5CSXFC6D6F31C6N - Cyclone V SX SoC FPGA 110K LE | Intel
MPN: 5CSXFC6D6F31C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $398.5 | $3,985.00 |
| 100 | $360 | $36,000.00 |
| 500 | $320 | $160,000.00 |
| 1,000 | $285 | $285,000.00 |
Drop-in alternatives for 5CSXFC6D6F31C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSXFC6D6F31A7N
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View Datasheet →5CSXFC6D6F31C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →5CSXFC5D6F31C7N
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$285 / Unit
View Datasheet →5CSXFC5D6F31C8N
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View Datasheet →5CSXFC5D6F31C6N
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View Datasheet →5CSXFC6D6F31C6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SX |
| Architecture | SoC FPGA (FPGA + Hard Processor System) |
| Logic Elements | 110,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| Embedded Memory (FPGA Fabric) | 5.44 Mbit |
| DSP Blocks (18x18 Multipliers) | 112 |
| User I/O Count | 288 |
| Package | 896-FBGA (31x31 mm) |
| Process Technology | TSMC 28 nm low-power |
| PLLs | 6 |
| Transceiver Blocks | 6 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (commercial grade C6 speed grade) |
| RoHS Status | Compliant |
5CSXFC6D6F31C6N 896-fbga (31x31 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC6D6F31C6N (896-fbga (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC6D6F31C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC6D6F31C6N is suitable for 7 applications: Industrial Motor Control and Drive, Machine Vision and Video Pipeline, Wireless Backhaul Baseband Processing, Automotive Driver Assistance ADAS, Video Surveillance Network Recorder, Factory Automation and Programmable Logic Controller, Aerospace Image Processing Payload.
Industrial Motor Control and Drive
The 5CSXFC6D6F31C6N is well suited for industrial motor control because the dual-core ARM Cortex-A9 HPS runs the real-time control loop at 925 MHz while the 112 DSP blocks execute field-oriented control (FOC), space-vector PWM, and Clarke/Park transforms in hardware. The 5.44 Mbit embedded SRAM buffers encoder feedback and current-sense samples per PWM cycle, enabling deterministic sub-microsecond loop times without external FIFOs. The HPS multiport SDRAM controller supports ECC-protected DDR3 for firmware logs and fault histories. Per the Cyclone V Device Datasheet, the device operates from -40C to +100C commercial grade, suitable for factory-floor cabinet installations.
Recommended
Machine Vision and Video Pipeline
The 5CSXFC6D6F31C6N's 110K logic elements and 112 18x18 multipliers provide the throughput needed for mid-resolution machine vision pipelines such as defect detection, barcode reading, and optical inspection. Image acquisition through a Camera Link or MIPI CSI-2 interface runs in the FPGA fabric while preprocessing kernels (Sobel, Gaussian, threshold) execute on DSP blocks in parallel. The dual-core HPS handles GigE Vision protocol stack, image metadata tagging, and Ethernet-based command/response at up to 925 MHz. Per Altera's Cyclone V datasheet, the integrated PCIe Gen2 hard IP block enables direct camera frame transfer to a host PC at 5 Gbps with minimal host-CPU involvement.
Recommended
Wireless Backhaul Baseband Processing
The 5CSXFC6D6F31C6N handles baseband DSP for small-cell and microwave backhaul links using its 112 hardware multipliers to implement FFT, channel estimation, and QAM modulation/demodulation at sample rates up to 245.76 MHz. The dual-core ARM Cortex-A9 runs the L2/L3 protocol stack, MAC scheduler, and OAM agent at 925 MHz, offloading timing-critical MAC-PHY interaction to the FPGA fabric for sub-100 ns latency. Per the Cyclone V datasheet, the 6 transceiver blocks deliver up to 5 Gbps per channel for CPRI or OBSAI fronthaul links to a remote radio head. The 288 GPIO provide ample LVDS lanes for parallel ADC/DAC interfaces at baseband sampling rates.
Recommended
Automotive Driver Assistance ADAS
The 5CSXFC6D6F31C6N supports ADAS front-camera or surround-view processing by combining HPS-run perception algorithms with FPGA-accelerated image preprocessing. Sensor fusion from multiple LVDS camera inputs uses the FPGA fabric's parallel pipeline, while the dual-core ARM Cortex-A9 runs object detection, lane-marking recognition, and adaptive-cruise-control logic. The 5.44 Mbit embedded memory buffers 720p frame buffers at 30 fps without external SRAM for the preprocessing chain. Per the Altera Cyclone V SX datasheet, this part is commercial-grade; for AEC-Q100-qualified automotive applications, designers should select the 5CSXFC6D6F31I7N industrial-temperature variant or move to Cyclone V SoC with automotive qualification.
Recommended
Video Surveillance Network Recorder
The 5CSXFC6D6F31C6N powers a hybrid NVR by encoding H.264/H.265 streams from analog and IP cameras in the FPGA fabric's 110K logic elements while the ARM Cortex-A9 manages ONVIF/RTSP networking, motion-detection analytics, and storage control at 925 MHz. The dual-core HPS runs embedded Linux for filesystem management, RAID-aware recording, and web-based UI serving. The integrated multiport SDRAM controller supports DDR3 with ECC for reliable 24/7 operation in unattended installations. Per the Cyclone V datasheet, six transceiver blocks enable 10 GbE uplink connectivity without external PHYs, reducing BOM for high-channel-count deployments.
