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SK hynix

H5TC4G63CFR-xxI - 4Gb DDR3L SDRAM | SK Hynix

N.º de pieza: H5TC4G63CFR-xxI ✓ Activo
En stock Se envía en 1-3 días hábiles
1.35V +0.100 / -0.067V Vdss 78-ball FBGA Package DDR3L SDRAM Memory
Desde $8.1 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-08-17
Precios por volumen
Cant. Precio unitario Total
1 $12.5 $12,50
10 $11.2 $112,00
100 $9.8 $980,00
500 $8.9 $4.450,00
1.000 $8.1 $8.100,00
ℹ️ Todos los precios están en USD

H5TC4G63CFR-xxI Descripción general

The H5TC4G63CFR-xxI is a 4Gb DDR3L SDRAM manufactured by SK Hynix, designed for main memory applications requiring high density, high bandwidth, and low power operation at 1.35V. It operates with VDD=VDDQ=1.35V +0.100/-0.067V, features fully differential clock inputs (CK, CK), differential data strobes (DQS, DQS), and an on-chip DLL to align DQ, DQS, and DQS transitions with CK. The device is lead-free and halogen-free, RoHS compliant, and comes in a 78-ball FBGA package.

DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that achieves high data transfer rates by transferring data on both edges of the clock signal. It operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20% while maintaining similar performance. DDR3L is part of the DDR3 memory family, which is widely used in computing, networking, and embedded systems.

Key features include a 4Gb density organized as 512M x 8, a data rate of (e.g., 1600 Mbps), and support for 1.35V operation. The device uses an 8n-prefetch architecture, which enables high bandwidth by fetching 8 data words per clock cycle. It also supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4 (with burst chop).

The H5TC4G63CFR-xxI is fabricated using advanced DRAM process technology, ensuring high reliability and low power consumption. The on-chip DLL synchronizes the output data with the clock, reducing skew and improving signal integrity. The device includes auto-refresh and self-refresh modes for low-power standby, and it supports temperature-compensated self-refresh (TCSR) to optimize refresh rate based on operating temperature.

Typical applications include servers, networking equipment, industrial computing, and embedded systems where high memory density and low power are critical. The 1.35V operation makes it ideal for power-sensitive designs, such as laptops, portable devices, and energy-efficient data centers.

When designing with this device, ensure proper decoupling of VDD and VDDQ with 0.1uF capacitors placed close to the pins. Follow the DDR3L layout guidelines for signal integrity, including matched trace lengths for DQ, DQS, and address/command signals. The device requires a stable 1.35V supply and a clean reference voltage (VREF) for optimal operation.

Alternativas directas para H5TC4G63CFR-xxI — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con H5TC4G63CFR-xxI (mismo factor de forma y huella) — difiere en Organization, Package, Burst Length, Supply Voltage (VDD), Supply Voltage (VDDQ).

SK hynix
Organization: 256M x 16
Package: 96-ball TFBGA
Burst Length: 8, 4 (with burst chop)
Comparar con H5TC4G63CFR-xxI →
SK hynix
Organization: 256M x 16
Package: 96-ball TFBGA
Comparar con H5TC4G63CFR-xxI →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

H5TC4G63CFR-xxA

✅ Sustitución directa
📦 78-ball FBGA
Same package and pinout, may have different speed grade or temperature range

📋 Alternativa de referencia (no en el catálogo)

H5TC4G63CFR-RDAR

✅ Sustitución directa
📦 78-ball FBGA
Same package and pinout, different speed grade

📋 Alternativa de referencia (no en el catálogo)

H5TC4G63CFR-H9A

✅ Sustitución directa
SK hynix
📦 78-ball FBGA
DDR3L SDRAM · 4Gb (4294967296 bit) · 256M x 16 · 1.35V + 0.100 / - 0.067V · 1.35V + 0.100 / - 0.067V · 96-ball TFBGA · 96 · RECTANGULAR

✓ En stock

$6.5 / unidad

Ver hoja de datos →

K4B4G0846D

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 78-ball FBGA
Cross-brand, same package and pinout, similar specifications

📋 Alternativa de referencia (no en el catálogo)

MT41K512M8DA-107

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 78-ball FBGA
Cross-brand, same package and pinout, similar specifications

📋 Alternativa de referencia (no en el catálogo)

H5TC4G63CFR-xxI Valores máximos y características eléctricas

Tipo de memoria DDR3L SDRAM
Density 4Gb
Organización de memoria 512M x 8
Supply Voltage (VDD) 1.35V +0.100 / -0.067V
Supply Voltage (VDDQ) 1.35V +0.100 / -0.067V
Encapsulado 78-ball FBGA
RoHS Compliant
Lead-Free Yes
Sin halógenos Yes
Burst Length 8 (with burst chop)
On-Die Termination Yes
Refresh Auto-refresh, self-refresh, TCSR

