H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix
N.º de pieza: H5TC4G63CFR-H9A ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.5 | $6.500,00 |
H5TC4G63CFR-H9A Descripción general
DDR3L SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining backward compatibility with DDR3 environments. It is part of the DDR3 memory family, which uses double data rate architecture to transfer data on both edges of the clock, achieving high bandwidth. DDR3L is widely used in laptops, embedded systems, and networking equipment where energy efficiency is critical.
Key features include fully differential clock inputs (CK, CK), differential data strobe (DQS, DQS), and an on-chip DLL that aligns DQ, DQS, and DQS transitions with CK transitions. The DM (data mask) function masks write data at both rising and falling edges, ensuring data integrity. The device supports burst lengths of 8 and 4 (with burst chop), and features programmable CAS latency and additive latency for flexible timing.
The H5TC4G63CFR-H9A is designed for high-bandwidth, low-power main memory applications. Its 4Gb density and x16 organization make it ideal for applications requiring large memory capacity with a moderate bus width. The 96-ball TFBGA package offers excellent thermal and electrical performance, with a ball pitch of 0.8mm, facilitating high-density PCB layouts.
Typical applications include laptops and ultrabooks, embedded computing, networking switches and routers, and industrial automation systems. The low operating voltage and high bandwidth make it suitable for battery-powered devices and energy-conscious designs.
When designing with this component, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins to minimize noise. The device requires a stable 1.35V supply and careful signal integrity management for the high-speed data bus. Refer to the datasheet for detailed timing parameters and PCB layout guidelines.
Alternativas directas para H5TC4G63CFR-H9A — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con H5TC4G63CFR-H9A (mismo factor de forma y huella) — difiere en Package, Burst Length, Supply Voltage, CAS Latency, Data Rate.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
H5TC4G63AFR-H9A
✅ Sustitución directa✓ En stock
$6.5 / unidad
Ver hoja de datos →H5TC4G63CFR-H9I
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$7.2 / unidad
Ver hoja de datos →H5TC4G63CFR-H9J
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6 / unidad
Ver hoja de datos →K4B4G1646E-BYK0
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1.8 / unidad
Ver hoja de datos →MT41K256M16HA-125
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6.3636 / unidad
Ver hoja de datos →IS43TR16256AL-125KBL
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.6 / unidad
Ver hoja de datos →H5TC4G63CFR-H9A Valores máximos y características eléctricas
| Tipo de memoria | DDR3L SDRAM |
| Memory Density | 4Gb (4294967296 bit) |
| Organización de memoria | 256M x 16 |
| Supply Voltage (VDD) | 1.35V + 0.100 / - 0.067V |
| Supply Voltage (VDDQ) | 1.35V + 0.100 / - 0.067V |
| Encapsulado | 96-ball TFBGA |
| Number of Terminals | 96 |
| Package Shape | RECTANGULAR |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Sin halógenos | Yes |
| Burst Length | 8, 4 (with burst chop) |
| Differential Clock Inputs | Yes (CK, CK) |
| Differential Data Strobe | Yes (DQS, DQS) |
| On-Chip DLL | Yes |
| DM (Data Mask) | Yes |
Configuración de pines de H5TC4G63CFR-H9A
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDDQ — Power supply for output |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ8 — Data input/output 8 |
| Pin B3 | DQ9 — Data input/output 9 |
| Pin B4 | VDD — Power supply |
| Pin B5 | DQ10 — Data input/output 10 |
| Pin B6 | DQ11 — Data input/output 11 |
| Pin B7 | VSS — Ground |
| Pin B8 | DQ12 — Data input/output 12 |
| Pin B9 | DQ13 — Data input/output 13 |
| Pin B10 | VDDQ — Power supply for output |
| Pin B11 | DQ14 — Data input/output 14 |
| Pin B12 | DQ15 — Data input/output 15 |
| Pin C1 | VDDQ — Power supply for output |
| Pin C2 | VSS — Ground |
