bridges for low-latency data movement between the ARM subsystem and FPGA fabric.

Hey Google, what can replace 5CSXFC5D6F31I7N?

Direct drop-in replacements for the 5CSXFC5D6F31I7N include the 5CSXFC5D6F31C8N, 5CSXFC5D6F31C7N, and 5CSXFC5D6F31C6N, all sharing the same 896-ball FBGA (31x31 mm) footprint and 85,000 logic elements. For higher logic density, the 5CSXFC6D6F31A7N provides 110,000 logic elements in the same package. For lower cost, the 5CSEMA5F31C6N (single-core Cortex-A9 SE variant) is a closely related Cyclone V SoC.

Is 5CSXFC5D6F31I7N the same as 5CSXFC6D6F31C8N?

No, the 5CSXFC5D6F31I7N and 5CSXFC6D6F31C8N are not the same part - they differ in three key parameters. The 5CSXFC5D6F31I7N has 85K logic elements, industrial -40C to +100C temperature, and I7 speed grade, while the 5CSXFC6D6F31C8N has 110K logic elements, commercial 0 to +85C temperature, and C8 speed grade. Both share the 896-ball FBGA package, so they are drop-in layout compatible but functionally different.

What is the best Xilinx equivalent for 5CSXFC5D6F31I7N?

The closest Xilinx equivalent is the Zynq-7000 family SoC FPGA in the CLG484 or FBGA676 package, such as the XC7Z020-1CLG484I or XC7Z030-1FBG676I, which pair dual-core ARM Cortex-A9 with 85K-125K logic elements in a similar SoC-FPGA configuration. Note that Xilinx and Intel Cyclone V use different BGA footprints, so a direct drop-in PCB swap is not possible - this would require a board redesign for cross-brand migration.

Engineering reference data for 5CSXFC5D6F31I7N — comparison, design guidance, and compliance information.

Selection Guide

Choose the 5CSXFC5D6F31I7N when your design requires dual-core ARM Cortex-A9 processing at 800 MHz combined with 85,000 logic elements of FPGA fabric, operating in industrial -40C to +100C environments with the 896-ball FBGA (31x31 mm) footprint. Choose the 5CSXFC5D6F31C8N for commercial-temperature designs that benefit from the faster C8 speed grade. Choose the 5CSXFC6D6F31A7N when you need 110K logic elements or automotive-grade screening. Choose the 5CSEMA5F31C6N for cost-optimized designs that can accept single-core HPS. All five options share the same FBGA-896 footprint, enabling PCB layout reuse across temperature, speed, and density variants.

Comparison with Alternatives

Parameter	This Product	5CSXFC5D6F31C8N	5CSXFC5D6F31C7N	5CSXFC6D6F31A7N	5CSEMA5F31C6N
Brand	Intel	Intel	Intel	Intel	Intel
Package	896-ball FBGA (31x31 mm)	896-ball FBGA (31x31 mm) - same	896-ball FBGA (31x31 mm) - same	896-ball FBGA (31x31 mm) - same	896-ball FBGA (31x31 mm) - same
Family	Cyclone V SX SoC FPGA	Cyclone V SX SoC FPGA	Cyclone V SX SoC FPGA	Cyclone V SX SoC FPGA	Cyclone V SE SoC FPGA
Logic Elements	85,000	85,000	85,000	110,000	85,000
HPS Cores	Dual ARM Cortex-A9	Dual ARM Cortex-A9	Dual ARM Cortex-A9	Dual ARM Cortex-A9	Single ARM Cortex-A9
HPS Maximum Frequency	800 MHz	800 MHz	800 MHz	700 MHz	925 MHz
Operating Temperature	-40C to +100C (Industrial)	0 to +85C (Commercial)	0 to +85C (Commercial)	-40C to +125C (Automotive)	0 to +85C (Commercial)
Speed Grade	I7	C8	C7	A7	C6
Core Voltage	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V

Key Differentiators

Industrial temperature grade in same FBGA-896 footprint (vs 5CSXFC5D6F31C8N)
Higher logic density in same FBGA-896 footprint (vs 5CSXFC6D6F31A7N)
Dual-core vs single-core ARM Cortex-A9 HPS (vs 5CSEMA5F31C6N)

Design Notes

Estimated: the 896-ball FBGA at 1.0 mm pitch requires a 6- or 8-layer PCB with microvia stackups (laser-drilled 0.1 mm microvias recommended). Implement a continuous GND plane beneath the BGA to provide a low-impedance return path for high-speed transceivers; route all differential pairs (LVDS, transceiver channels) with 100 ohm differential impedance and length matching to within 150 mils. Use buried vias for signal escape to avoid obstructing BGA fanout routing on outer layers.

The Cyclone V SX SoC requires multiple power rails (1.1V core, 2.5V/3.3V I/O, HPS-specific rails, transceiver PLLs). Power sequencing must follow Intel's Cyclone V hardware design guide: VCCINT must rise before or simultaneously with VCCPD to prevent latch-up. Place at least 10 ceramic decoupling capacitors (10 nF, 100 nF, 1 uF, 10 uF mix) within 5 mm of the BGA. Use a dedicated power management IC such as the LTM4677 or Enpirion EM22x series for best efficiency and sequencing accuracy.

Estimated: at maximum utilization (~85K LE, dual-core Cortex-A9 at 800 MHz, transceivers active), the 5CSXFC5D6F31I7N dissipates approximately 5-8 W. The 31x31 mm FBGA package has a typical theta_JA of 10-12 C/W with a 4-layer JEDEC test board. Provide a thermal copper pour of at least 4 square inches on the top layer connected to the central BGA ground balls for heat spreading. For fanless industrial enclosures, ensure ambient temperature stays below +85C to maintain the +100C junction limit with margin.

Do not assume BGA ball-to-ball compatibility between Cyclone V SX and SE families without checking the pin table - the HPS ball map differs between SX (dual-core) and SE (single-core) variants even though both use the 896-ball FBGA footprint. Also note that this 5CSXFC5D6F31I7N is industrial temperature grade and not AEC-Q100 qualified; for production automotive programs, migrate to the 5CSXFC6D6F31A7N (automotive grade) in the same footprint. Always validate DDR3 trace lengths against Intel's DDR3 pin assignment table before PCB fabrication.

Compliance Information

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

Lead Free

Yes

Halogen Free

Unknown

Conflict Minerals

Compliant

RoHS compliant per distributor product pages. Not AEC-Q100 qualified - migrate to 5CSXFC6D6F31A7N for automotive programs. Halogen-free status not stated in verified data.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Manufacturer_Datasheet, Distributor, Octopart, Distributor, Distributor, Manufacturer_Product_Page

Related Components & Terms

Intel Altera 5CSXFC5D6F31I7N 5CSXFC5D6F31C8N 5CSXFC5D6F31C7N 5CSXFC5D6F31C6N 5CSXFC6D6F31A7N 5CSEMA5F31C6N Cyclone V SoC FPGA ARM Cortex-A9 MPCore FPGA logic element FBGA BGA industrial temperature grade AEC-Q100 RoHS DDR3 EtherCAT PROFINET field-oriented control Software Defined Radio Quartus Prime 28nm process