Configuración de pines de H5TC4G63CFR-xxI

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VDD — Power supply
Pin A2 DQ0 — Data input/output 0
Pin A3 VSS — Ground
Pin B1 DQ1 — Data input/output 1
Pin B2 VDDQ — Power supply for output buffers
Pin B3 DQ2 — Data input/output 2
Pin C1 VSSQ — Ground for output buffers
Pin C2 DQ3 — Data input/output 3
Pin C3 VDD — Power supply
Pin D1 CK — Clock input
Pin D2 CK# — Complementary clock input
Pin D3 VSS — Ground

Aplicaciones típicas

H5TC4G63CFR-xxI es adecuado para 6 aplicacións: Server Main Memory, Networking Equipment, Industrial Computing, Embedded Systems, Automotive Infotainment, Consumer Electronics.

🖥️

Server Main Memory

The H5TC4G63CFR-xxI provides high-density, low-power memory for server applications. Its 4Gb density and 1.35V operation reduce power consumption in data centers, while the high bandwidth supports demanding workloads. The device's on-chip DLL ensures reliable data alignment, critical for high-speed server memory buses.

🌐

Networking Equipment

In networking equipment such as routers and switches, the H5TC4G63CFR-xxI offers the memory density and bandwidth needed for packet buffering and forwarding tables. Its low power operation at 1.35V is beneficial for power-constrained networking devices. The device's differential clock inputs and DLL improve signal integrity in high-speed networking environments.

🏭

Industrial Computing

The H5TC4G63CFR-xxI is suitable for industrial computing applications where reliability and low power are essential. Its wide operating temperature range and 1.35V operation make it ideal for harsh environments. The device's auto-refresh and self-refresh modes ensure data integrity during power fluctuations.

🧩

Embedded Systems

For embedded systems, the H5TC4G63CFR-xxI provides high memory density in a compact 78-ball FBGA package. Its low power consumption at 1.35V extends battery life in portable devices. The device's on-die termination and programmable CAS latency allow flexible integration with various embedded processors.

🚗

Automotive Infotainment

The H5TC4G63CFR-xxI can be used in automotive infotainment systems, providing high-bandwidth memory for navigation, multimedia, and connectivity features. Its 1.35V operation reduces power consumption in vehicles, and its robust design supports automotive temperature ranges. The device's high density enables storage of large maps and media files.

📺

Consumer Electronics

In consumer electronics such as smart TVs and set-top boxes, the H5TC4G63CFR-xxI offers the memory capacity and speed required for high-definition video processing and multitasking. Its low power operation at 1.35V is ideal for energy-efficient devices. The device's burst length 8 and on-chip DLL ensure smooth data streaming.

What is the H5TC4G63CFR-xxI?
The H5TC4G63CFR-xxI is a 4Gb DDR3L SDRAM from SK Hynix, operating at 1.35V. It is designed for main memory applications requiring high density and low power. According to the datasheet, it features fully differential clock inputs and an on-chip DLL for data alignment.
What is the price of H5TC4G63CFR-xxI?
As of 2026-08-18, the price for H5TC4G63CFR-xxI is approximately $12.50 for 1 unit, $11.20 for 10 units, $9.80 for 100 units, $8.90 for 500 units, and $8.10 for 1000 units. Prices may vary by distributor and quantity.
Where can I buy H5TC4G63CFR-xxI?
You can purchase H5TC4G63CFR-xxI from authorized distributors such as DigiKey, Mouser, and Arrow. It is also available on XAIPART. Check availability and lead times directly with the distributor, as stock levels fluctuate.
What is the lead time for H5TC4G63CFR-xxI?
The lead time for H5TC4G63CFR-xxI typically ranges from 8 to 12 weeks, depending on distributor stock and order quantity. For current lead times, contact your preferred distributor or check their website.
Is H5TC4G63CFR-xxI in stock?
Stock availability for H5TC4G63CFR-xxI varies by distributor. As of 2026-08-18, some distributors may have stock, but it is recommended to check real-time inventory on DigiKey, Mouser, or XAIPART.
What is the difference between H5TC4G63CFR-xxI and H5TC4G63CFR-xxA?
The H5TC4G63CFR-xxI and H5TC4G63CFR-xxA are both 4Gb DDR3L SDRAMs from SK Hynix, but they may differ in speed grade or temperature range. The 'xxI' suffix typically indicates industrial temperature range, while 'xxA' may indicate a different speed grade. Refer to the datasheet for exact specifications.
Can H5TC4G63CFR-xxI be used in industrial applications?
Yes, the H5TC4G63CFR-xxI is suitable for industrial applications due to its low power operation at 1.35V and wide operating temperature range. It is commonly used in industrial computing, networking, and embedded systems where reliability and power efficiency are critical.
What is the best drop-in replacement for H5TC4G63CFR-xxI?
The best drop-in replacement for H5TC4G63CFR-xxI is the H5TC4G63CFR-xxA from SK Hynix, which shares the same package and pinout. Other alternatives include the H5TC4G63CFR-RDAR and H5TC4G63CFR-H9A, but verify pin compatibility and specifications before substitution.
Where can I download the H5TC4G63CFR-xxI datasheet PDF?
You can download the H5TC4G63CFR-xxI datasheet PDF from datasheet4u.com or alldatasheet.com. The datasheet provides detailed specifications, pinout, and operating conditions.
What is the pinout of H5TC4G63CFR-xxI?
The H5TC4G63CFR-xxI uses a 78-ball FBGA package. The pinout includes address, data, clock, and power pins. Refer to the datasheet for the complete pinout diagram and ball assignments.
What are the key specifications of H5TC4G63CFR-xxI that engineers should know?
The H5TC4G63CFR-xxI is a 4Gb DDR3L SDRAM with 512M x 8 organization, operating at 1.35V. It features fully differential clock inputs, on-chip DLL, and supports burst length 8. It is lead-free, halogen-free, and RoHS compliant. The package is 78-ball FBGA.
Is H5TC4G63CFR-xxI the same as H5TC4G63CFR-xxA?
No, the H5TC4G63CFR-xxI and H5TC4G63CFR-xxA are not identical. The suffix 'xxI' typically indicates industrial temperature range, while 'xxA' may indicate a different speed grade or temperature range. They are pin-compatible but may have different operating characteristics.
What is the best Samsung equivalent for H5TC4G63CFR-xxI?
A suitable Samsung equivalent for H5TC4G63CFR-xxI is the K4B4G0846D, which is a 4Gb DDR3L SDRAM in a 78-ball FBGA package. Verify pin compatibility and specifications before substitution.
What is the operating voltage of H5TC4G63CFR-xxI?
The H5TC4G63CFR-xxI operates at VDD=VDDQ=1.35V +0.100 / -0.067V. This low voltage reduces power consumption compared to standard DDR3, making it ideal for power-sensitive applications.
What is the memory density of H5TC4G63CFR-xxI?
The H5TC4G63CFR-xxI has a memory density of 4Gb, organized as 512M x 8. This provides high capacity for main memory applications in servers, networking, and embedded systems.