| Pin C3 | VDD — Power supply |
| Pin C4 | VSS — Ground |
| Pin C5 | VDDQ — Power supply for output |
| Pin C6 | VSS — Ground |
| Pin C7 | VDD — Power supply |
| Pin C8 | VSS — Ground |
| Pin C9 | VDDQ — Power supply for output |
| Pin C10 | VSS — Ground |
| Pin C11 | VDD — Power supply |
| Pin C12 | VSS — Ground |
| Pin D1 | CK — Clock input |
| Pin D2 | CK — Complementary clock input |
| Pin D3 | VSS — Ground |
| Pin D4 | CKE — Clock enable |
| Pin D5 | VDD — Power supply |
| Pin D6 | VSS — Ground |
| Pin D7 | VDDQ — Power supply for output |
| Pin D8 | VSS — Ground |
| Pin D9 | VDD — Power supply |
| Pin D10 | VSS — Ground |
| Pin D11 | VDDQ — Power supply for output |
| Pin D12 | VSS — Ground |
| Pin E1 | RAS — Row address strobe |
| Pin E2 | CAS — Column address strobe |
| Pin E3 | WE — Write enable |
| Pin E4 | CS — Chip select |
| Pin E5 | VDD — Power supply |
| Pin E6 | VSS — Ground |
| Pin E7 | VDDQ — Power supply for output |
| Pin E8 | VSS — Ground |
| Pin E9 | VDD — Power supply |
| Pin E10 | VSS — Ground |
| Pin E11 | VDDQ — Power supply for output |
| Pin E12 | VSS — Ground |
| Pin F1 | A0 — Address input 0 |
| Pin F2 | A1 — Address input 1 |
| Pin F3 | A2 — Address input 2 |
| Pin F4 | A3 — Address input 3 |
| Pin F5 | VDD — Power supply |
| Pin F6 | VSS — Ground |
| Pin F7 | VDDQ — Power supply for output |
| Pin F8 | VSS — Ground |
| Pin F9 | VDD — Power supply |
| Pin F10 | VSS — Ground |
| Pin F11 | VDDQ — Power supply for output |
| Pin F12 | VSS — Ground |
| Pin G1 | A4 — Address input 4 |
| Pin G2 | A5 — Address input 5 |
| Pin G3 | A6 — Address input 6 |
| Pin G4 | A7 — Address input 7 |
| Pin G5 | VDD — Power supply |
| Pin G6 | VSS — Ground |
| Pin G7 | VDDQ — Power supply for output |
| Pin G8 | VSS — Ground |
| Pin G9 | VDD — Power supply |
| Pin G10 | VSS — Ground |
| Pin G11 | VDDQ — Power supply for output |
| Pin G12 | VSS — Ground |
| Pin H1 | A8 — Address input 8 |
| Pin H2 | A9 — Address input 9 |
| Pin H3 | A10/AP — Address input 10 / Auto-precharge |
| Pin H4 | A11 — Address input 11 |
| Pin H5 | VDD — Power supply |
| Pin H6 | VSS — Ground |
| Pin H7 | VDDQ — Power supply for output |
| Pin H8 | VSS — Ground |
| Pin H9 | VDD — Power supply |
| Pin H10 | VSS — Ground |
| Pin H11 | VDDQ — Power supply for output |
| Pin H12 | VSS — Ground |
| Pin J1 | A12 — Address input 12 |
| Pin J2 | A13 — Address input 13 |
| Pin J3 | BA0 — Bank address 0 |
| Pin J4 | BA1 — Bank address 1 |
| Pin J5 | VDD — Power supply |
| Pin J6 | VSS — Ground |
| Pin J7 | VDDQ — Power supply for output |
| Pin J8 | VSS — Ground |
| Pin J9 | VDD — Power supply |
| Pin J10 | VSS — Ground |
| Pin J11 | VDDQ — Power supply for output |
| Pin J12 | VSS — Ground |
| Pin K1 | BA2 — Bank address 2 |
| Pin K2 | ODT — On-die termination |
| Pin K3 | VSS — Ground |
| Pin K4 | VDD — Power supply |
| Pin K5 | VSS — Ground |
| Pin K6 | VDDQ — Power supply for output |
| Pin K7 | VSS — Ground |
| Pin K8 | VDD — Power supply |
| Pin K9 | VSS — Ground |
| Pin K10 | VDDQ — Power supply for output |
| Pin K11 | VSS — Ground |
| Pin K12 | VDD — Power supply |
| Pin L1 | DM — Data mask |
| Pin L2 | DQS — Data strobe |
| Pin L3 | DQS — Complementary data strobe |
| Pin L4 | VSS — Ground |
| Pin L5 | VDDQ — Power supply for output |
| Pin L6 | VSS — Ground |
| Pin L7 | VDD — Power supply |
| Pin L8 | VSS — Ground |
| Pin L9 | VDDQ — Power supply for output |
| Pin L10 | VSS — Ground |
| Pin L11 | VDD — Power supply |
| Pin L12 | VSS — Ground |
| Pin M1 | VSS — Ground |
| Pin M2 | VDD — Power supply |
| Pin M3 | VSS — Ground |
| Pin M4 | VDDQ — Power supply for output |
| Pin M5 | VSS — Ground |
| Pin M6 | VDD — Power supply |
| Pin M7 | VSS — Ground |
| Pin M8 | VDDQ — Power supply for output |
| Pin M9 | VSS — Ground |
| Pin M10 | VDD — Power supply |
| Pin M11 | VSS — Ground |
| Pin M12 | VDDQ — Power supply for output |
Aplicaciones típicas
H5TC4G63CFR-H9A es adecuado para 6 aplicacións: Laptops and Ultrabooks, Embedded Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Networking and Communications.