Recommended
Factory Automation and Programmable Logic Controller
The 5CSXFC6D6F31C6N serves as a soft-PLC plus motion-controller hybrid where the HPS runs IEC 61131-3 runtime (CODESYS or proprietary) and the FPGA fabric implements deterministic I/O handling at 100 kHz rates. EtherCAT, PROFINET, or EtherNet/IP master stacks execute on the HPS at 925 MHz, while the FPGA fabric handles distributed-clock sync and process-data telegram parsing in hardware. The 288 GPIO support dozens of industrial I/O channels with hardware debouncing and timestamp capture. Per the Altera Cyclone V datasheet, the industrial temperature variants provide reliable operation in factory cabinets where ambient temperatures exceed commercial-grade limits.
Recommended
Aerospace Image Processing Payload
The 5CSXFC6D6F31C6N processes high-resolution imagery from UAV or satellite imaging payloads by handling JPEG2000 compression or lossless packing in the FPGA fabric while the dual-core HPS runs geotagging, telemetry overlay, and data downlink formatting. Radiation-tolerant considerations are addressed via Triple Modular Redundancy (TMR) implemented in the 110K logic elements for SEU mitigation in low-earth-orbit applications. The 5.44 Mbit embedded SRAM provides on-chip frame buffering, and the integrated PCIe Gen2 hard IP enables Camera Link or LVDS sensor ingest at 5 Gbps aggregate bandwidth. Per the Cyclone V datasheet, the 896-FBGA package and 288 GPIO support high-speed parallel interfaces required for hyperspectral imaging.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC6D6F31C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6D6F31A7N | 5CSXFC6D6F31C7N | 5CSXFC5D6F31C7N | 5CSXFC5D6F31C8N | 5CSXFC5D6F31C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) |
| Logic Elements | 110,000 | 110,000 | 110,000 | 85,000 | 85,000 | 85,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore |
| HPS Max Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Speed Grade | C6 | A7 | C7 | C7 | C8 | C6 |
| Embedded Memory | 5.44 Mbit | 5.44 Mbit | 5.44 Mbit | 4.46 Mbit | 4.46 Mbit | 4.46 Mbit |
| DSP Blocks (18x18) | 112 | 112 | 112 | 87 | 87 | 87 |
| User I/O | 288 | 288 | 288 | 288 | 288 | 288 |
| Operating Temperature | 0C to +100C (Commercial) | 0C to +100C (Commercial) | 0C to +100C (Commercial) | 0C to +100C (Commercial) | 0C to +100C (Commercial) | 0C to +100C (Commercial) |
Key Differentiators
- Higher logic element density than 5CSXFC5D6F31C7N in same 896-FBGA footprint (vs 5CSXFC5D6F31C7N)
- C6 speed grade balances Fmax and power versus C7 variants (vs 5CSXFC6D6F31C7N)
- Dual-core ARM Cortex-A9 HPS integrated on-chip eliminates external processor (vs 5CGTFD9A5U19A7N)
Design Notes
The 896-FBGA (31x31 mm) package has 1.0 mm ball pitch and requires a multi-layer PCB with microvia or laser-drilled via stack-ups for fan-out. Per the Altera Cyclone V Device Datasheet pin connection guidelines, route DDR3 SDRAM, transceiver channels, and clock signals with 50 ohm controlled-impedance traces on inner stripline layers. Decoupling capacitors must be placed directly under the BGA on the bottom side using via-in-pad technology to minimize inductance.
The 5CSXFC6D6F31C6N requires separate power rails for the HPS core, FPGA core, PLL analog supply, and I/O banks. Use a multi-rail power management IC such as the LTM4677 or EM21XX family with sequencing to ensure HPS comes up before FPGA fabric if boot from FPGA is used. Estimated: at 110K LE utilization with 50% toggle rate and 925 MHz HPS, total power is approximately 5-8 W depending on I/O switching - design the PCB thermal solution accordingly with copper pours and via arrays under the package.
The 896-FBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12 C/W with 8 thermal vias under the package center pad. For continuous full-load operation in a sealed enclosure, attach a heatsink via thermal interface material (TIM) to the package lid or use forced-air cooling. Estimated: at 6 W total power dissipation, the junction temperature rises 72 C above ambient without airflow, requiring derating above 25 C ambient for industrial applications.
Do not confuse the 'N' suffix speed grade with the temperature grade - the 5CSXFC6D6F31C6N is C6 commercial grade with 0C to +100C operating range. For industrial temperature applications, select the 5CSXFC6D6F31I7N variant. Also note that all HPS-FPGA bridge interfaces (AXI bridges, FPGA-to-HPS SDRAM, HPS-to-FPGA) must be configured in Quartus Prime Qsys before bitstream generation, otherwise the HPS will fail to boot when the FPGA fabric loads.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. Not AEC-Q100 qualified - for automotive applications, consider the 5CSXFC6D6F31I7N industrial-temperature variant or contact Intel for automotive-grade Cyclone V SX SoC options. Lead-free and halogen-free per Cyclone V family datasheet.