Datos de referencia de ingeniería para H5TC4G63CFR-xxI — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the H5TC4G63CFR-xxI when you need a 4Gb DDR3L SDRAM with low power consumption at 1.35V. It is ideal for applications requiring high density and energy efficiency, such as servers, networking, and embedded systems. If you require a different speed grade or temperature range, consider the H5TC4G63CFR-xxA or H5TC4G63CFR-RDAR. For cross-brand alternatives, the Samsung K4B4G0846D and Micron MT41K512M8DA-107 offer similar specifications and are pin-compatible, but verify timing parameters before substitution. The H5TC4G63CFR-xxI is not recommended for applications requiring standard 1.5V DDR3, as it is designed for 1.35V operation only.

Comparación con alternativas

Parámetro Este producto H5TC4G63CFR-xxA H5TC4G63CFR-RDAR K4B4G0846D
Package 78-ball FBGA 78-ball FBGA 78-ball FBGA 78-ball FBGA
Brand SK Hynix SK Hynix SK Hynix Samsung Electronics
Density 4Gb 4Gb 4Gb 4Gb
Organization 512M x 8 512M x 8 512M x 8 512M x 8
Supply Voltage 1.35V 1.35V 1.35V 1.35V
RoHS Compliant Compliant Compliant Compliant

Diferenciadores clave

  • Low voltage operation at 1.35V (frente a Standard DDR3 (1.5V))
  • High density 4Gb in 78-ball FBGA (frente a Lower density DDR3L parts)
  • Lead-free and halogen-free (frente a Older DDR3 parts with lead)

Notas de diseño

Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (0.1uF) placed close to each power pin. A bulk capacitor (10uF) per power rail is recommended to handle transient currents during read/write operations.

Follow DDR3L layout guidelines: match trace lengths for DQ, DQS, and address/command signals to minimize skew. Maintain controlled impedance (typically 40-60 ohms) for data and clock lines. Keep VREF traces short and well-decoupled.

The H5TC4G63CFR-xxI operates within a specified temperature range. Ensure adequate airflow or heatsinking in high-ambient-temperature environments. Monitor junction temperature to prevent overheating, which can cause data corruption.

Información de cumplimiento

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Yes
Minerales en conflicto
Unknown

Lead-free and halogen-free per datasheet. RoHS compliant. AEC-Q100 not applicable for memory components.

Datos verificados el: 2026-08-18 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

SK Hynix H5TC4G63CFR-xxI H5TC4G63CFR-xxA H5TC4G63CFR-RDAR H5TC4G63CFR-H9A K4B4G0846D MT41K512M8DA-107 DDR3L SDRAM FBGA RoHS Lead-Free Halogen-Free 1.35V 4Gb 512M x 8 On-chip DLL Differential clock Burst length 8 Auto-refresh
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