Laptops and Ultrabooks
The H5TC4G63CFR-H9A is ideal for laptops and ultrabooks due to its low 1.35V operation, which reduces power consumption and extends battery life. Its 4Gb density and x16 organization provide sufficient memory capacity for mainstream computing tasks. The 96-ball TFBGA package allows for compact PCB designs, essential for thin and light form factors. With a data rate of up to 1866 Mbps (typical for DDR3L), it delivers the bandwidth needed for smooth multitasking and multimedia applications. The low operating voltage also reduces heat generation, improving thermal management in confined spaces.
Recomendado
Embedded Computing
In embedded systems, the H5TC4G63CFR-H9A provides high-density, low-power memory for applications such as industrial PCs, point-of-sale terminals, and medical devices. Its 1.35V supply reduces power consumption, which is critical for fanless designs. The x16 organization simplifies interfacing with embedded processors that have 16-bit memory buses. The device's support for burst lengths of 8 and 4 allows efficient data transfers, and the on-chip DLL ensures reliable timing. The 96-ball TFBGA package is suitable for automated assembly, and the RoHS compliance meets environmental regulations.
Recomendado
Networking Equipment
The H5TC4G63CFR-H9A is well-suited for networking switches and routers, where high bandwidth and low power are essential. Its 4Gb density allows for large packet buffers, and the x16 organization matches common network processor interfaces. The low 1.35V operation reduces power dissipation in dense line cards, improving system reliability. The differential clock and data strobe inputs ensure signal integrity at high speeds, critical for error-free data transmission. The device's RoHS compliance is important for global market access.
Recomendado
Industrial Automation
In industrial automation, the H5TC4G63CFR-H9A provides reliable memory for PLCs, robotics controllers, and HMI systems. Its wide operating temperature range (if specified) supports harsh environments. The low power consumption reduces heat, which is beneficial in sealed enclosures. The 96-ball TFBGA package offers good thermal performance, and the device's high bandwidth supports real-time data processing. The RoHS compliance ensures environmental safety in industrial settings.
Recomendado
Consumer Electronics
The H5TC4G63CFR-H9A is used in consumer electronics such as smart TVs, set-top boxes, and gaming consoles. Its 4Gb density provides ample memory for multimedia applications, and the low 1.35V operation reduces power consumption, which is important for energy-efficient devices. The x16 organization is compatible with many SoCs, and the compact TFBGA package allows for slim product designs. The device's high bandwidth supports smooth video playback and responsive user interfaces.
Recomendado
Networking and Communications
The H5TC4G63CFR-H9A is also used in communication infrastructure such as base stations and network appliances. Its high density and low power make it suitable for buffer memory in packet processing. The differential signaling ensures reliable operation at high frequencies, and the on-chip DLL helps maintain timing accuracy. The device's RoHS compliance is essential for global deployment. The 96-ball TFBGA package is suitable for high-density PCB designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para H5TC4G63CFR-H9A — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | H5TC4G63AFR-H9A | H5TC4G63CFR-H9I | H5TC4G63CFR-H9J | K4B4G1646E-BYK0 | MT41K256M16HA-125 | IS43TR16256AL-125KBL |
|---|---|---|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA | 96-ball FBGA | 96-ball TFBGA |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | Samsung | Micron | ISSI |
| Memory Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Speed Grade | H9A (1866 Mbps) | H9A (1866 Mbps) | H9I (1600 Mbps) | H9J (1333 Mbps) | BYK0 (1866 Mbps) | -125 (1600 Mbps) | -125 (1600 Mbps) |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1333 Mbps | 1866 Mbps | 1600 Mbps | 1600 Mbps |
Diferenciadores clave
- Low power consumption (frente a K4B4G1646E-BYK0)
- High speed grade (frente a MT41K256M16HA-125)
- Same-brand availability (frente a IS43TR16256AL-125KBL)
Notas de diseño
Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each power pin to minimize noise. The tolerance is +0.100V / -0.067V, so a well-regulated supply is critical. Consider using a dedicated DDR3L power solution to maintain voltage accuracy under load transients.
For high-speed DDR3L signals, maintain controlled impedance (typically 50 ohms single-ended, 100 ohms differential) and keep trace lengths matched within 50 mils. Place the device close to the controller to minimize stub effects. Use ground planes to provide a return path and reduce EMI. Follow the layout guidelines in the SK hynix datasheet for optimal signal integrity.
The H5TC4G63CFR-H9A in a 96-ball TFBGA package has a thermal resistance that depends on PCB design. Ensure adequate thermal vias and copper pour under the package to dissipate heat. The device's low 1.35V operation reduces power dissipation, but in high-density systems, monitor junction temperature to stay within the specified operating range.
Información de cumplimiento
RoHS compliant and lead-free/halogen-free per datasheet. REACH and conflict minerals status not specified in provided data.
